PITTSBURGH, June 15, 2021 /PRNewswire/ --
Key Highlights
- Ansys® Redhawk-SC™ and
Ansys® Totem™ power integrity platforms are
certified for TSMC's industry-leading N3 and N4 process
technologies
- TSMC's certifications will help customers speed design flow
convergence for Redhawk-SC and Totem
Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge
multiphysics signoff solutions for TSMC's advanced N3 and N4
process technologies. This enables joint customers to meet critical
power, thermal and reliability standards for highly sophisticated
artificial intelligence/machine learning, 5G, high-performance
computing (HPC), networking and autonomous vehicle chips.
The certification of Ansys RedHawk-SC for TSMC N3 and N4 process
technologies includes power network extraction, power integrity and
reliability, signal electromigration (EM), thermal reliability
analysis for self-heat, thermal-aware EM and statistical EM
budgeting. Redhawk-SC will analyze very large 3nm network designs
by using elastic compute, big-data analytics and high capacity of
its underlying Ansys®
SeaScape™ infrastructure. Totem is similarly
certified for transistor-level custom designs. The predictive
accuracy of Redhawk-SC and Totem have also been
verified through TSMC's certification.
"As our long-standing ecosystem partner, Ansys has been making
continuous efforts to help our mutual customers maximize the
benefits of TSMC's industry-leading process technologies," said
Suk Lee, vice president of the
Design Infrastructure Management Division at TSMC. "We look forward
to our continued partnership with Ansys to address critical
customer challenges in power and performance and enable
next-generation silicon designs for 5G, AI, HPC, networking, and
automotive applications."
"To best serve our customers' needs, it is essential that we
collaborate closely with TSMC on the leading edge of silicon
technology for design solutions enablement," said John Lee, vice president and general manager at
Ansys. "This collaboration with TSMC makes the signoff fidelity of
our Ansys multiphysics simulation platform possible and Ansys
remains committed to powering the best user experience for our
joint customers."
About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–C
Contacts
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Kelsey
DeBriyn
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724.820.3927
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kelsey.debriyn@ansys.com
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SOURCE Ansys