KCCO7913
3 hours ago
Yes.
A resource on the various tests. https://espec.com/na/applications/family/telecordia_gr-468/index.html
A link to OpenLight's 2025 press release on this subject. This announcement was full qualification of a suite of active components. Today's LWLG announcement was for one of the tests, albeit in theory the most difficult. https://openlightphotonics.com/newsroom/openlight-achieves-successful-completion-of-telcordia-gr-468-qualification-for-silicon-photonics-components
A technical paper from earlier this year from Huawei performing the 85/85 test on the EO polymer known as SEO100 (Soluxra, an old and mostly inactive company unlike LWLG/NLM/Silorix). https://opg.optica.org/col/abstract.cfm?uri=col-23-5-051303&origin=search
The sample size of 11 is normal. But it's probably safe to assume that for volume production these tests will need to be scaled and proven out for larger sample sizes (probably what some of the development entails in the "Stage 3" step we are expecting to hear more on with 2-4 customers by end of year).
My initial questions/comments:
1) This is the first time LWLG has ever published results from this specific test. Previous published results have been accelerated aging of various kinds (both material and operating modulators).
2) Were the 'thin-film devices' for material tests only, or were these operating modulators? Like the technical paper above, there is modulator performance data that goes along with this 85/85 data.
3) If these were operating modulators, were these tests performed with continuous operation? Or 'bake' in the 'oven', take out to 'turn on' and test, then put back in the testing apparatus? This would be a critical question. The ALD seems to be performing so well that it's probably safe to assume these devices would maintain this level of reliability in a continuously operating device.
Great news. This data gives potential customers much more confidence that they aren't wasting their time and resources on co-developing PICs together.
x993231
7 hours ago
Ted is a yawner, sure they did 300mph verified stable by industry which is the standard set by the industry in unbearable conditions the conditions are unheard of by the industry,,, and although no change could be noted Ted says that it may wobbled a little if they let it run for 5 miles longer, right Ted? If 5 miles was the standard it would be, not something that is set by a a paid short poster. TIs a Yawner bud (Ted). Please post your EO optics credentials. Period and full stop. Nice try.
X. Nice try, standard set by the industry and EXCEEDED!
This is only protected by BASICALLY hairspray, not a gold box, big, no A HUGE DEAL
atlsutiger
7 hours ago
That equates to 17-45 years.
I asked Grok 4:
The 1000-hour Telcordia GR-468 85/85 reliability test (conducted at 85°C and 85% relative humidity) on Lightwave Logic's Perkinamine™ electro-optic (EO) polymer thin-film devices represents a major milestone in demonstrating material stability under accelerated environmental stress conditions. This test is a widely recognized industry standard for optoelectronic components, designed to simulate long-term exposure to heat and humidity that could cause degradation mechanisms like oxidation, hydrolysis, or moisture ingress, which increase optical absorbance (leading to higher signal loss). The reported 1.6% average change (increase) in absorbance across more than 11 samples is exceptionally low, far exceeding the test's pass criteria—typically requiring less than 5-10% degradation in key optical metrics for polymers, depending on the specific GR-468 subsection. In contrast, historical EO polymers (e.g., early guest-host or cross-linked systems from the 1990s-2000s) often failed similar tests within hundreds of hours, showing 20-50% or higher absorbance increases due to poor thermal and environmental stability. Current inorganic alternatives in silicon photonics transceivers, such as lithium niobate (LiNbO3) thin-film modulators or indium phosphide (InP)-based devices, exhibit near-zero degradation (<0.5% absorbance change) in equivalent tests, but they come with trade-offs like higher drive voltages (increasing power consumption by 20-50% or more) and challenges in dense integration with silicon platforms.
Your extrapolation of 1.6% loss over 1000 hours to ~14% per year (based on ~8700 hours/year) overestimates real-world degradation because it assumes linear scaling under normal operating conditions, which is not accurate for accelerated life testing (ALT). In ALT like 85/85, the harsh environment accelerates failure modes by factors of 100-500x compared to typical data center conditions (e.g., 40-70°C case temperature and 40-60% relative humidity). Using Peck's model for humidity-accelerated degradation—common for polymers—the acceleration factor (AF) can be estimated as:
\[ AF = \left( \frac{RH_{test}}{RH_{op}} \right)^{m} \times \exp\left( \frac{E_a}{k} \left( \frac{1}{T_{op}} - \frac{1}{T_{test}} \right) \right) \]
where \( RH_{test} = 85\% \), \( RH_{op} = 50\% \), \( m \approx 2.5-3 \) (empirical humidity exponent for EO organics), \( E_a \approx 0.7-0.0.9 \) eV (activation energy for moisture-driven degradation), \( k = 8.617 \times 10^{-5} \) eV/K (Boltzmann's constant), \( T_{test} = 358 K \) (85°C), and \( T_{op} = 323 K \) (50°C). This yields an AF of ~150-400, meaning 1000 stressed hours equate to ~150,000-400,000 operational hours (~17-45 years). Thus, the 1.6% absorbance loss projects to ~0.004-0.01% per year under normal use, not 14%. Degradation also isn't strictly linear; it often follows a sub-linear pattern (e.g., proportional to \(\sqrt{t}\) for diffusion-limited processes), and Lightwave's second-generation encapsulation (with upgrades to fourth-gen atomic layer deposition showing oxygen transmission rates below 1.4 × 10^{-6} g/m²/day) further stabilizes it against ongoing loss.
For Lightwave Logic's EO polymer, this result addresses a historical Achilles' heel of organic materials in silicon photonics: insufficient longevity for mission-critical applications. With only minimal absorbance increase, it implies negligible impact on key performance metrics—e.g., <0.07 dB additional insertion loss (assuming typical baseline absorbance and 1.6% relative change, since dB = 4.343 \times \Delta A)\), where A is absorbance)—preserving low-drive-voltage advantages (V_p <1V, enabling 30-60% lower power than Si or InP modulators) and high bandwidth bandwidth (>200Gbps PAM4 for 800G/1.6T transceivers). In data centers, where power efficiency is critical (transceivers can consume 10-20% of rack power at scale), this stability enhances viability for integration into hybrid silicon-organic platforms, potentially reducing overall system consumption by 20-40% versus all-silicon solutions.
Commercially, passing Telcordia 85/85 is a "qualifier" threshold for Tier-1 players (e.g., Intel, Broadcom, Cisco, Nvidia for AI/hyperscale, or foundries like GlobalFoundries/TSMC). It de-risks adoption by proving the polymer can endure 10-20+ years in-field without significant failure, paving the way for inclusion in PDKs (Process Design Kits) and volume production. Combined with Lightwave's prior demos of high r33 (electro-optic coefficient >100 pm/V) and partnerships for foundry scaling, this boosts prospects for deployment in next-gen transceivers, where EO polymers excel in enabling denser, lower-latency interconnects for AI factories. However, full viability hinges on follow-on tests (e.g., 2000+ hours or biased operating life) and ecosystem buy-in; if scaled, it could disrupt the ~$10B+ silicon photonics market by offering a drop-in upgrade for power-hungry legacy systems.
tedpeele
7 hours ago
I'm good with $2 tomorrow. Remember, I said $1 - $4 this year.
This is the part that - if true - could give the stock added strength for now, although I would prefer "have demonstrated" instead of "are demonstrating". "are demonstrating" sounds like the demonstrating is still in progress, which means there is some uncertainty if the results will hold out over more time:polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications-including AI factory scale-out and hyperscalers front-end networking
Nobody has commented on the 1000 hours yet with absorbance loss of 1.6% on average.
First, why only 1000 hours?
Second, there are over 8,700 hours in one year. 8.7 x 1.6 = almost 14% a year.
Anyone here have a perspective on that? Probably not.
..
prototype_101
8 hours ago
Marco, perhaps Yves has Tier 1 deals lined up that needed the Reliability results and Telcordia success before they could get done, and these deals can get finalized now, LWLG Polymers are clearly the best choice for true Next Gen!!
again, apparently LWLG passed with only 2nd generation encapsulation!! and the press release said we had a breakthrough with 4th generation encapsulation as well, here
In addition, the company's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material, recently demonstrating an oxygen transmission rate (OTR) of 1.4 ×?10?6?g/m²/day-approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the "gold-box" standard of 7 ×?10?6?g/m²/day for lifetime reliability.
https://feeds.issuerdirect.com/news-release.html?newsid=7616648492185254&symbol=LWLG
and compared to the supposed best competition LWLG is TONS THE BEST!!
Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers
Performance
Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)
LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)
Integration
Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)
LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost
Processing
Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.
LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc
Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
danieldeubank
8 hours ago
Lightwave Logic, Inc. Announces Perkinamine(TM) Polymer Reliability Breakthrough - Passes Telcordia 85/85 Test & Develops Enhanced Moisture & Oxygen Resistance via Fourth-Generation Encapsulation Technology
Grok-3
The announcement by Lightwave Logic, Inc. regarding their Perkinamine™ polymer achieving a breakthrough in reliability, specifically passing the Telcordia GR-468 85/85 environmental stress test and developing a fourth-generation encapsulation technology, is a significant milestone for the company and the broader field of electro-optic (EO) polymer technology. Below is an analysis of its significance:Telcordia GR-468 85/85 Test Success:The Telcordia GR-468 85/85 test is an industry-standard reliability test that subjects materials to harsh environmental conditions—85°C temperature and 85% relative humidity—for an extended period (1,000 hours in this case). Lightwave Logic's Perkinamine™ polymer demonstrated only a 1.6% average loss in performance, indicating exceptional stability and durability under stress.
This achievement validates the reliability of Lightwave Logic’s EO polymer for real-world applications, particularly in high-speed optical interconnects used in data centers and AI-driven networking. Passing this test is a critical step toward commercial adoption, as it meets stringent industry requirements for long-term performance in demanding environments.
Fourth-Generation Encapsulation Technology:The development of a fourth-generation atomic layer deposition (ALD) encapsulation material with an oxygen transmission rate of 1.4 × 10?6 g/m²/day is a significant advancement. This ultra-low oxygen transmission rate enhances the polymer’s resistance to moisture and oxygen, which are common causes of degradation in photonic devices.
Improved encapsulation extends the lifespan and performance of EO polymer-based devices, making them more competitive with traditional materials like silicon photonics, indium phosphide, or lithium niobate. This is particularly important for applications requiring long-term reliability, such as telecommunications and AI data centers.
Impact on Commercial Viability:These breakthroughs significantly enhance the commercial viability of Lightwave Logic’s Perkinamine™ polymer technology. The ability to withstand harsh environmental conditions and maintain performance makes it attractive for integration into high-speed optical transceivers and photonic integrated circuits (PICs), which are critical for next-generation AI clusters and data centers.
The announcement aligns with Lightwave Logic’s ongoing efforts to secure licensing agreements and partnerships, as evidenced by their existing material supply and license agreement from May 2023 and collaborations with companies like Polariton Technologies.
Strategic Advantage in AI and Data Center Markets:The reliability and encapsulation advancements position Lightwave Logic’s EO polymers as a compelling solution for overcoming bandwidth and power consumption bottlenecks in traditional silicon photonics-based modulators. EO polymers offer ultra-fast response times, low power consumption, and high electro-optic coefficients, making them ideal for high-speed data transmission in AI and datacenter applications.
The technology’s potential to support data transmission speeds of 400 Gb/s per lane, with scalability to 800 Gb/s, addresses the growing demand for high-bandwidth, energy-efficient solutions in AI-driven networking.
Market and Investor Sentiment:Posts on X from July 15, 2025, reflect positive sentiment among investors and industry observers, highlighting the announcement as a key milestone for Lightwave Logic (NASDAQ: LWLG).
Despite the technological promise, the company’s stock has experienced volatility (e.g., a 66% decline over six months as of March 2025), indicating that while the technical achievements are significant, market dynamics and broader adoption will play a critical role in future valuation.
Broader Industry Implications:The success of Lightwave Logic’s EO polymer technology could disrupt the photonics industry by offering a high-performance, low-power alternative to conventional materials. This aligns with industry trends toward co-packaged optics (CPO) and heterogeneous integration, where polymers can enhance silicon photonics performance.
The technology’s compatibility with existing semiconductor fabrication processes (e.g., via the Process Design Kit announced in March 2025) further strengthens its potential for widespread adoption in commercial foundries.
In summary, Lightwave Logic’s achievement in passing the Telcordia 85/85 test and developing advanced encapsulation technology marks a pivotal step toward commercializing their Perkinamine™ EO polymer for high-speed, low-power optical communication systems. These advancements enhance the technology’s reliability, scalability, and appeal for AI and datacenter applications, positioning Lightwave Logic as a key player in the evolving photonics landscape. However, continued partnerships, licensing agreements, and market traction will be essential to translate these technical milestones into sustained commercial success.
prototype_101
8 hours ago
no time at all, it's a simple substitution, that's all, LWLG is READY TO PRODUCTIZE just like Yves told investors recently
Yves LeMaitre
• 1st
CEO Lightwave Logic
2w
Hi Mark Lutkowitz,
Just a few comments on EO Polymers. I believe that we have made significant progress on reliability and are now ready for productization.
Read back what was said on organic LEDs reliability only a few years ago … while today, you might be reading this post on an OLED screen… why the change? improved materials, design for high temperature, protection form moisture and oxygen… Lightwave Logic, Inc. had a number of technology breakthroughs over the last two years, both in polymer design and process development that closely follow the OLED trajectory.
Perception can be a bit unfair, but it is reality… we are still suffering from the past failure of Lumera/Gigoptix in bringing products to market. I cannot emphasize enough that our Perkinamine polymers are completely different from the polymers designed and licensed by the University of Washington.
Finally, I agree that we need to do a better job of educating the industry about how we made our Perkinamine polymers extremely robust without compromising on performance. We’ll take on the challenge !
x993231
9 hours ago
Yves told us they were attempting to do this at THE SHM, check the tape, THEY DID IT, READY FOR COMMERCIALIZATION!
X. BINGO, here come the shorts but buts,, this is ALD not in a box, tis a big deal for chips in the GPU not exterior plug in "gold box" modulators. ALD replacing hard box hermeticly sealed protection. HUGE, and we have the patent on it for Polymers, again HUGE. The foundys do it on Silicon today, but not protecting EO polymers! So they just need to deploy the ALD spray nozzle.
Trump in Pittsburg PA tomorrow on AI, I'll be RVing a few miles away.
Oxygen Protection, the industry was requesting this FOREVER.
x993231
9 hours ago
Yves told us they were attempting to do this AT THE SHM, check the tape, THEY DID IT, READY FOR COMMERCIALIZATION!
X. BINGO, here come the shorts but buts,, this is ALD not in a box, tis a big deal for chips in the GPU not exterior plug in "gold box" modulators.
Trump in PA tomorrow on AI, I'll be RVing a few miles away.
prototype_101
9 hours ago
Lightwave Logic, Inc. Announces Perkinamine(TM) Polymer Reliability Breakthrough - Passes Telcordia 85/85 Test & Develops Enhanced Moisture & Oxygen Resistance via Fourth-Generation Encapsulation Technology
https://feeds.issuerdirect.com/news-release.html?newsid=7616648492185254&symbol=LWLG
ENGLEWOOD, COLORADO / ACCESS Newswire / July 15, 2025 / Lightwave Logic, Inc. (NASDAQ:LWLG) (the "Company"), a leading provider of high-performance electro-optic (EO) polymer materials, today announced that its latest-generation Perkinamine™ polymer has successfully passed the rigorous Telcordia GR-468 85/85 environmental stress test (85?°C at 85?% relative humidity), validating its long-term reliability under harsh environmental conditions. The results confirm that Lightwave Logic's EO polymer materials can maintain performance over time, meeting key industry requirements for deployment in telecom and datacom infrastructure.
Expanded 85/85 Test Results:
Sample selection: Thin-film devices with second-generation proprietary encapsulation barrier
Stress conditions: 85?°C and 85?% relative humidity for 1,000 hours
Performance: Change in absorbance measurements showed only 1.6% average loss after 1,000 hours
Pass rate: More than 11 samples exceeded Telcordia GR-468 requirements by a wide margin
These results highlight robust protection against moisture and oxygen, enabled by Lightwave Logic's proprietary encapsulation technology.
In addition, the company's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material, recently demonstrating an oxygen transmission rate (OTR) of 1.4 ×?10?6?g/m²/day-approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the "gold-box" standard of 7 ×?10?6?g/m²/day for lifetime reliability.
Lightwave Logic is preparing this fourth-generation encapsulation material for its next-release back-end-of-line (BEOL) Process Design Kit (PDK) for integration into silicon photonics foundries.
"Achieving full Telcordia 85/85 certification and improving barrier performance by two orders of magnitude are watershed achievements for our platform," said Yves LeMaitre, CEO of Lightwave Logic. "Similar to the trajectory of Organic LEDs, electro-optic polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications-including AI factory scale-out and hyperscalers front-end networking."
This milestone builds upon Lightwave Logic's prior achievements, including industry-leading EO polymer performance and strategic partnerships with foundries for scalable device manufacturing, and is a critical component of Stage 1 and 2 design win process with companies actively engaged in the Company's commercial pipeline.
About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ:?LWLG) is a technology platform company pioneering the development of proprietary electro-optic polymers that enable ultra-high-speed data transmission with low power consumption and compact form factors. These materials power next-generation photonic devices for telecommunications, data centers, and emerging AI infrastructure. Visit www.lightwavelogic.com for more information.
Safe Harbor Statement
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements regarding polymer performance, manufacturing readiness, and potential real-world applications. Words such as "may," "will," "should," "anticipates," "believes," and similar expressions identify such statements. Actual results may differ materially due to risks including technical and manufacturing challenges, reliance on third-party foundries, delays in qualification, funding constraints, market competition, regulatory changes, and other risks described in Lightwave Logic's filings with the SEC, including the "Risk Factors" section of its most recent Form 10-K and Form 10-Q.
Contacts:
Ryan Coleman or Nick Teves
Alpha IR Group for Lightwave Logic
lwlg@alpha-ir.com
312-445-2870
SOURCE: Lightwave Logic
Pro_v12001
9 hours ago
AI Overview of Telcordia GR-468 85/85
The Telcordia GR-468 85/85 environmental stress test, also known as the "damp heat" test, is crucial for ensuring the long-term reliability of optoelectronic devices used in telecommunications and datacom equipment. This test, conducted at 85°C and 85% relative humidity, helps identify potential weaknesses in device design and manufacturing processes that could lead to failure under harsh environmental conditions. By simulating these extreme conditions, the test allows manufacturers to assess the durability and longevity of their products before deployment, ultimately minimizing the risk of field failures and service disruptions.
Here's a more detailed explanation of its importance:
Long-term reliability assessment:
.
The 85/85 test accelerates the aging process of optoelectronic components, allowing manufacturers to predict their lifespan under normal operating conditions more quickly than with traditional methods.
Identification of potential failure mechanisms:
.
The extreme conditions of the 85/85 test can expose hidden weaknesses in materials, manufacturing processes, or device design, leading to failure modes like corrosion, degradation of optical properties, or changes in electrical characteristics.
Improved product quality and reduced risk:
.
By identifying and addressing these potential failure mechanisms, manufacturers can improve the quality and reliability of their products, minimizing the risk of costly field failures and service disruptions.
Compliance with industry standards:
.
The GR-468 standard is widely recognized and followed in the telecommunications industry, and passing the 85/85 test demonstrates that a product meets these stringent requirements.
Cost savings:
.
Identifying and fixing potential problems during the design and manufacturing phase is far less expensive than dealing with them in the field.
Customer confidence:
.
Successfully completing the 85/85 test provides customers with greater confidence in the reliability and performance of the equipment they purchase.
In essence, the Telcordia GR-468 85/85 test is a vital tool for ensuring the robustness and longevity of optoelectronic devices, contributing to the overall reliability of telecommunications and datacom infrastructure.
Lightwaver
10 hours ago
Lightwave Logic, Inc. Announces Perkinamine(TM) Polymer Reliability Breakthrough - Passes Telcordia 85/85 Test & Develops Enhanced Moisture & Oxygen Resistance via Fourth-Generation Encapsulation Technology
07/15/2025
ENGLEWOOD, COLORADO / ACCESS Newswire / July 15, 2025 / Lightwave Logic, Inc. (NASDAQ:LWLG) (the "Company"), a leading provider of high-performance electro-optic (EO) polymer materials, today announced that its latest-generation Perkinamine™ polymer has successfully passed the rigorous Telcordia GR-468 85/85 environmental stress test (85?°C at 85?% relative humidity), validating its long-term reliability under harsh environmental conditions. The results confirm that Lightwave Logic's EO polymer materials can maintain performance over time, meeting key industry requirements for deployment in telecom and datacom infrastructure.
Expanded 85/85 Test Results:
Sample selection: Thin-film devices with second-generation proprietary encapsulation barrier
Stress conditions: 85?°C and 85?% relative humidity for 1,000 hours
Performance: Change in absorbance measurements showed only 1.6% average loss after 1,000 hours
Pass rate: More than 11 samples exceeded Telcordia GR-468 requirements by a wide margin
These results highlight robust protection against moisture and oxygen, enabled by Lightwave Logic's proprietary encapsulation technology.
In addition, the company's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material, recently demonstrating an oxygen transmission rate (OTR) of 1.4 ×?10?6?g/m²/day-approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the "gold-box" standard of 7 ×?10?6?g/m²/day for lifetime reliability.
Lightwave Logic is preparing this fourth-generation encapsulation material for its next-release back-end-of-line (BEOL) Process Design Kit (PDK) for integration into silicon photonics foundries.
"Achieving full Telcordia 85/85 certification and improving barrier performance by two orders of magnitude are watershed achievements for our platform," said Yves LeMaitre, CEO of Lightwave Logic. "Similar to the trajectory of Organic LEDs, electro-optic polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications-including AI factory scale-out and hyperscalers front-end networking."
This milestone builds upon Lightwave Logic's prior achievements, including industry-leading EO polymer performance and strategic partnerships with foundries for scalable device manufacturing, and is a critical component of Stage 1 and 2 design win process with companies actively engaged in the Company's commercial pipeline.
About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ:?LWLG) is a technology platform company pioneering the development of proprietary electro-optic polymers that enable ultra-high-speed data transmission with low power consumption and compact form factors. These materials power next-generation photonic devices for telecommunications, data centers, and emerging AI infrastructure. Visit www.lightwavelogic.com for more information.
Safe Harbor Statement
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements regarding polymer performance, manufacturing readiness, and potential real-world applications. Words such as "may," "will," "should," "anticipates," "believes," and similar expressions identify such statements. Actual results may differ materially due to risks including technical and manufacturing challenges, reliance on third-party foundries, delays in qualification, funding constraints, market competition, regulatory changes, and other risks described in Lightwave Logic's filings with the SEC, including the "Risk Factors" section of its most recent Form 10-K and Form 10-Q.
Contacts:
Ryan Coleman or Nick Teves
Alpha IR Group for Lightwave Logic
lwlg@alpha-ir.com
312-445-2870
SOURCE: Lightwave Logic
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