Aehr Test Systems to Participate in the 13th Annual Virtual CEO Investor Summit 2021
June 07 2021 - 4:05PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and reliability
qualification equipment, today announced that President and CEO
Gayn Erickson and CFO Ken Spink are scheduled to participate in the
13th Annual CEO Summit, being held virtually this year on June 15,
2021.
“We look forward to discussing our semiconductor wafer level and
singulated die test and burn-in solutions and the markets they
serve with investors,” said Mr. Erickson. “Aehr Test provides
complete production solutions for improving yield and reliability
of semiconductors, and devices such as silicon carbide
semiconductors used in electric and hybrid electric vehicles,
silicon photonics devices used in data centers and 5G
infrastructure, and 2D/3D and other sensors used in mobile and
wearable applications, which are expected to be significant revenue
drivers for our products this fiscal year and next.”
About The 13th Annual
Virtual CEO Summit 2021
The CEO Summit is hosted by executive management from
participating companies and will feature a virtual “round-robin”
format consisting of small group meetings, each 40 minutes in
duration. Each company will be available for up to six meeting
slots during the conference, while investors and analysts will have
the opportunity to meet with 11 of the participating management
teams from 9:00 a.m. until 5:15p.m. EDT on June 15th.
The 15 management teams collectively hosting the 13th Annual
Virtual CEO Summit 2021 currently include:
ACM Research (ACMR), Aehr Test (AEHR), Alpha & Omega
Semiconductor (AOSL), Axcelis (ACLS), Brooks Automation (BRKS),
Cohu (COHU), Everspin Technologies (MRAM), FormFactor (FORM), Ichor
Systems (ICHR), inTEST Corporation (INTT), Intevac (IVAC), Kulicke
& Soffa (KLIC), POET Technologies (POETF) and Veeco Instruments
(VECO).
The Virtual CEO Summit is by invitation only and is open to
accredited investors and publishing research analysts. As space is
limited, please RSVP early. Hosts reserve the right to limit
attendance as necessary. Advance registration and company meeting
selection is required. Last day for registration is June 10,
2021.
RSVP Contacts for 13th
Annual Virtual CEO Summit 2021
To RSVP for the Virtual CEO Summit, please contact either of the
Summit’s co-chairs.
Laura J. Guerrant-Oiye |
Claire E. McAdams |
Guerrant Associates |
Headgate Partners LLC |
Phone: (808) 960-2642 |
Phone: (530) 265-9899 |
Email: laura@ga-ir.com |
Email: Claire@headgatepartners.com |
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts:
Aehr Test Systems |
MKR Investor Relations Inc. |
Ken Spink |
Todd Kehrli or Jim Byers |
Chief Financial Officer |
Analyst/Investor Contact |
(510) 623-9400 x309 |
(323) 468-2300 |
aehr@mkr-group.com |
|
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