UNITED STATES
SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

Form 6-K

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16
UNDER THE SECURITIES EXCHANGE ACT OF 1934

 

For the month of January, 2018

 

Commission File Number: 001-31994

 

Semiconductor Manufacturing International Corporation

(Translation of registrant’s name into English)

 

18 Zhangjiang Road

Pudong New Area, Shanghai 201203

People’s Republic of China

(Address of principal executive office)

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:

 

 Form 20-F     Form 40-F

 

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1): 

 

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7): 

 

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934:

 

 Yes     No

 

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): n/a

 

 

 

 

 

 


 

SIGNATURES

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

Semiconductor Manufacturing International Corporation

 

 

 

 

Date: January 30, 2018

 

By:

/s/ Dr. Gao Yonggang

 

 

 

Name:

Dr. Gao Yonggang

 

 

 

Title:

Executive Director, Chief Financial Officer and Joint Company Secretary

 

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Hong Kong Exchanges a nd Clearing Limited a nd The Stock Exchange of H ong Kong Limited take no r esponsibility f or th e c ontents of this announcement, make no representation as to its accuracy o r completeness and expressly disclaim a ny liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the c ontents of t his announcement.

 

 

SEMICONDUCTOR M ANUFACTURING I NTERNATIONAL CORPORATION

*

(incorporated in t he Cayman Islands with limited li ability)

(Stock Code: 981)

 

DISCLOSEABLE TRANSACTION A ND CONNECTED TRANSACTION PROPOSED CAPITAL CONTRIBUTION AND DEEMED DISPOSAL

OF EQUITY INTEREST IN SMSC

 

 

PROPOSED CAPITAL CONTRIBUTION AND DEEMED DISPOSAL OF EQUITY INTEREST

The Company is pleased t o a nnounce that, on 30 January 2018, SMIC Holdings, SMIC Shanghai, China IC Fund and Shanghai I C F und entered into the J oint Venture Agreement a nd the Capital Contribution Agreement pursuant t o which SMIC Holdings, China IC Fund and Shanghai I C F und agreed to make cash contribution to the R egistered Capital of SMSC in th e a mount of U S$1.5435 billion, US946.5 million a nd US$800 million, respectively. As a r esult of t he Capital Contribution: (i) the R egistered Capital of SMSC will increase from US$210 million t o U S$3.5 billion; (ii) the Company’s equity interest in SMSC, through S MIC H oldings and SMIC Shanghai, will decrease from 100% to 50.1%; and (iii) S MSC will b e owned a s to 27.04% and 22.86% by China IC Fund and Shanghai IC Fund, respectively.

 

 

 

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LISTING RULES IMPLICATIONS

 

As China IC Fund holds a pproximately 15. 05% of the issued s hare capital o f t he Company through i ts wholly-owned subsidi ary, Xinxin (Hongkong) Capital Co., Limited, as at the date o f t his announcement, it is a c onnected person o f t he Company under t he Listing R ules. T he transactions contemplated under t he Joint V enture Agreement and the Capital Contribution A greement c onstitute connected transactions of the Company under Chapter 14A of the L isting Rules.

 

Pursuant to the J oint Venture Agreement an d t he Capital Contribution Agreement, as a r esult of t he Capital Contribution, the Company’s equity interest in SMSC, through SMIC Holdings and SMIC Shanghai, will decrease from 100 % t o 50. 1%, which constitutes a deemed disposal for t he Company under Chapter 14 of the Listing Rules.

 

As certa i n app licable p ercentage ratios stipulated under R ule 14.07 of the L isting Rules i n r espect of the Joint Venture A greement and t he Capital Contribution Agreement exceed 5 % but are less than 25%, t he transactions contemplated under t he Joint V entu re Agreement and the Capital Contribution A greement constitute discloseable transactions of the Compa ny under Chapter 14 of the L isting Rules, and a non-exempt connected transaction subject to reporting, announcement and the Independent Shareholders’ approval requirements o f Chapter 14A of the L isting Rules.

 

In accordance with the L isting Rules, an Independent B oard Committee will be established to a dvise and pr ovide recommendation to t he Independent Shareholders on the Joint Venture A greement, t he Capital Contribution Agreement and the transactions contemplated thereunder and to advise the Independent Shareholders on how to v ote.

 

An independent financial a dviser will be appointed to a dvise t he Independent B oard Committee and the I ndepende nt Shareholders on the Joint Venture A greement, t he Capital Contribution A greement and t he transactions contemplated thereunder.

 

 

 

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GENERAL

At the E GM, ordinary r esolutions will be pr oposed to the I ndependent Shareholders t o approve t he Joint Venture Agreement a nd the Capital Contribution Agreement. As China IC Fund is a connected person of the Company, its wholly-owned subsidiary Xinxin ( H ongkong) Capit a l Co., L td. a nd ot her a ssocia t es ( a s defined in t he Listing Rules) of China IC Fund will abstain from voting on t he ordinary resolutions to approve t he Joint Venture Agreement a nd the Capital Contribution Agreement. A part from Xinxin (Hongkong) Capital Co., Limited and other associates of China I C F und, no other Shareholder will be r equired t o a bstain from voting on the r elevant resolutions at the E GM.

No D irecto r is considered t o have a m at erial interest in t he Join t Venture Agreemen t or the Capital Contribution Agreement which would have required t he Director to abstain from voting at t he Board meeting author ising t he Joint Venture Agreemen t and t he Capital Contribution Agreement.

The Company expects to dispatch a circular to the Shareholders on or before 9 March 2018 as time is needed to finalise the c ontent s t herein containing, among other t hings, (i) f urther details on t he Joint V enture Agreement and the Capital Contribution Agreemen t; (ii) a l ett e r f rom t he Ind epe ndent B oard Committee to t he Independent Shareholders; (iii) a letter f rom t he independent financial a dviser co ntaining its a dvice to the Independent Board Committee and t he Independent S hareholders; and (iv) a notice convening the EGM.

 

The Company is pleased t o a nnounce that, on 30 January 2018, SMIC Holdings, SMIC Shanghai, China IC Fund and Shanghai I C F und entered into the J oint Venture Agreement a nd the Capital Contribution Agreement pursuant t o which SMIC Holdings, China IC Fund and Shanghai I C F und agreed to make cash contribution t o t he Registered Capital of SMSC in t he amount of US$1.5435 billion, US946.5 million and US$800 million, r espectively. As a result of the Capital Contribution: (i) t he Registered Capital of SMSC will increase from U S$210 million to US$3.5 billion; (ii) t he Company ’s equity interest in SMSC, t hrough SMIC H oldings a nd SMIC Shanghai, will decrease from 100% to 50.1%; a nd (iii) SMSC will be owned a s t o 27.04% a nd 22.86% by China IC Fund and Shanghai I C F und, respectively.

 

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SUMMARY OF PRINCIPAL TERMS OF THE J OINT VENTURE AGREEMENT

 

Date:

 

30 January 2018

 

Parties:

 

 

(a)

S MIC H oldings

 

 

 

(b)

S MIC Shanghai

 

 

 

(c)

China IC Fund

 

 

 

(d)

Shanghai I C F und

 

 

To the b est o f t he Directors’ knowledge, inf ormation and b elief and having made all reasonable enquiry, Shanghai IC Fund and it s ultimate b eneficial owners ( other than China IC Fund) are third parties i ndependent of the Company and i ts connected persons.

 

Business S cope of SMSC

 

SMSC will principally engage in wafer m anufacturing, w afer probing and bumping, technology development, design service, ma sk manufacturing, a ssembly and final t esting of integrated circuits and sales of self-m anufactured products. S MSC is expected to establish and build up large-scale m anufacturing capacity focusing on 14 nanometer and below p rocess and m anufacturing technol ogies and aims to reach a manufacturing capacity of 35,000 wafers per m onth.

 

Total Investment and Registered Capital

 

The total investment in SMSC by the parties is es timated to b e U S$10.24 b illi on. T he parties will c ontribute i n aggregate US$3.5 b illion of the total investment as Capital Contribution i n t he following manner:

 

 

(a)

SMIC H oldings has committed t o contribute U S$1.5985 billion, representing 45.67% of the enlarged R egistered Capital after t he Capital Contribution. US$55 million has been contributed prior t o entering i nto t he Joint Venture Agreement a nd US$1.5435 billion is outstanding;

 

 

 

(b)

S MIC Shanghai h as committed to contribute U S$155 million, which has b een fully contributed prior to entering into the J oi nt Venture A greement, r epresenting 4 .43% of the e nlarged R egistered Capital after t he Capital Contribution;

 

 

 

(c)

China IC Fund has c ommitt ed to contribute U S$946.5 mill ion, which is outstanding, representing 27.04% of the e nlarged R egistered Capital after t he Capital Contribution; and

 

 

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(d)

Shanghai I C F und has committed to contribute US$800 million, which is outstanding, r epresenting 22.86% of t he enlarged Registered Capit a l a fter the Capital C ontr ibution.

 

 

The c onsideration was a rrived at after a rm’s length negotiation among the parties with reference to t he net a sset value, future busin ess prospect s and developm ent potential of SMSC. The d ifference b etween the total investment of US$10.24 b illion and enlarged Registered Capital after the Capital Contribution o f U S$3.5 b illion is   i ntended to b e funded through debt financing.

 

Each party shall complete 30% of its outstanding contributions prior to 30 June 2018, complete 30% of its outstandi ng contributions prior to 31 December 2018, and complete the r emaining 40% of the c ontribut ions prior to 30 June 2019 (the ‘‘Time Frame ’’ ) .

 

Notwithstanding the a bove, t he capital c ontribution b y China IC Fund is subject to the following condition s ( ‘‘ Condition Precedent ’’ ):

 

 

(i)

r eceipt o f t he written appro val fro m the c ompetent government authority(ies) in Shanghai, pursuant to    which a   g overnment subsidy    lasting for    not less    than five years w ith an amount each year not less than 4% of the total capital c ontribution of China IC Fund s hal l b e g rant e d to SM SC; and

 

 

 

(ii)

the validity o f t he investment period of China IC Fund (after which China IC fund cannot make capital c ontribution to SMSC).

 

 

The parties have further agreed that if China IC Fund fails t o make Capital Contribution in accordance with the Time F rame, due to (i) t he Condition Precedent is not satisfied o r only satisfied within one m onth prior to the a ny deadline of t he Time Fra me; o r (ii) t he expiry of the investment period of China IC Fund, the failure by China IC Fund to make its Capital Contribution will n ot constitute a breach of t he Joint Venture Agreement. However, if the Condition Precedent is satisfied within one month prior to any deadline of the Time F rame, o r beyond a ny such deadline (but within the investment period of China IC Fund), China IC Fund shall make t he relevant capital contribution in accordance with the J oint Venture Agreement within one month a fter the satisfaction of th e Condition Preceden t. If China IC Fund fails t o make capital contribution due t o t he Condition Precedent cannot be met on o r before 25 August 2019, and/or if China I C Fund is unable t o make capital contribution due to the expiry of its investment period, such failure t o make capital contribution will not constitute a breach by China IC Fund, and t he parties will fu rth er negotiate a nd amend t he Joint Venture Agreemen t a nd the articles of association of SMSC a s well a s other relevant legal documents.

 

The c ash c apital contribution by SMIC Hold ings will be funded b y t he internal cash flow. The p roceeds o f t he Capital Contribution will be used by SMSC as capital e xpenditure and working capital.

 

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Composition of t he Board a nd the S uperv isory Board of SMSC and General Management

 

The board of directors o f S MSC will comprise five d irectors. S MIC H oldings and SMIC Shanghai together a re entitled to appoint th ree d irectors in total and each of China IC Fund and Shanghai IC Fund is e ntitled to appoint one director. S MIC H oldings and SMIC Shanghai together are e ntitled to nominate t he chairman of the board of directors of SMSC, who will also act a s t he legal r epresentative o f S MSC.

 

The supervisory board of SMSC will comprise three members. China IC Fund will appoint o ne member who will also be the c hairman o f t he supervisory board. Each o f Shanghai IC Fund and the employees of SMSC will be entitled to appoint o ne member.

 

The Company will be responsible for m anaging the d aily operations of SMSC.

 

Pre-Emptive Rights of Shareholders

 

Pursuant to the J oint Venture Agreement, in case of any proposed transfer of equity interest to thi r d party(ies), subjec t t o ce rta in exceptions, each of t he parties t o t he Joint Venture Agreement shall has a pre-emptive right t o subscribe for t he equity interest which any party to the J oint Venture Agreement intends to tr ansfer to any t hird party, on pro rata basis among t he remaining non-transfer parties and on t erms not harsher than terms of t ransfer t o t hird party(ies). The part y(ies) that intend to transfer shares to third party(ies) are r equired t o notify t he non-transfer parties t o such proposed transfer of equity interest. I n case of a ny further contribution t o t he Registered Capital, each party shall be entitled t o a pro rata portion of such proposed Registered Capital contribution equivalent to the r espective percentage of the R egistered Capital then owned by each of th e parties immediately prior to the p ro posed R egistered Capital contribution.

 

Oth e r T erms

 

The t erm o f operation of SMSC will be 50 years f rom t he date of its e stablishment. T he parties will decide whether to e xtend t he term of operation of SMSC at least six months prior to t he expiry date of the t erm o f operation, subject to the approval of the r elevant PRC authorit ies.

 

The Joint Venture A greement will, after being agreed and signed by th e parties, t oget her with the transactions contemplated thereunder, be subject to the approval by Independent Shareholders at the EGM. Upon obtaining t he regulatory approvals and the approval by the Independent Shareholders at th e EGM, t he Joint Ven ture Agreement will become effective and bi nding on the parties. T he obligations of the parties under t he Joint V enture Agreement a re subject to c omp liance w ith a pplicable laws (including those of regulatory authorities (including but not limited to t he Stock Exchange and the N ew York Stock E xchange, Inc.)).

 

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SUMMARY OF PRINCIPAL TERMS OF THE CAPITAL CONTRIBUTION AGREEMENT

 

Date:

 

30 January 2018

 

Parties:

 

 

(e)

S MIC H oldings;

 

 

 

(f)

S MIC Shanghai;

 

 

 

(g)

China IC Fund; a nd

 

 

 

(h)

Shanghai I C F und,

 

 

To the b est o f t he Directors’ knowledge, inf ormation and b elief and having made all reasonable enquiry, Shanghai IC Fund and it s ultimate b eneficial owners ( other than China IC Fund) are third parties i ndependent o f t he Company and t he connected persons of the Company.

 

Subscription of Registered Capital

 

The R egistered Capital of SMSC will increase from US$210 million to U S$3.5 b illion. In respect o f t he increase of US$3.29 b illion, th e parties h ave agreed that SMIC Holdings will contribute the amount of US$1.5435 billion i n c ash while China IC Fund and Shanghai IC Fund will c ontribute the R MB e quivalent o f U S$946.5 million and U S$800 million i n c ash (calculated at the middle exchange rate o f R MB to US$ a s announced by the P eople’s Bank o f China on the date o f t he contribution), r espectively.

 

Oth e r T erms

 

The Capital Contribution Agreement will, after b eing agreed and signed b y t he parties, together with the transactions contemplated thereunder, be subject to t he approval by the Independent Shareholders at the EGM. Upon obtaining t he regulatory approvals and approval by the Independent Shareholders at the EGM, t he Capital Contribution Agreement will become effective and binding on the parties.

 

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GENERAL INFORMATION    A BOUT SMSC

 

SMSC was established on 1 D ecember 2016. According to t he unaudited a ccounts o f SMSC prepared   in accordance with   IFRS,    a s at 31 D ecember 2017, SMSC has total assets and total equity of approximat ely U S$209.0 million and U S$202.8 million, respectively. T he net p rofit/(loss) (before taxation and extraordinary items) o f S MSC f or the y ear e nded 31 D ecember 2017 is approximat ely U S$(115,240) and t he net p rofit/(loss) (after t ax ation and extraordinar y items) o f S MSC f or the y ear e nded 31 D ecember 2017 is approximately U S$(115,240). S MSC will c ontinue to be a s ubsidiary of the Company following completion of the transactions contemplated under t he Joint V enture Agreement and the Capital Contribution A greement. T he deemed disposal as a r esult of the Capital Contribution will not result in the r ecognition of any gain or loss i n profit or loss of the Group.

 

REASONS FOR AND BENEFITS O F T HE CAPITAL CONTRIBUTION

 

SMSC is a 12-inch wafer f ab with advanced process c apability built in line with the schedule of the Company’s 14 nanometre and b elow advanced technology node research and d evelopment and mass production. China IC Fund and S hanghai IC Fund mainly invest in the value chain o f i ntegrated circu it industry v ia various approaches, p rimarily in integrated circuit c hip m anufacturing as well as chip designing, packaging test and equipment and materials. The 12-inch wafer f ab will be built by joint v enture partnership with China IC Fund and S hanghai IC Fund and t he Company c ould speed up t he introduction of advanced m anufacturing process and products with the s upport o f t he government industry f unds. T his will a lso r elieve the Company from spending large amount of cash investment and d epreciatio n c ost c aused b y t he expansion o f a dvanced production capacity.

 

The Company believes that such partnership with China IC Fund and S hanghai IC Fund through t he Joint V enture Agreement and the Capital Contribution Agreement and transactions contemplated thereunder a re in the interests of the Company and t he Shareholders a s a whole and beneficial to the s ustainable development o f t he Company. The D irectors (excluding i ndependent non-executive D irectors whose view will b e given after taking i nto account the a dvice f rom t he i ndependent financial a dviser) c onsider that it is in the b est interests of the Company and t he Shareholders as a whole to e nter into the Joint V enture Agreement and the Capital Contribution A greement and t he transactions contemplated thereunder; the t erms of the Joint Venture A greement and t he Capital Contribution A greement are f air and reasonable; and t he entering into of the Joint Venture A greement and t he Capital Contribution A greement and t he transactions contemplated thereunder a re on normal commercial t erms or better, in the ordinary and usual c ourse of business of the Group and i n t he interests o f t he Company and t he Shareholders a s a whole.

 

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IMPLICATIONS OF THE LISTING RULES

 

As China IC Fund holds a pproximately 15.05% of the issued s hare capital o f t he Company through i ts wholly-owned subsidi ary, Xinxin (Hongkong) Capital Co., Limited, as at the date o f t his announcement, it is a c onnected person of the Company under the L isting Rules. The transactions c ontemplated under t he Joint V enture Agreement and the Capital Contribution A gree ment constitute connected transactions of the Company under Chapter 14A of the L isting Rules.

 

Pursuant to the J oint Venture Agreement an d t he Capital Contribution Agreement, a s a result of the Capital Contribution, the Company’s equity interest in SMSC, through SMIC Holdings and SMIC Shanghai, will decrease from 100% to 50.1%, which constitutes a deemed disposal for t he Company under Chapter 14 of the Listing Rules.

 

As certain a pplica b le p ercentage ratios stipulated under Rule 14.07 of the L isting Rules in respect o f t he Joint Ven ture Agreemen t and the Capital Contribution A greement exceed 5 % but are less than 2 5%, t he transact ions contemplated under t he Joint V enture Agreement and the Capital Contribution A greeme nt constitute discloseable transactions of the Company under Chapter 14 of the L isting Rules, and a non-exempt connected transaction subject to r e porting, announcement and the Independent Shareholders’ approval requirements o f Chapter 14A of the L isting Rules.

 

In accordance with the L isting Rules, an Independent B oard Committee will b e established to a dvise and provide r ecomme ndation to t he Independent Shareholders on the Joint Venture A greement, t he Capital Contribution A greement and t he transactions co ntemp l at ed thereund er and to a dvise th e Independent Shareholders on how to vote.

 

An independent financial a dviser will be appointed to advise the Independent Board Committee and t he Independent Shareholders on the J oi nt Venture A greement, the Capital Contribution A greement and t he transactions contemplated thereunder.

 

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GENERAL

 

At the EGM, ordinary r esolutions will be proposed to the Independent Shareholders to approve t he Joint V enture Agreement and the Capital Contribution Agreement. As China IC Fund is a c onnected person of the Company, i ts wholly-owned subsidiary Xinxin (Hongkong) Capital Co., Ltd. and other a ssocia t es ( a s d efined in th e L isti n g Rules) of China IC Fund will abstain f rom v oting on t he ordinary resolutions to approve the Joint Venture A greement and t he Capital Contribution Agreement. Apart f rom Xinxin (Hongkong) Capital Co., Limited and other a ssociates of China IC Fund, no other Shareholder will be required to abstain from voting on the r elevant r esolutions at th e EGM.

 

No Direct or is considered t o have a material i nt erest in t he Join t Venture Agreement o r the Capital Contribution Agreement which would have r equired t he Director to abstain from voting at the B oard meeting a uthorising the J oint Venture Agreement and t he Capital Contribution Agreement.

 

The Company expects to dispatch a circular to th e S har e hold e r s on or b ef ore 9 Mar c h 2018 a s t ime is n eeded to finalise t he contents therein c ontaining, among other t hings, (i) further d etails on the Joint Venture A greement and the Capital Contribution Agreement; (ii) a l etter f rom t he Independent Board Co mmittee to the Independent Shareholders; (iii) a l etter f rom t he independent financial a dviser containing its a dvice to t he Independent Board Co mmit t ee and t he Independent S hareho lders; and (iv) a no tice con vening t he EGM.

 

INFORMATION ABOUT THE P ARTIES

 

The Company, SMIC H oldings and SMIC S hanghai

 

The Company is one o f t he leading semicondu ctor foundries i n t he world and t he largest and m ost a dvanced f oundry i n t he PRC. T he Company provides integrated circuit foundry and technology services at 0.35-mi cron to 28-nanometer. Headquartered i n Shanghai, the PRC, t he Company h as a 300mm w afer fabrication facility ( fab) and a 200mm mega-fab i n S hanghai; a 300mm meg a-fab and a second majority owned 300mm fab under d evelopment f or advance nodes i n Beijing; 200mm f abs i n T ianjin and Shenzhen. The Company also has m arketing and c ustomer service offices i n t he United States, Europe, Japan, and Taiwan, and a representative office in Hong Kong. S MIC Shanghai is a wholly-owned subsidiary of th e Company established i n t he PRC. S MIC Holdings, a s a multinational company’s regi onal headquarters, was formed in 2015 and is a wholly-owned s ubsidiary of the Company.

 

China IC F und

 

China IC Fund, incorporated in September 2014, mainly invests in the value chain o f integrated circuit i ndustry v ia various approa ches, p rimarily in integrat ed circuit c hip manufacturing a s well a s c hip d esigning, p ackaging test and e quipment and materials.

 

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Fund investors include CDB Capital, China National Tobacco Corporation, Beijing Yizhuang International I nvestment and Development Co., Ltd., China Mobile Communications Corporation, Shanghai Guos heng (Group) Co., Ltd., Beijing Purple Communications Technology Group Ltd and Sino IC Capital Co., Ltd.

 

Shanghai IC Fund

 

Shanghai IC Fund is currently t he largest loc al integrated circuit i ndustry investment fund in Shanghai, the investo rs of which include, among others, Shanghai S&T Venture Capital ( Group) Co., Ltd., S AIC Capital Co., Ltd., China IC Fund, Shanghai Guo Sheng Group Co., Ltd. and Shanghai Internationa l Group. The fund’s investment focuses on the i ntegrated c ircuit manufacturing industr y and extends to t he entire industry c hain. The f und a ims to invest and build i ndustrial s tar enterprises and e nhance c orporate value and a ccelerate t he coordinated d evelopme nt of integrated circuit i ndustry c hain.

 

DEFINITIONS

 

In this announcement, the following words have the following meanings unless the contex t r equires oth erwise:

 

‘‘ associates’

 

shall h ave the meaning assigned to it under t he Listing R ules;

 

 

 

‘‘Board’’

 

t he board o f D irectors;

 

 

 

‘‘ China IC Fund’

 

國家集成電路 業投資基金股 有限公司   (China      Integrated Circuit I ndustry I nvestment F und Co., Ltd.*), a company established under the laws o f t he PRC;

 

 

 

‘‘ Cap i ta l

Contribution’

 

the c apital contribution to t he Regi st ered Capita l b y S MIC Holdings, S MIC Shanghai, China IC Fund and S hanghai IC Fund which will result in the increase i n t he Registered Capital from US$210 million to U S$3.5 b illion;

 

 

 

‘‘ Cap i ta l

Contribution Agreement’

 

the capital contribution agreement entered into among SMIC Holdings, SMIC Shanghai, China IC Fund and Shanghai I C Fund on 30 January 2018 in r elation t o Capital Contribution;

 

 

 

‘‘Company’’

 

Semiconductor Manufactu ring International Corporation ( 國際集成電路製造有限公司 *), a company i ncorporated in the Cayman Islands w ith limited liability, the s hares o f which are listed on the m ain board of the S tock Exchange and the American depositary shares of which a re listed on th e N ew York Stoc k Exc hange, Inc. ;

 

 

 

‘‘ Director(s)’

 

t he director(s) o f t he Company;

 

 

 

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‘‘ EGM’

 

t he extraordinary general meeting o f t he Company proposed to be held to approve, among other t hings, the Joint Venture Agreement, the Capital Contribution A greement and t he transaction s co ntemplat ed thereund er;

 

 

 

‘‘ Group’

 

t he Company and its subsidiaries;

 

 

 

‘‘ Hong Kong’’

 

the Hong Kong Special Ad mini strative Regi on of the PRC;

 

 

 

‘‘ IFRS’

 

International   A ccounting Standards, International F inancial Reporting Standards, amendments and t he related interpretations issued b y t he international A ccounting Standards B oard

 

 

 

‘‘ Independent Board Committee’

 

the i ndependent committee o f t he Board that consists of all independent n on-executive D irectors who have no direct or indirect interest in the Joint Venture A greement other than, where a pplicable, b eing a Shareholder;

 

 

 

‘‘ Independent

Shareholders’

 

in relation to the Joint Venture A greement and t he Capital Contribution A greement, Shareholders other than X inxin ( Hong Kong) Capital Co., Limited and other a ssociates o f China IC Fund;

 

 

 

‘‘ Jo i nt Ve ntur e Agreement’

 

the joint venture a greement entered i nto a mong SMIC Holdings, SMIC Shanghai, China IC Fund and Shanghai I C F und on 30 January 2018 in relation to the Capital Contribution;

 

 

 

‘‘ L is t i n g Ru les’’

 

th e Ru les Go ve rn i n g t he Listing o f Securities on T he Stock Exchange of Hong Kong Limited;

 

 

 

‘‘PRC’’

 

the P eople’s R epublic o f China (for the p urposes of this announcement excluding Hong Kong, Macau Special Administrative Region of the P eople’s R epublic of China and Taiwan);

 

 

 

‘‘ Registered Capital’

 

t he registered capital o f SMSC;

 

 

 

‘‘ Shanghai IC Fund’

 

海集成電路 業投資基金股 有限公司 (Shanghai Integrated Circuit Industry Investment Fund Co., Ltd*), a company established under the laws of the PRC and is owned a s to approximately 10.53% by China IC Fund;

 

 

 

‘‘ Shareholder(s)’

 

the h older(s) of the Share(s);

 

 

 

‘‘Shares’’

 

ordinary shares of par value US$0.004 each in the s hare capital of the Company;

 

 

 

‘‘ SMIC Holdings’

 

SMIC Holdings Corporation* ( 芯國際控股有限公司 ),    a limited liability company established in the PRC and a wholly- owned s ubsidiary of the Company;

 

 

 

14

 


 

SMI C Shanghai

 

際集 電路 司   (Semiconductor Manufacturing International ( Shanghai) Corporation*), a wholly foreign-owned e nterpris e e stablished in the PRC and a wholly-owned s ubsidiary of the Company;

 

 

 

‘‘S M S C ’’

 

芯南方集成電路製造有限公司 (Semiconductor Manufacturing South China Corporation*), a Chi nese-foreign j oint venture established under t he laws of the PRC and a wholly-owned subsidiary of the Company whose r egistered c apital prior to t he Capital Contribution is US$210 million, of which 77% is owned by SMIC Shanghai and 23% is owned b y S MIC H oldings;

 

 

 

‘‘ Stock Exchange’

 

T he Stock Exchange o f Hong Kong Limited;

 

 

 

‘‘ United States’

 

the U ni ted S tates o f A merica;

 

 

 

‘‘US$’’

 

Un i ted S tates do l lar, the lawful c u rrency o f t he Un ited States;

 

 

 

‘‘ % ’’

 

p e r ce nt.

 

 

15

 


 

By order o f t he Board

Semiconductor M anufacturing International Corporation

Gao Yonggang

Executive D irector, Chief F inancial O fficer and Joint C ompany S ecretary

Shanghai, PRC,

30 January 2018

As at the d ate of t his announcement, the d irectors of the Company are:

Executive D irectors

Zhou Zixue (Chairman)

Zhao HaiJun ( C o-Chief E xecutive Officer)

Liang Mong Song (Co-Chief E xecutive Officer)

Gao Y onggang (Chief Financial Officer and Joint Company Secretary)

Non-executive Directors

Tzu-Yin Chiu (Vice Chairman)

Chen Shanzhi

Zhou Jie

Ren K ai

Lu Jun

Tong Guohua

Independent Non-executive Directors

Lip-Bu Tan

William Tudor Brown

Carmen I-Hua Chang

Shang-yi Chiang

Jason J ingsheng Cong

 

*

For ide ntification p urpo ses only

 

16

 

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