PITTSBURGH, April 22, 2019 /PRNewswire/ -- Through new
certifications and a comprehensive suite of semiconductor design
solutions, TSMC and ANSYS (NASDAQ: ANSS) empower mutual customers
to meet increasing demands for next-generation of innovations in
mobile, networking, 5G, artificial intelligence (AI), cloud and
data center applications.
Advancements in these cutting-edge applications are pushing the
limits of performance within a power and thermal constrained
environment. AI applications — including training and inferencing
data sets in the cloud and edge — require power-hungry,
high-performance processors with increased functionality.
TSMC certifies ANSYS®
RedHawk™ and ANSYS® Totem
™ multiphysics solutions on its latest 5nm
FinFET process technology. The certifications include
extraction, power integrity and reliability, signal
electromigration (signal EM) and thermal reliability analysis, and
statistical EM budgeting (SEB) analysis. Optimized for mobile and
HPC applications, the certifications enable low power design
solutions for TSMC's most advanced process technology.
"ANSYS' solutions are certified on TSMC industry-leading 5nm
FinFET, 7nm, and 7nm FinFET Plus processes, enabling our mutual
customers to verify and validate their designs with increased
confidence to address growing performance, reliability and power
challenges," said Suk Lee, senior director, design
infrastructure management division at TSMC. "Our fruitful
collaboration with ANSYS results in empowering customers to achieve
their successes in high-growth markets with primary focuses on
leading edge AI, data center, cloud and mobile applications."
"Multiphysics analysis enables silicon success for 7nm and below
FinFET designs," said John Lee,
general manager at ANSYS. "We are proud to collaborate with TSMC to
enable our mutual customers to achieve their power, performance,
area and reliability goals with our solutions."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A., Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries
ANSS - C
Media
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Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
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Investors
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Annette Arribas,
IRC
724.820.3700
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.