BERLIN, Feb. 14, 2020 /PRNewswire/ -- In 2020, the market
for conductive inks will be $2.4Bn,
according to extensive research by IDTechEx. Of that, 95% of the
conductive ink supply by value goes into just three applications –
the printed bus bars and fingers on PV solar cells, exterior
automotive heating applications (defoggers) and touch screen edge
electrodes.
However, for years now there has been work on a myriad of new
applications for conductive ink which are beginning to come to
commercial fruition. These market opportunities will be in the
spotlight at Printed Electronics Europe 2020, held in Berlin on 13-14 May
2020, with over 2,500 attendees and over 250 speakers
covering the broad range of opportunities. Many exhibit compound
annual growth rates (CAGR) of several hundred percent through to
2025.
In this article Raghu Das, CEO of
IDTechEx assesses some of those opportunities.
Material Opportunities for 5G
The opportunity: By 2025 the value of 5G
connections globally will be worth $303
Billion.
The problem: For highest speed data transfer 5G
systems will use higher frequencies such as 28Ghz and 39Ghz,
significantly higher than the 0.7Ghz – 2.5Ghz frequencies typically
used in a cellphone. This results in more potential for
electromagnetic interference (EMI) between componentry, so they
need to be adequately 'shielded'. Another key trend here is the
rise of multi-chip packages in which connectivity as well as other
dies sit inside a single package. In such cases, even internal EMI
shielding and compartmentalization might be required.
The printed electronics solution: Spray-on,
coat-on or print-on solutions are in now in testing and early
production, which offer uniform coverage of components at higher
manufacturing speed and potentially at lower cost.
Printed Electronics Europe 2020 features a session on material
opportunities for 5G, including EMI shielding advances.
Material Opportunities for Power Semiconductors in Electric
Vehicles
The opportunity: In 2025 126 tonnes of die attach
material will be needed for electric vehicles.
The problem: The electric vehicle market is
expanding. As a consequence, the market for power modules within
all manners of electric vehicles is growing, using semiconductor
technologies such as SiC and GaN. The trend is towards higher power
densities which translates to higher operational temperatures, from
170 Degrees Celsius towards 250 Degrees Celsius. The materials
around the power packages need to cope with these higher
temperatures.
The printed electronics solution: Silver
offers high conductivity and a high melting point versus
conventional semiconductor attachment materials. Nanoparticle
silver is already being used by some EV makers as part of the die
attach system.
Printed Electronics Europe 2020 features sessions on die attach
materials and materials for heat management within electric
vehicles.
Printed Heaters in Autonomous and/or Electric
Vehicles
The opportunity: In 2025 148 million electric
vehicles will be sold, across land, water and air electric vehicles
types.
The problems: Cold temperatures impact batteries
by increasing their internal resistance and lowering their
capacity. For those living in very cold climates, electric vehicle
batteries may therefore need assisted heating. LIDAR systems, used
to enable autonomy, require clear optical pathways, so any ice or
snow on the LIDAR optics needs to be melted away through a heating
system. Additionally, without an internal combustion engine,
electric vehicles require other ways to produce heat for the
occupants.
The printed electronics solution: Printed
heaters are lightweight, offer relative ease with custom designs
and shapes and are typically flexible for easy integration and
application of heat where it is needed.
Printed Electronics Europe 2020 features presentations and
exhibitors covering these aspects including transparent heaters and
flexible heaters.
3D Electronics to Improve Human Machines Interfaces
The opportunity: The market for 3D printed
electronics and Circuit prototyping will be worth over $1 Bn by 2025.
The problem: Combining circuit substrates,
switches, LEDs and other components and then fitting these to
control panels involves a relatively high numbers of components and
tooling set up time. Often the final product is not weight
efficient and nor is it most cost effective for small batch
numbers.
The printed electronics solution: Printing the
wiring, switches and other components and then molding this as the
final structure can overcome the above limitations. The final
pieces can be lighter weight. It can be easier to change or
customize designs. Differentiation can be provided by having
interactive 3D surfaces rather than 2D ones.
Printed Electronics Europe 2020 features presentations and
exhibitors covering In Mold Electronics, film inserted electronics
and 3D printed electronics.
These are just four of the opportunities that will be covered,
in addition to others including antennas, sensors, e-textiles,
electronic skin patches and more. See the evolving speaker list at
www.PrintedElectronicsEurope.com and book by 20 February 2020 for the 30% attendee
discount.
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Media Contact:
Jessica Abineri
Marketing Coordinator
press@IDTechEx.com
+44(0)1223 812300