Onto Innovation Announces Growing $500 Million Order Backlog, Including Solutions for Heterogeneous Packaging
January 11 2022 - 9:06AM
Business Wire
Over $100 million in orders encompass solutions
for 2.5D, 3D packaging and hybrid bonding applications
Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or
the “Company”) today announced a total order backlog of $500
million comprised of more than $100 million for its lithography and
inspection products in support of the emerging heterogeneous
packaging sector, which covers technology designed for 2.5D and
next-generation 3D packages and those using hybrid bonding as a
method of connecting stacked chips.
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Illustrative example of the hybrid
bonding technology showing a CIS chip connected to an ISP chip.
(Graphic: Business Wire)
Heterogeneous packaging is expected to be the fastest growing
segment within the advanced packaging market, driving a growth rate
of 11% CAGR for advanced package substrates over the next four
years and reaching an estimated $13 billion in revenue in 2025,
according to TechSearch International. The rise in heterogeneous
packaging as a new industry standard will be broad and
industry-transforming, delivering the increased performance needed
for data center processors, edge compute and mobile processors, as
well as advanced specialty packages needed for the next-generation
RF and image sensors used in mobile devices and demanded by
expanding 5G technology.
“The key to this market is the ability to increase interconnect
density while simultaneously achieving high yields. The Company has
received orders of nearly $100 million for its new JetStep® X500
lithography system for shipment in 2022 and 2023 to support 2.5D
heterogeneous packaging on advanced substrate panels,” said Elvino
DaSilveira, vice president and lithography business manager. “Onto
Innovation’s lithography, inspection and software product suite
provides an integrated solution that enables our customers to
achieve the necessary precision and repeatability required to bring
these technologies from R&D to high-volume production.”
Onto Innovation also received over $12 million in orders for its
Dragonfly® G3 inspection system. This leading-edge inspection
system offers the sub-micron metrology resolution needed for
advanced packages using the new hybrid bonding technology. Hybrid
bonding is a key element in the next-generation of heterogeneous
packaging and allows for true 3D die-to-die stacking. Early
adopters of this packaging technology include a leading-edge
manufacturer of a high-definition CIS device, which is bonded
directly to a logic chip produced by a top-tier foundry.
“We are partnering with our customers to move beyond providing
them with the most precise data streams for process control. We are
now offering them analytics across fabs through our Discover®
software, which enables higher yield bonding between chips from
different fab locations,” said Ju Jin, senior vice president and
general manager of the inspection business. “This is another
example of Onto Innovation’s leadership in delivering flexible,
high-performance products spanning the entire manufacturing process
across factories in the value chain.”
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global
scale with an expanded portfolio of leading-edge technologies that
include: Un-patterned wafer quality; 3D metrology spanning chip
features from nanometer scale transistors to large die
interconnects; macro defect inspection of wafers and packages;
metal interconnect composition; factory analytics; and lithography
for advanced semiconductor packaging.
Our breadth of offerings across the entire semiconductor value
chain helps our customers solve their most difficult yield, device
performance, quality, and reliability issues. Onto Innovation
strives to optimize our customers’ critical path of progress by
making them smarter, faster and more efficient.
Headquartered in Wilmington, Massachusetts, Onto Innovation
supports customers with a worldwide sales and service
organization.
Additional information can be found at
www.ontoinnovation.com.
Forward Looking Statement
This press release may contain forward-looking statements within
the meaning of the Private Securities Litigation Reform Act of 1995
(the “Act”) which include: statements related to the order backlog;
Onto Innovation’s business momentum and future growth; the benefit
to customers of Onto Innovation’s products; Onto Innovation’s
ability to both deliver products and services consistent with our
customers’ demands and expectations and strengthen its market
position; as well as other matters that are not purely historical
data. Onto Innovation wishes to take advantage of the “safe harbor”
provided for by the Act and cautions that actual results may differ
materially from those projected as a result of various factors,
including risks and uncertainties, many of which are beyond Onto
Innovation’s control. Such factors include, but are not limited to,
the length, severity and potential business impact of the COVID-19
pandemic; the Company’s ability to leverage its resources to
improve its position in its core markets; its ability to
successfully integrate acquired businesses and technologies; its
ability to weather difficult economic environments; its ability to
open new market opportunities and target high-margin markets; the
strength/weakness of the back-end and/or front-end semiconductor
market segments; fluctuations in customer capital spending and any
potential impact as a result of the novel coronavirus situation.
Additional information and considerations regarding the risks faced
by Onto Innovation are available in Onto Innovation’s Form 10-K
report for the year ended December 26, 2020 and other filings with
the Securities and Exchange Commission. As the forward-looking
statements are based on Onto Innovation’s current expectations, the
Company cannot guarantee any related future results, levels of
activity, performance or achievements. Onto Innovation does not
assume any obligation to update the forward-looking information
contained in this press release.
Source: Onto Innovation Inc. ONTO-I
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version on businesswire.com: https://www.businesswire.com/news/home/20220111005502/en/
Michael Sheaffer, +1 978.253.6273
mike.sheaffer@OntoInnovation.com
Onto Innovation (NYSE:ONTO)
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