danieldeubank
5 hours ago
U.S. President Donald Trump is set to announce $70 billion in artificial intelligence (AI) and energy investments in Pennsylvania on Tuesday, July 15, 2025, at the inaugural Pennsylvania Energy and Innovation Summit hosted by Republican Senator David McCormick at Carnegie Mellon University in Pittsburgh. The investments, a mix of federal incentives and private-sector capital, aim to accelerate AI development and ensure U.S. leadership in the technology amid global competition, particularly with China. The package includes:$25 billion for hyperscale data centers to support advanced AI models, with Blackstone Inc.’s Jon Gray announcing a project expected to create 6,000 construction jobs annually and 3,000 permanent jobs.
$30 billion for high-voltage transmission lines, modular nuclear pilots, and large-scale battery storage to meet the energy demands of AI data centers.
Remaining funds allocated for university research hubs and workforce programs to train 200,000 new AI and energy technicians over the next decade.
The initiative involves new data centers, power generation expansion, grid infrastructure upgrades, AI training programs, and apprenticeships. Around 60 executives from major companies, including BlackRock’s Larry Fink, Palantir’s Alex Karp, Anthropic’s Dario Amodei, ExxonMobil’s Darren Woods, and Chevron’s Mike Wirth, are expected to attend. The announcement follows Trump’s earlier $100 billion AI data center investment from SoftBank, OpenAI, and Oracle, and aligns with efforts to ease regulations and expedite permits to boost AI and energy infrastructure. The event also coincides with the recent $14.1 billion acquisition of Pittsburgh-based U.S. Steel by Nippon Steel, highlighting Pennsylvania’s economic significance.
prototype_101
12 hours ago
amazing how little volume they manipulate it down 7 cents inside a minute, pathetic that the low volume high frequency manipulation continues!!
Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers
Performance
Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)
LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)
Integration
Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)
LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost
Processing
Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.
LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc
Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
prototype_101
13 hours ago
did the 18+ million Shorts Cover? No? ouch pity really!! good luck getting 18 million shares pried from Longs diamond hands here!!! Yves & Blum about to ink Tier 1 deals, the Asia arm being setup for Sales & Distribution coupled with the other indicators tell smart investors it is Nvidia and TSMC deals coming soon
upcoming Tier 1 deals soon, frankly it's likely Nvidia and TSMC in the works, why else would LWLG be establishing a Sales and Distribution arm in Asia currently!!
Is LWLG working with TSMC/Nvidia on their Next-gen technology project in Taiwan? the following are reasons why this may quite likely be the case!!
- Yves recent Asia trip included a stop in Taiwan coincident with recent collaborations of TSMC and Nvidia
- Yves spending the first 5-10 minutes of the 2025 ASM on Nvidia's new strategy, you can watch the 2025 ASM replay here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176203906
- Tom saying LWLG is now Establishing Sales and Distribution channels in Asia, why would this be being done now if there was not a need for it developing for LWLG's technology in Asia currently
- Eoptolink and Foxconn added to Yves 2025 ASM presentation after his recent trip to Taiwan, obviously one would assume he met with TSMC
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
- SemiVision articles tagging LWLG along with TSMC and Nvidia
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176198177
-Nvidia in GTC 2025 Keynote disclosing they will be using MRR's in their next-generation technology, and it has been proven that LWLG's technology is the solution to the issues that silicon MRR's have with temperature sensitivity that require individual temperature IC's for each and every MRR!!! read all about it in this post of mine
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176202947
- Nvidia Patents including Polymers as materials being used
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176159796
- the Lebby exchange with Nvidia VP of R&D who commented directly back to Lebby "some startups are clinging too tightly to their IP" Note: perhaps this is the actual reason Lebby was replaced by Yves, Lebby likely was being too controlling in relationship developing the devices in-house where the recent LWLG shift in business strategy in now allowing the Customer to control the device developments with LWLG technical support and PDK's available to them as needed
- 2024 ASM slides 13 and 14 including the quote from Nvidia executive
----- Quote from Slide 13 >> “in many ways polymers will be an ideal enabler of the growth expected in Infiniband usage”
----- Infiniband is a key enabler for NVIDIA à higher speeds are required now
----- Slide 14 showing the Infiniband Roadmap showing how LWLG would be able to enable with their Polymers
- Jim's 2024 ASM comment regarding working with Nvidia
- Yves LeMaitre asked $LWLG shareholders to do some homework and watch the GTC 2025 hardware presentation of Jensen Huang on copacked optics. Because presentations can be long, Steve Schiets made an AI podcast with NotebookLM. Great listen, imo.
https://www.linkedin.com/posts/steve-schiets-1016aa21_ai-photonics-cpo-activity-7329210816216403968-StF4/
Marco commented, This podcast summary of what came out of Jensen"s Huang's talk on co-packaged optics is absolutely great! It pieces together what Nvidia wants and sees the industry moving towards while pointing out the things that will allow LWLG's polymers to meet the checklist of requirements without each company talking about the other. A match made in heaven so to speak. The critical concept of moving the optics as close as possible to the compute functions can be facilitated using polymers as part of the device configuration. Accomplishing this either using tiny MRRs with polymers inside or using co-packaged optics with polymers incorporated the goal is obtained. Either way, it looks like Lightwave's polymers will become critical enablers of the marriage of optics and compute.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176202918
pitcook
16 hours ago
p-pe #1 actually posted- - -
As someone closely tracking the company and its ecosystem, I see these reactions not just as polite gestures, but as early signals of industry alignment, partner readiness, and cross-domain anticipation.🤣🤣🤣🤣😅🤣🤣🤣
What incorrect pathetic hyping basis were you using as facts when you predicted 8,624 times over the last 10 years that the material was 100% finished (which even the lying CEO said more than 8 years after you said it was, that your knowledge was basically clueless) and that 3,600 days ago, and daily for at least 6 years, that any day we were getting a signed major financial DEAL!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!.
Many here want to know if you are just 1,000,000% clueless about the GOO, or just a fake paid hyper? There really are no other options.
If there is please explain why a broken clock has been more correct in 12 hours than you have been in 87,800 hours?
Anyone who doesn't agree with this is a member of p-pe #1 mob/cult.
When is the next conference for our Mgt. team to educate all of the major tech companies, that they will need a faster chip, that uses less power?
prototype_101
16 hours ago
Bid 1.41 for 5k shares now, 18 Million Shorts need to get to the EXIT before Blum & Yves Tier 1 deals are announced, good luck finding those 18 Million shares before the PPS set new highs!!
Robert Blum's Arrival@LWLG: Glimpse Behind the Curtain
Robert Blum’s recent appointment at Lightwave Logic has triggered an impressive wave of congratulations on LinkedIn — but beyond the celebration lies something more telling: a strategic snapshot of where LWLG might be headed.
As someone closely tracking the company and its ecosystem, I see these reactions not just as polite gestures, but as early signals of industry alignment, partner readiness, and cross-domain anticipation.
🔍 Here are some standout commenters and what they suggest:
🚀 Key Industry Executives Who Congratulated Robert:
Daniel Zhu (NVIDIA) – Director of Photonic Design
Signals potential relevance of LWLG's polymer platform in high-speed GPU or AI interconnects.
Babak Sabi (AWS Annapurna Labs) – VP
AWS is deeply invested in silicon photonics and custom AI infrastructure.
Manish Mehta (Broadcom) – VP, Optical Systems
Broadcom is a giant in CPO (co-packaged optics). A strategic nod?
Takashi Saida (NTT) – VP, Head of Device Innovation
Could reflect testing, R&D collaboration, or foundry-level engagement.
Jens Dieckroeger (ADTRAN) – Sr. Director Governance
ADTRAN has engaged with polymer-based solutions; may already be in exploratory talks.
Susmita Joshi, PhD (Photonics & Connectivity)
Highly respected voice in silicon photonics, DWDM, and high-speed AI fabrics.
Preet Virk (Celestial AI) – COO
A potential technology convergence: photonic AI compute meets next-gen interconnects.
Chris Pfistner (Avicena Tech) – VP Sales & Marketing
Active in photonic links for AI – market overlap or parallel momentum.
Paul Diglio (GlobalFoundries) – Principal Engineer
May indicate contact with manufacturing partners to align with foundry capabilities.
Vincent Di Caprio (ICAPS) – VP, Advanced Packaging
Points to polymer relevance in advanced chip packaging ecosystems.
Faraz Monifi (Intel) – Photonics Design Lead
Intel's ecosystem interest is particularly telling, considering historic skepticism.
Dieter Hoffend (imec Automotive) – Business Director
imec as a potential European integration partner or validator?
Jeroen Duis (PHIX Photonics Assembly) – CTO
PHIX plays a role in photonic chip packaging — relevant for commercial rollout.
Ed Baichtal (Data Center Architect)
His excitement suggests attention from hyperscaler design circles.
🧭 What this all points to:
AI, Datacenter & Optical Interconnects: Many well-placed figures in these sectors congratulated Robert — suggesting LWLG's pivot may focus more sharply on high-performance, scalable optical solutions.
Foundry & Packaging Ecosystem Readiness: Involvement of GlobalFoundries, imec, and ICAPS hints at backend alignment for real-world integration.
Go-to-Market Foundations: Multiple VP-level voices from marketing, sales, and operations are engaging — a clue that commercialization is a priority.