TTM Technologies, Inc. Announces Upcoming Conference Participation
May 10 2021 - 4:05PM
TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed
circuit board (PCB) and radio frequency (“RF”) components and
assemblies manufacturer, today announced that members of its
management team will attend the following virtual investor
conferences:
- The Goldman Sachs Credit and Leveraged Finance Conference on
May 17th with a presentation at 2:55pm Eastern Time,
- The Needham Technology and Media Conference on May 18th with a
presentation at 3:00pm Eastern Time,
- The JP Morgan Global Technology, Media and Communications
conference on May 24th,
- The Barclays High Yield Bond and Syndicated Loan Conference on
May 26th,
- The Craig-Hallum Institutional Investor Conference on June
2nd,
- The UBS Global Industrials and Transportation Conference on
June 8th with a presentation at 4:00 pm Eastern Time,
- The Baird Global Consumer, Technology & Services Conference
on June 9th with a presentation at 12:50pm Eastern Time; and
- The Stifel Cross Sector Insight Conference on June 10th with a
presentation at 12:00 pm Eastern Time.
All presentations will be webcast live on the company’s website,
www.ttm.com, and a replay will be accessible for a limited time
following the events.
About TTMTTM Technologies, Inc. is a leading
global printed circuit board manufacturer, focusing on quick-turn
and technologically advanced PCBs and backplane assemblies, and a
global designer and manufacturer of RF and microwave components and
assemblies. TTM stands for time-to-market, representing how TTM's
time-critical, one-stop manufacturing services enable customers to
shorten the time required to develop new products and bring them to
market. Additional information can be found at www.ttm.com.
Contact:Sameer Desai,Senior Director, Corporate Development
& Investor Relationssameer.desai@ttmtech.com714-327-3050
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