CORRECTING and REPLACING PHOTO Toshiba Memory Develops 96-Layer BiCS FLASH with QLC Technology
July 19 2018 - 10:01PM
Business Wire
Boosts Single-Chip Memory Capacity to Highest
Level yet Achieved
Please replace the photo with the accompanying corrected
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Toshiba Memory's 96-layer BiCS FLASH 3D
flash memory boosts single-chip memory capacity to the highest
level yet achieved. (Photo: Business Wire)
The release reads:
TOSHIBA MEMORY DEVELOPS 96-LAYER BICS FLASH
WITH QLC TECHNOLOGY
Boosts Single-Chip Memory Capacity to Highest
Level yet Achieved
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of
Toshiba Memory Corporation, today announced the development of a
prototype sample of 96-layer BiCS FLASHTM, its proprietary
three-dimensional (3D) flash memory, with 4-bit-per-cell (quad
level cell, QLC) technology. With this milestone achievement,
Toshiba demonstrates its technology leadership in the storage
market by delivering technology that boosts single-chip memory
capacity to the highest level yet achieved1.
Toshiba’s new QLC BiCS FLASH significantly expands capacity by
pushing the bit count for data per memory cell from three to four.
The new product achieves the industry's maximum capacity of 1.33
terabits2 for a single chip, and a 16-die stacked architecture in a
single package realizes an unparalleled capacity of 2.66
terabytes.
The number of applications needing huge amounts of storage
continues to grow, fed by the enormous volumes of data being
generated that need to be accessed and analyzed in real time.
Social media, SSDs, edge computing, enterprise applications and the
rapidly expanding data center storage market are all areas in which
larger capacity storage is required – to name just a few. With the
introduction of 96-layer QLC technology, Toshiba Memory enables the
development of products that keep pace with the fast-moving storage
market.
QLC technology has long been a part of Toshiba’s roadmap
strategy for high-density, smaller chip size flash memory
solutions: the company was the first to publicly discuss QLC
technology (at the 2016 Flash Memory Summit) and one of the first
to develop a 3D flash memory device that uses it.
“We were among the first in the industry to envision and prepare
for the successful migration of SLC technology to MLC, from MLC to
TLC, and now from TLC to QLC,” noted Scott Nelson, senior vice
president of TMA’s Memory Business Unit. “This technology evolution
has made increasingly dense packaging options available, and QLC
will have a game-changing impact across many different
markets.”
Samples of Toshiba’s groundbreaking QLC device will begin
shipping in early September to SSD and SSD controller vendors for
evaluation and development purposes. Mass production is expected to
begin in 2019. Additionally, a packaged prototype will be showcased
at the 2018 Flash Memory Summit, taking place from August 6-9 in
Santa Clara, California. For more information, please visit
www.Toshiba.com/TMA.
Notes:[1] Source: Toshiba Memory Corporation, as of July
19, 2018.[2] Definition of capacity: Toshiba Memory Corporation
defines a gigabyte (GB) as 1,000,000,000 bytes. A computer
operating system, however, reports storage capacity using powers of
2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and
therefore shows less storage capacity. Available storage capacity
(including examples of various media files) will vary based on file
size, formatting, settings, software and operating system, such as
Microsoft Operating System and/or pre-installed software
applications, or media content. Actual formatted capacity may
vary.
About Toshiba Memory America, Inc.
Toshiba Memory America, Inc. (TMA) is the U.S.-based subsidiary
of Toshiba Memory Corporation, a leading worldwide supplier of
flash memory and solid state drives (SSDs). From the invention of
flash memory to today’s breakthrough 96-layer BiCS FLASH™ 3D
technology, Toshiba continues to lead innovation and move the
industry forward. For more information on TMA, please
visit www.toshiba.com/tma and follow the company on LinkedIn,
Twitter (@Toshiba_Memory) and Facebook.
© 2018 Toshiba Memory America, Inc. All rights reserved.
Information in this press release, including product pricing and
specifications, content of services, and contact information is
current and believed to be accurate on the date of the
announcement, but is subject to change without prior notice.
Technical and application information contained here is subject to
the most recent applicable Toshiba product specifications.
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COMPANY CONTACT:Toshiba Memory America, Inc.Rebecca
Bueno, 949-737-7321rebecca.bueno@taec.toshiba.comorMEDIA
CONTACT:Lages & AssociatesDena Jacobson,
949-453-8080dena@lages.com