ACM Research Introduces Vacuum Cleaning Platform Targeting the Rapidly Growing Chiplets Industry
September 12 2023 - 4:05PM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, today, through its operating
subsidiary ACM Research (Shanghai), Inc., introduced the ULTRA C v
Vacuum Cleaning Tool to meet the unique flux removal requirements
for chiplets and other advanced 3D packaging structures. The new
tool, which was developed in collaboration with several key
customers, has demonstrated excellent process performance with no
flux residual remaining post-clean. ACM also announced that it has
received a purchase order from a major Chinese manufacturer for the
tool, which it expects to deliver in the first quarter of 2024.
Interest in modular chiplet technologies has grown rapidly as
the semiconductor industry looks to alternative architectures for
more powerful chips without shrinking the transistor size. This
approach combines modular chiplets to form more complex integrated
circuits to improve performance, reduce cost and offer increased
design flexibility versus traditional monolithic chips. Chiplets
are seeing increased adoption across the server, personal computer,
consumer electronics and automotive markets.
“Chiplets represent a significant market opportunity within the
semiconductor manufacturing industry, with unique challenges that
we believe would be difficult to effectively address with more
traditional cleaning technologies,” said Dr. David Wang, ACM’s
President and Chief Executive Officer. “ACM has worked together
with several key customers to address technical challenges to
deploy chiplets, and to deliver differentiated tools to achieve the
performance and throughput required for high-volume manufacturing.
The ULTRA C v Vacuum Cleaning Tool fits this model, and once again
expands our product portfolio to support emerging market
opportunities.”
About the ULTRA C v Vacuum Cleaning Tool
ACM’s ULTRA C v Vacuum Cleaning Tool addresses the unique
requirement of removing flux that is used after reflow as part of
the advanced packaging process. As feature sizes of these devices
continue to shrink, traditional cleaning under atmospheric pressure
is no longer sufficient. By developing a tool that can clean under
vacuum, surface wetting ability is improved for liquid to flow into
very narrow spaces to fully remove flux residues within a
reasonable cleaning time. For devices that require very high flux
dipping, a saponification agent can be added to achieve a complete
clean.
Forward-Looking Statements
Certain statements contained in this press release are not
historical facts and may be forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995.
Words such as “plans,” “expects,” “believes,” “anticipates,”
“designed,” and similar words are intended to identify
forward-looking statements. Forward-looking statements are based on
ACM management’s current expectations and beliefs, and involve a
number of risks and uncertainties that are difficult to predict and
that could cause actual results to differ materially from those
stated or implied by the forward-looking statements. A description
of certain of these risks, uncertainties and other matters can be
found in filings ACM makes with the U.S. Securities and Exchange
Commission, all of which are available at www.sec.gov. Because
forward-looking statements involve risks and uncertainties, actual
results and events may differ materially from results and events
currently expected by ACM. ACM undertakes no obligation to publicly
update these forward-looking statements to reflect events or
circumstances that occur after the date hereof or to reflect any
change in its expectations with regard to these forward-looking
statements or the occurrence of unanticipated events.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for
single-wafer or batch wet cleaning, electroplating, stress-free
polishing and thermal processes that are critical to advanced
semiconductor device manufacturing, as well as wafer-level
packaging. ACM is committed to delivering customized,
high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield. For more information,
visit www.acmrcsh.com.
© ACM Research, Inc. ULTRA C and the ACM Research logo are
trademarks of ACM Research, Inc. For convenience, these trademarks
appear in this press release without ™ symbols, but that practice
does not mean ACM will not assert, to the fullest extent under
applicable law, its rights to such trademarks.
Media Contact: |
Company Contacts: |
Shannon Blood |
USA |
Kiterocket |
Robert Metter |
+1 208-216-9180 |
+1 503.367.9753 |
sblood@kiterocket.com |
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China |
|
Xi Wang |
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ACM Research (Shanghai),
Inc. |
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+86 21 50808868 |
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Korea |
|
YY Kim |
|
ACM Research (Korea),
Inc. |
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+821041415171 |
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Taiwan |
|
David Chang |
|
+886 921999884 |
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Singapore |
|
Adrian Ong |
|
+65 8813-1107 |
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