PITTSBURGH, May 19, 2016 /PRNewswire/ -- ANSYS (NASDAQ: ANSS)
has married the advanced computer science of elastic computing, big
data and machine learning to the physics-based world of engineering
simulation – offering the industry a first look at the future of
product development. Available today, the unique ANSYS®
SeaScape™ architecture enables organizations to innovate faster
than the ever. ANSYS® SeaHawk™ is the first product
taking advantage of this new platform capability to deliver
accelerated design optimization of next-generation
chips.
Engineering simulation generates tremendous amounts of data –
far more than most organizations can effectively leverage for
future product designs. A typical integrated circuit, for example,
has billions of variables that can be simulated. At the same time
the highly specialized engineering supercomputing resources are not
keeping pace with the demand for even higher fidelity simulations
needed for increasingly complex products. By leveraging such big
data technologies as elastic compute and map reduce, SeaScape
provides an infrastructure to address these issues in the context
of almost any engineering design objective. These results provide
more useful insight to product developers early in the design
process so they can more quickly innovate their offerings. ANSYS
has collaborated with Intel Corporation to optimize SeaScape to
take full advantage of the many-core Intel®
Xeon® processor and Intel® Xeon
Phi™ processor families.
The first product on the SeaScape infrastructure, SeaHawk,
dramatically transforms electronic product design through
significant improvements in simulation coverage, turnaround times
and analysis flexibility. The combination of big data techniques
and ANSYS' proven simulation capabilities arms SeaHawk users with a
broad range of capabilities to reduce size of the chip and its
power consumption without sacrificing performance or schedule
constraints. Early users have realized an average of 5 percent
reduction in die size, which could result in millions of dollars of
savings during production.
"Die size and development time reduction are targets that
electronic design engineers have pursued with marginal success
given the limitations of today's in-design solutions," said
John Lee, general manager, ANSYS.
"ANSYS SeaHawk bridges the in-design and sign-off needs by bringing
unprecedented simulation performance and design insights without
sacrificing sign-off accuracy and coverage. We're excited to offer
SeaHawk to the EDA industry today and equally excited to offer
other SeaScape-based products across our entire simulation
portfolio in the future."
Using flexible low-memory compute infrastructures, SeaHawk –
which is available now for customer engagements – has demonstrated
significant performance and turnaround time improvements. Those
rapid insights help to drive in-design optimization. ANSYS is
bringing its gold standard sign-off simulation power to now also
benefit the earlier stages of the chip development cycle.
"The performance increases ANSYS SeaHawk delivers for
engineering simulations enable users to freely optimize and
innovate designs without constraints," said Hugo Saleh, director of marketing, High
Performance Computing Platform Group at Intel
Corporation. "The collaboration between Intel and ANSYS
continues to deliver innovation and performance for our respective
customers, providing great value and performance for reduced time
to results. Together with ANSYS we're delivering leading simulation
capabilities to market utilizing the Intel® Scalable
System Framework."
About ANSYS, Inc.
ANSYS is the global leader in engineering simulation. We bring
clarity and insight to our customer's most complex design
challenges through the broadest portfolio of fast, accurate
and reliable simulation tools. Our technology enables organizations
in all industries to imagine high-quality, innovative and
sustainable product designs that have an accelerated time to
market. Founded in 1970, ANSYS employs almost
3000 professionals, more than 700 of them with PhDs in
engineering fields such as finite element analysis, computational
fluid dynamics, electronics and electromagnetics, embedded
software, system simulation and design optimization. Headquartered
south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic
sales and development locations throughout the world with
a network of channel partners in 40+ countries. Visit www.ansys.com
for more information.
ANSYS also has a strong presence on the major social channels.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
ANSS-T
Media
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Amy
Pietzak
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724.820.4367
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amy.pietzak@ansys.com
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Investors
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Annette Arribas,
CTP
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724.820.3700
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.