Broadcom Strengthens its Commitment to Open Compute Project Showcasing Leading-Edge and Wide Range of Initiatives at this Year’s Global Summit
November 09 2021 - 12:28PM
Broadcom Inc. (NASDAQ:AVGO) today announced its continued
commitment to open computing at the 2021 Open Compute Project
(OCP) Global Summit, being held November 9-10 at the San Jose
Convention Center. A long-time supporter of open, standards-based
technologies, Broadcom is dedicated to developing high-performance,
scalable solutions optimized for AI/ML in Cloud and hyperscale data
centers.
“Our innovative and broad portfolio focused on connectivity, as
well as our significant investment going into this space, clearly
demonstrates Broadcom is passionately committed to OCP and open
standards,” said Charlie Kawwas, Ph. D., chief operating officer,
Broadcom. “Our leading-edge technologies, such as the industry’s
highest bandwidth switch and routing chip, OCP NIC 3.0 adapters,
OCP 3.0 storage adapters, PCIe switching, line card PHYs, and
optical module PHYs will benefit data centers, service providers,
and enterprise— alike, and enable this vibrant OCP community.”
Broadcom is a leading technology provider of OCP compliant
solutions both directly through design project
contributions and indirectly— via ODM and OEM partnerships that
integrate its technologies into their systems. Broadcom’s
innovative products are designed specifically to deliver a rich set
of features at maximum performance, while providing power and cost
efficiencies.
Broadcom Ethernet switch and routing chips, PCIe switches,
Ethernet network adapters, PAM4 Line card PHYs, and SAS/SATA/NVMe
storage solutions are featured in a broad range of OCP designs at
this year’s summit. Notable OCP demonstrations and initiatives
involving Broadcom’s technologies include:
- Ampere is showing a demo of the Broadcom 2x100G OCP NIC
3.0 adapter as part of their Ampere® Altra® and Ampere Altra Max
CPU platforms, Expo Hall, Booth B13.
- Arrcus is showcasing two demos at OCP based on UfiSpace
hardware. The first demo is for a massively scalable, virtualized,
distributed routing platform utilizing Broadcom Jericho2 and Ramon
chipsets, OCP Experience Center. The second demo will showcase the
Ethernet VPN multi-homing feature (Arrcus Open MLAG) on TD4
platforms, using dual TORs based on TD4-X11, Arrcus Booth C4.
- Broadcom showcasing 2x100G OCP NIC 3.0 adapter with multi-host
connectivity, manageability, and precision timing using PTP, OCP
Experience Center.
- Broadcom featuring the 9502-16i HBA and 9562-16i RAID
OCP 3.0 SFF Storage Adapters, OCP Experience Center.
- Capgemini engineering will be at OCP, based on the Virtual
Broadband demo they did at BBWF 2021, Amsterdam this past October
12. The demo was designed around the Broadcom Qumran2C housed in
UFISpace Q2C white boxes.
- Edgecore Networks will be
showcasing switch systems, featuring Broadcom Trident 3, Qumran 2a,
Qumran-AX, Trident 4, Jericho 2 and Qumran 2c silicon, Edgecore
Networks Booth C23.
- Meta and Broadcom demo featuring Transparent Clock based time
synchronization driven by Tomahawk 4 switching silicon. Arista
7060DX5 and 7388X5 Tomahawk 4 based switches also showcased, OCP
Experience Center.
- Meta and Broadcom demo, showcasing our 2x100G OCP NIC 3.0
adapter, featuring Broadcom’s device attestation security feature
with OpenBMC using SPDM 1.1, OCP Experience Center.
- MiTAC will showcase three 5G Edge compute products including
Aowanda, Firestone / Whitestone, and Capri incorporating Broadcom
dual-port and quad-port 25G, 50G, and 100G Ethernet OCP NIC 3.0s
and standard PCIe NICs, Expo Hall Booth C25.
- Pluribus Networks and Broadcom collaborating to showcase the
Adaptive Cloud Fabric solution with newly added Kubernetes-aware
visibility and analytics, leveraging open data center switches
featuring Trident 3 and Trident 4 hardware-accelerated telemetry,
Pluribus Booth, A26. Presentation Tuesday, November 9, 3:00p.m.,
210C.
- QCT will showcase a demo of S5X, S5XQ, S5XQ All-Flash
appliances incorporating Broadcom OCP NIC 3.0 adapter, SAS95xx
MegaRAID Storage Controller, and an 88xxx PCIe Gen 4 Switch, Expo
Hall Booth A33.
- Viking Enterprise Solutions will be showing a demo of the
Broadcom 2x100G OCP NIC 3.0 adapter in
their VSS1240P NVMe Storage Server platform, OCP
Experience Center.
- Wiwynn is showcasing several systems including OCP Server and
Storage (SV7100G4/SV7000G4/ST7000G4), OAI Server (SV600G4), Generic
Servers (SV328R) and Edge Server (EP100/ES200), which use several
Broadcom products including: Gen4 PCIe Switch (PEX88xxxx), SAS96xx
Storage Controllers, 24G SAS Expanders (SAS4xXX) and several OCP
NIC 3.0 adapters: 2x25G, 4x25G, 1x100G and 2x100G, Expo Hall Booth
C2.
Broadcom will also participate in numerous technical panel
sessions at this year’s summit, specifically:
- “Networking and New Data Center Challenges- Presented by Meta,”
Ram Velaga, senior vice president and general manager, Broadcom
will join Omar Baldanado, director of Engineering, Meta, on stage
during the Meta keynote, Tuesday, November 9, 9:17a.m., SJCC-
Concourse Level- Grand Ballroom 220.
- “Dual TOR Use Case When Having Single-NIC Servers,” Kamini
Santhanagopalan, product line manager, and Lawrence Lee, software
engineer, Microsoft, on Wednesday, November 10, 10:00a.m., SJCC –
LL20BC.
- “Network Challenges and Solutions in PTP Hyperscale Data
Centers,” Amit Oren distinguished engineer, architecture and
technology, Bhaskar Chinni, principal product line manager, and
Ahmad Byagowi, hardware engineer, Meta, on Wednesday, November 10,
11:00a.m., SJCC – 210AE.
- “Hardware Project Management Update,” Hemal Shah, distinguished
engineer and architect, and Bob Stevens, distinguished member,
Technical Staff, Dell, Wednesday, November 10, 1:00p.m., SJCC –
210AE.
- “Stateful and Stateless Monitoring Capabilities,” Bhaskar
Chinni, principal product line manager, and Rui Miao, network
engineer, Alibaba, on Wednesday, November 10, 1:00p.m., SJCC –
LL20BC.
- “OCP NIC 3.0 Management with NC-SI 1.2,” Hemal Shah,
distinguished engineer and architect, and Bob Stevens,
distinguished member, Technical Staff, Dell, Wednesday, November
10, 2:00p.m., SJCC – 210AE.
- “SAI pipeline enhancements with Pre-Ingress ACL and MyMAC
Station Stages and Enhanced FEC Modes for High Speed, 200G and
Above Ports,” Jai Kumar, distinguished engineer, architecture and
technology, Kishore Gummadidala, software engineer, and Mike
Beresford, software engineer, Google, Wednesday, November 10,
2:00p.m., SJCC – LL20BC.
- “SONiC Automation: Large Scale Deployments Made Easy,” Kamran
Naqvi, principal network architect, and Lumir Honus, lead principal
network architect, AT&T, Wednesday, November 10, 4:00p.m., SJCC
– LL20BC.
- “Migration to SONiC from 3-tiered Legacy Network – EPFL Case
Study,” Kamran Naqvi, principal network architect, Eric Krejci,
infrastructure architect, EPFL, and Mehdi Abdelouahab, product
manager, Juniper Networks, Wednesday, November 10, 4:25p.m., SJCC –
LL20BC.
In addition, Broadcom has also extended the PHY Abstraction
Interface (PAI) layer to enable line card PHYs, further
demonstrating support of the broader OCP community. Like the Switch
Abstraction Layer available for Broadcom’s Ethernet switch
products, PAI consists of standardized C based APIs to program
the external retimers, gearboxes and MACSec PHY devices. This
open source API driver set makes the customer application level
programs agnostic to the underlying silicon and easy to use.
For more information on Broadcom solutions supporting open
source initiatives visit https://www.broadcom.com.
About BroadcomBroadcom Inc. (NASDAQ:
AVGO) is a global technology leader that designs,
develops and supplies a broad range of semiconductor and
infrastructure software solutions. Broadcom’s category-leading
product portfolio serves critical markets including data center,
networking, enterprise software, broadband, wireless, storage and
industrial. Our solutions include data center
networking and storage, enterprise, mainframe and cyber
security software focused on automation, monitoring and security,
smartphone components, telecoms and factory
automation. For more information, go to
https://www.broadcom.com.
Broadcom, the pulse logo, and Connecting everything are among
the trademarks of Broadcom. The term “Broadcom” refers
to Broadcom Inc., and/or its subsidiaries. Other trademarks
are the property of their respective owners.
Press Contact: Jon PiazzaCorporate
Communicationspress.relations@broadcom.comTelephone: +1 408 433
7924
Broadcom (NASDAQ:AVGO)
Historical Stock Chart
From Mar 2024 to Apr 2024
Broadcom (NASDAQ:AVGO)
Historical Stock Chart
From Apr 2023 to Apr 2024