PITTSBURGH, May 24, 2017 /PRNewswire/ -- Customers of
Samsung Electronics and ANSYS (NASDAQ: ANSS) are
empowered to create the next generation of robust and reliable
electronic devices thanks to Samsung's certification and enablement
of ANSYS solutions.
This certification of self-heat for 10nm chip technologies and
enablement of electromigration (EM) and voltage drop (IR) for the
latest 7LPP/8LPP technologies reduces customers' design risk while
providing the highest robustness and reliability to their
high-performance computing, mobile and automotive applications.
For those applications where reliability over time is an
absolute requirement, ANSYS solutions perform a variety of analyses
of the Systems on Chips (SoCs), including extraction, power and
reliability, signal and power integrity, and thermal reliability
over the chip's expected life. ANSYS and Samsung collaborated on
this certification and enablement process to provide customers with
the most reliable solutions to develop innovative, reliable
products faster while minimizing design costs and risk.
"Self-heat and thermal analyses are absolute requirements for
automotive and high-performance computing applications," said
Suk Won Kim, vice president of the
Design Technology Team at Samsung Electronics. "We collaborated
with ANSYS to enable their solutions for Samsung Foundry's
leading-edge process platforms, empowering customers to create the
most robust and reliable SoCs."
"Our collaboration with Samsung Foundry on the certification of
ANSYS self-heat for 10nm chip technologies and enablement of EM/IR
technology for their latest FinFET process technology platforms
empower mutual customers to develop robust and reliable SoCs," said
John Lee, general manager at ANSYS.
"This certification and enablement prepares customers to build
next-generation automotive and high-performance computing products
with the required robustness, reliability and safety."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane, driven a
car, used a computer, touched a mobile device, crossed a bridge, or
put on wearable technology, chances are you've used a product where
ANSYS software played a critical role in its creation. ANSYS is the
global leader in engineering simulation. We help the world's most
innovative companies deliver radically better products to their
customers. By offering the best and broadest portfolio of
engineering simulation software, we help them solve the most
complex design challenges and create products limited only by
imagination. Founded in 1970, ANSYS employs thousands of
professionals, many of whom are expert M.S. and Ph.D.-level
engineers in finite element analysis, computational fluid dynamics,
electronics, semiconductors, embedded software and design
optimization. Headquartered south of Pittsburgh, Pennsylvania, U.S.A., ANSYS has
more than 75 strategic sales locations throughout the world with a
network of channel partners in 40+ countries. Visit www.ansys.com
for more information.
To join the simulation conversation, please
visit: www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
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Contact
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Media
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Amy
Pietzak
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724.820.4367
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amy.pietzak@ansys.com
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Investors
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Annette Arribas,
CTP
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724.820.3700
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annette.arribas@ansys.com
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To view the original version on PR Newswire,
visit:http://www.prnewswire.com/news-releases/ansys-self-heat-power-integrity-and-electromigration-solutions-enabled-on-samsungs-latest-finfet-technology-300463298.html
SOURCE ANSYS, Inc.