onsemi Launches MOSFETs With Innovative Top-Cool Packaging
November 15 2022 - 5:00AM
Business Wire
Top-side cooling simplifies design and reduces
cost for compact power solutions
onsemi (Nasdaq: ON), a leader in intelligent power and
sensing technologies, today announced a series of new MOSFET
devices that feature innovative top-side cooling to assist
designers in challenging automotive applications, especially within
motor control and DC/DC conversion. The company is showing the new
devices at its booth 101 in hall C4 at electronica, the world’s
leading trade fair and conference for electronics.
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Housed in a TCPAK57 package measuring just 5mm x 7mm, the new
Top Cool devices feature a 16.5mm2 thermal pad on the top side.
This allows heat to be dissipated directly into a heatsink rather
than via a typical printed circuit board (PCB). By enabling the use
of both sides of the PCB and decreasing the amount of heat going
into it, the TCPAK57 provides increased power density. Improved
reliability of the new design adds to an overall extended system
lifetime.
“Cooling is one of the greatest challenges in high power design
and successfully addressing it is the key enabler to reducing size
and weight, which is critical in modern automotive design,” said
Fabio Necco, vice president and general manager, Automotive Power
Solutions at onsemi. “With excellent electrical efficiency and
having eliminated the PCB from the thermal path, the design is
significantly simplified while reducing size and cost.”
The devices deliver the electrical efficiency required in high
power applications with RDS(ON) values as low as 1mΩ. Additionally,
the gate charge (Qg) is low (65 nC), reducing losses in high-speed
switching applications.
This solution leverages onsemi’s deep expertise in packaging to
provide the highest power density solution in the industry. TCPAK57
initial portfolio includes 40V, 60V and 80V. All devices are
capable of operating at junction temperatures (Tj) of 175°C and are
AEC-Q101 qualified and PPAP capable. This, along with their gull
wings that allows inspection of solder joints and superior board
level reliability, makes them ideally suited to demanding
automotive applications. The target applications are high/medium
power motor controls such as electric power steering and oil
pumps.
Samples of the new devices are available now with full-scale
manufacture planned in January 2023. Please contact our sales
office.
More information on the Single N-Channel Power MOSFETs on Top
Cool Package can be found on our website
here.
About onsemi
onsemi (Nasdaq: ON) is driving disruptive innovations to
help build a better future. With a focus on automotive and
industrial end-markets, the company is accelerating change in
megatrends such as vehicle electrification and safety, sustainable
energy grids, industrial automation, and 5G and cloud
infrastructure. onsemi offers a highly differentiated and
innovative product portfolio, delivering intelligent power and
sensing technologies that solve the world’s most complex challenges
and leads the way to creating a safer, cleaner, and smarter world.
onsemi is recognized as a Fortune 500® company and included
in the S&P 500® index. Learn more about onsemi at
www.onsemi.com.
onsemi and the onsemi logo are trademarks of Semiconductor
Components Industries, LLC. All other brand and product names
appearing in this document are registered trademarks or trademarks
of their respective holders.
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version on businesswire.com: https://www.businesswire.com/news/home/20221115005449/en/
Stefanie Cuene Head of Public Relations onsemi (602)
315-3778 Stefanie.Cuene@onsemi.com
Parag Agarwal Vice President - Investor Relations
& Corporate Development onsemi (602) 244-3437
investor@onsemi.com
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