Aehr Receives $1.3 Million Order for FOX-NP™ Test & Burn-in Systems for Photonics Device Characterization and Product Qualification
October 11 2021 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received a $1.3 million order
from a current customer for two FOX-NP™ systems, adding to their
existing fleet to provide additional test capacity for new product
engineering characterization and qualification of photonics
devices. The FOX-NP Systems are expected to ship within the next
few months.
Gayn Erickson, President and CEO of Aehr
Test Systems, commented, “This customer is one of the world’s
largest semiconductor manufacturers and is using Aehr as their plan
of record for all wafer level burn-in and stabilization of their
silicon photonics wafers today. These new FOX-NP systems are
configured with two test blades to allow two wafers to be tested in
parallel using our proprietary WaferPak Contactors, and each system
allows the customer to test either two of the same wafers or two
different wafers with different test plans. This customer is
expected to purchase sets of Aehr WaferPaks for these systems at a
later date. In addition, this customer continues to forecast
significant growth in shipments for silicon photonics devices that
we expect to drive the need for additional production burn-in
capacity for multiple years into the future.
“Stabilization of optical transmitters embedded
in silicon photonics as well as several other photonics devices is
a critical manufacturing step where the devices are subjected to
high temperatures and power to stabilize their output power. This
has traditionally been done in package or module form and is a very
costly step that is not prone to high parallelism or mass
production. Aehr’s FOX-NP systems used for engineering, device
qualification, and new product introduction as well as our FOX-XP™
multi-wafer production systems are able to burn-in and stabilize
these devices while still in wafer form on 100mm to 300mm diameter
wafers. The systems can test not only 100% of the devices on each
wafer up to thousands of devices, but can do this on up to nine
2000 watt high power wafers or up to eighteen 1000 watt wafers at a
time in a single FOX-XP system. This results in both savings from
removing failed devices before they are packaged or put into
modules later in the process, and significant cost savings
associated with stabilization of these devices at massive
parallelism while still in wafer form.
“We continue to be very optimistic about the
silicon photonics and photonics sensors markets and believe they
will be significant growth drivers for Aehr. Yole Research
forecasts the silicon photonics market to grow at a 49% cumulative
average growth rate (CAGR) from 2021 through 2026. The rapid growth
of integrated optical devices in data centers and data center
interconnect infrastructure, mobile devices, automotive
applications, and now wearable biosensor markets is driving
substantially higher requirements for initial quality and long-term
reliability, and they are increasing with every new product
generation. We believe these new applications are driving an
entirely new level of quality and reliability expectation for these
systems and pose a significant long-term growth opportunity for
Aehr.
“In addition to the growth opportunities of
silicon photonics in fiberoptic transceivers, companies are now
making public mention of adding optical transmission and reception
to semiconductors beyond just the silicon used for combined
silicon, laser transmitters and optical detection receivers for
discrete fiber optic transceiver modules. Companies like Intel and
Nvidia are talking about integrating fiber optic transceivers into
their core and graphics processor units (CPUs and GPUs). Long term,
we see integrated silicon photonics devices being integrated
directly into other semiconductors directly or using multi-die or
3D packaging technologies that will further increase the total
available market and demand for our FOX wafer level and singulated
die products.”
The FOX-XP system, available with multiple
WaferPak Contactors (full wafer test) or multiple
DiePak™ Carriers (singulated die/module test) configurations,
is capable of functional test and burn-in/cycling of integrated
devices such as silicon carbide power devices, silicon photonics as
well as other optical devices, 2D and 3D sensors, flash memories,
Gallium Nitride (GaN), magnetic sensors, microcontrollers, and
other leading-edge ICs in either wafer form factor, before they are
assembled into single or multi-die stacked packages, or in
singulated die or module form factor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a
worldwide provider of test systems for burning-in and testing
logic, optical and memory integrated circuits and has installed
over 2,500 systems worldwide. Increased quality and reliability
needs of the Automotive and Mobility integrated circuit markets are
driving additional test requirements, incremental capacity needs,
and new opportunities for Aehr Test products in package, wafer
level, and singulated die/module level test. Aehr Test has
developed and introduced several innovative products, including the
ABTS™ and FOX-P™ families of test and burn-in systems and
FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor Statement This
press release contains certain forward-looking statements within
the meaning of Section 27A of the Securities Act of 1933 and
Section 21E of the Securities Exchange Act of 1934. Forward-looking
statements generally relate to future events or Aehr’s future
financial or operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPak™ and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts: |
|
|
Aehr Test
Systems |
|
MKR Investor Relations
Inc. |
Vernon Rogers |
|
Todd Kehrli or Jim Byers |
EVP of Sales &
Marketing |
|
Analyst/Investor Contact |
(510) 623-9400
x215 |
|
(323) 468-2300 |
vrogers@aehr.com |
|
aehr@mkr-group.com |
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