FEI Unveils New Solutions for Faster Time-to-Analysis in Metals Research
July 30 2014 - 8:35AM
FEI (Nasdaq:FEIC) today announced two new products that speed up
the imaging and analysis time for metals researchers and industrial
failure analysis labs. The Helios™ PFIB DualBeam™, the first
DualBeam within FEI's product portfolio to include a plasma-based
focused ion beam (PFIB), mills 20 - 50 times faster than
gallium-based FIBs to deliver rapid, three-dimensional (3D) imaging
and analysis. The Teneo™ scanning electron microscope (SEM)
provides high-resolution, high-contrast images and fast, precise
analytical results, enabling researchers to clearly resolve grain
boundaries, interfaces and structure/topography of
difficult-to-image magnetic and nonconductive samples.
"Global investment in metals research is increasing for
industrial, building and environmental applications," states Trisha
Rice, vice president and general manager of Materials Science for
FEI. "Successful characterization of metals and magnetic materials
requires high-resolution, high-contrast images and fast, precise
analytical results. In addition, the ability to mill very quickly
through large features and zoom in to image and analyze fine
details is also important in multi-scale analysis, which involves
connecting macro-scale properties of materials to nano-scale
structure. Our new Helios PFIB DualBeam significantly increases
milling speed as well as the size of features that can be
studied."
Current gallium-based FIBs have been used traditionally to
prepare TEM samples, perform cross-sections and provide 3D
analysis, but the scales are limited due to the time that the
milling process requires, which can be many days for larger scales.
The Helios PFIB DualBeam can do the same work in hours, increasing
throughput and the size of features that can be studied. In
addition to metals research, the delamination of paints and
coatings and analysis of grain boundaries, thin films, interfaces
and adhesion layers are potential application for the new Helios
PFIB DualBeam.
"The Vion™ PFIB was the first FEI product to incorporate plasma
source technology when we launched it three years ago as a
single-beam FIB for failure analysis of advanced integrated
circuits," states Rice. "We understand this technology and our
customers' needs in great detail. The knowledge we gained from our
experience with the single beam tool has enabled us to design the
new DualBeam with key features that specifically address the
challenges of integrating a fast-milling plasma FIB in a DualBeam
system."
Rice adds, "Our new Teneo SEM meets the needs of metal
researchers for powerful imaging and highly precise analysis. At
the same time, its flexibility and high performance over a broad
range of applications make it an excellent solution for multi-user
laboratories."
The Teneo SEM includes a unique, non-immersion objective lens
that is specifically-designed to deliver high-resolution on
magnetic materials. Together, this lens and FEI's Trinity™
detection scheme deliver high image contrast from a wide variety of
materials, especially magnetic materials, alloys and composites.
Fast analytical capabilities, including energy dispersive
spectrometry (EDS) and electron backscatter diffraction (EBSD), are
supported by high-beam current and full 90-degree stage tilt.
The highly-configurable platform includes optional low-vacuum
capability for imaging of nonconductive samples, such as glass,
ceramics and polymers. Multi-user laboratory environments will also
benefit from the ease-of-use of the Teneo SEM, for example, most
users, regardless of experience level, can leverage step-by-step
workflows to get useful results more quickly.
For more information, please visit
http://www.fei.com/materials-science/metals/. Or stop by the
FEI booth (#916) at the Microscopy & Microanalysis (M&M)
2014 Exhibition, August 3-7, at the Connecticut Convention Center,
Hartford, CT, USA. FEI will also be at the International Microscopy
Congress (booth 6), September 7-12, in Prague, Czech Republic.
About FEI
FEI Company (Nasdaq:FEIC) designs, manufactures and supports a
broad range of high-performance microscopy workflow solutions that
provide images and answers at the micro-, nano- and picometer
scales. Its innovation and leadership enable customers in industry
and science to increase productivity and make breakthrough
discoveries. Headquartered in Hillsboro, Ore., USA, FEI has
over 2,600 employees and sales and service operations in more than
50 countries around the world. More information can be found at:
www.fei.com.
FEI Safe Harbor Statement
This news release contains forward-looking statements that
include statements regarding the performance capabilities and
benefits of the Helios PFIB DualBeam, Teneo SEM, and Trinity
detection scheme. Factors that could affect these forward-looking
statements include but are not limited to our ability to
manufacture, ship, deliver and install the tools or software as
expected; failure of the product or technology to perform as
expected; unexpected technology problems and challenges; changes to
the technology; the inability of FEI, its suppliers or project
partners to make the technological advances required for the
technology to achieve anticipated results; and the inability of the
customer to deploy the tools or develop and deploy the expected new
applications. Please also refer to our Form 10-K, Forms 10-Q, Forms
8-K and other filings with the U.S. Securities and Exchange
Commission for additional information on these factors and other
factors that could cause actual results to differ materially from
the forward-looking statements. FEI assumes no duty to update
forward-looking statements.
CONTACT: For more information contact:
Sandy Fewkes (media contact)
MindWrite Communications, Inc.
+1 408 224 4024
sandy@mind-write.com
FEI Company
Jason Willey (investors and analysts)
Investor Relations Director
+1 503 726 2533
jason.willey@fei.com
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