Nano Dimension Ltd. (Nasdaq:
NNDM), an industry leading
Additively
Manufactured
Electronics (
AME)/
PE
(3D-Printed Electronics)
provider, announced today that it has formed a partnership with
HENSOLDT AG (www.hensoldt.net), a global high-tech pioneer for
defense and security electronics and a market leader in civilian
and military sensor solutions. The recently formed joint venture
entity is named
J.A.M.E.S GmbH
(
Jetted
Additively
Manufactures
Electronics
Sources, or J.A.M.E.S).
Nano Dimension is a leading manufacturer of
intelligent machines which 3D-print Additively
Manufactured Electronics.
HENSOLDT has been using Nano Dimension’s DragonFly PRO and LDM®
3D-AME printer technology since 2018, to fabricate many innovative
“first-of” designs, as 3D-printed circuit boards (PCB)/AME 3D
Hi-PEDs®
(High-Performance-Electronic-Devices).
AME is a highly agile and customized method for development,
prototyping and fabrication of electronic circuits, which results
in a significant reduction of time and cost in the time-to-market
process. In addition, AME delivers a verified design before
production begins, resulting in a higher quality product.
HENSOLDT and Nano Dimension have been working
together to expand the capabilities of AME 3D Hi-PEDs®. By
formalizing their cooperation and co-investing approximately $6M in
the new joint venture entity, J.A.M.E.S, HENSOLDT
is strengthening its commitment to developing the most advanced
technology in 3D printing. The joint venture is led by HENSOLDT
Ventures, an independent unit within HENSOLDT, which implements and
brings to market new technologies and business models for the
HENSOLDT Group.
J.A.M.E.S, based in
Taufkirchen, Germany, will combine the strengths of both companies
and further advance the development of 3D-printed electronic
components. The main objective of J.A.M.E.S is the
development of an electronic designer’s community that will
exchange designs and methodologies for manufacturing, component
integration, and materials for Printed Electronics (PE) and
Additively Manufactured Electronics (AME). By connecting the
complete value chain of all designers and
users-of-designs across corporate
and geographical borders,
J.A.M.E.S will allow members of its community to
develop, prototype, market, and trade AME and PE designs, proof of
concepts, and products.
Beyond its “cloud presence”,
J.A.M.E.S will house an operating fabrication
laboratory that will be used for experimentation and support for
designs and technologies coming the J.A.M.E.S
community. This will make J.A.M.E.S capable of not
only being a community for ideation, but a platform to provide
prototyping services and AME applications for industry users and
its community of members.
Marian Rachow, Head of HENSOLDT Ventures, who
will serve on the J.A.M.E.S Board of Directors,
commented, “HENSOLDT, as a market leader in the field of sensor
technology and optronics, expects the closer cooperation with Nano
Dimension to accelerate development cycles as well as spare parts
production to respond to customer needs more quickly and
cost-effectively. Using special dielectric and conductive
nanoparticle inks, it is now possible to design electrical
components directly via the printer and bring them into a
three-dimensional form.”
Rachow added, “HENSOLDT has been investing in
basic research of digital 3D printing of electronic components for
several years to make the benefits of this technology available for
its own development and production. For example, in collaboration
with Nano Dimension, HENSOLDT has already printed the world’s first
10-layer PCB, which carries soldered high-performance electronic
structures on both outer sides, using a newly developed polymer ink
from Nano Dimension. Increasing competition and accelerated
customer procurement timelines will be one of the biggest
challenges for established providers in the future. Our joint
venture, J.A.M.E.S, not only offers rapid
development of technology as a real alternative to conventional
electronics manufacturing, but also offers small and medium-sized
companies the opportunity to efficiently design new products.”
Yoav Stern, Chairman of the Board & CEO of
Nano Dimension, who will serve as the Chairman of the
J.A.M.E.S Board of Directors, stated, “I am
confident that the co-investment of a supplier of transformative
technologies such as Nano Dimension, and an early innovative,
advanced adopter, committed to added value disruption such as
HENSOLDT, will produce game changing electronic solutions for both
suppliers and users of AME/PE. We are on the verge of a revolution
in 3D electronic additive manufacturing and are excited to
establish a strong ecosystem to drive the development of AME with
HENSOLDT. J.A.M.E.S GmbH
establishes a strong foundation for a world-wide network to foster
research, innovation and ultimately the development of Hi-PEDs® in
areas and industries still unexplored.”
Stern concluded, “The newly formed
J.A.M.E.S is focused on building a cloud-based
platform. In the future, other companies and customers are expected
to upload a wide variety of electronic components in their usual
CAD/CAM/CAE software and convert them into a new type of AME file
on the platform. Furthermore, they will be able to obtain
additional designs via the described platform, modify them, add
their own form factor and have them printed on-demand.”
About HENSOLDTHENSOLDT
(www.hensoldt.net) is a German defense industry champion with a
leading market position in Europe and global reach. Headquartered
in Taufkirchen near Munich, Germany, the company develops sensor
solutions for defense and security applications. As a technology
leader, HENSOLDT is also continuously expanding its portfolio in
cyber and developing new products to combat a wide range of threats
based on innovative approaches to data management, robotics, and
cybersecurity. With more than 5,600 employees, HENSOLDT generated
revenues of €1.2 billion in 2020. HENSOLDT is listed on the
Frankfurt Stock Exchange, where it is part of the SDAX share
index.
About Nano DimensionNano
Dimension (Nasdaq: NNDM) is a provider of intelligent machines for
the fabrication of Additively Manufactured Electronics (AME). High
fidelity active electronic and electromechanical subassemblies are
integral enablers of autonomous intelligent drones, cars,
satellites, smartphones, and in vivo medical devices. They
necessitate iterative development, IP safety, fast time-to-market,
and device performance gains, thereby mandating AME for in-house,
rapid prototyping and production. The DragonFly LDM® system is
being deployed in a wide range of industries, including academic
and research institutions, defense, aerospace, autonomous
automotive, robotics, and biotech. Its ability to enable on-site
prototyping in a matter of hours instead of weeks; create products
with better performance; reduce the size and weight of electronic
parts and devices; enable innovation; and critically important,
protect IP, is a paradigm shift in how industry and research
institutions will research, develop, and produce High-Performance
Electronic Devices (Hi-PEDs®.) Nano Dimension machines serve
cross-industry needs by depositing proprietary consumable
conductive and dielectric materials simultaneously, while
concurrently integrating in-situ capacitors, antennas, coils,
transformers, and electromechanical components, to function at
unprecedented performance. Nano Dimension bridges the gap between
PCB and semiconductor integrated circuits. A revolution at the
click of a button: From CAD to a functional high-performance AME
device in hours, solely at the cost of the consumable materials.
For more information, please visit www.nano-di.com.
Forward Looking StatementsThis
press release contains forward-looking statements within the
meaning of the “safe harbor” provisions of the Private Securities
Litigation Reform Act of 1995 and other Federal securities laws.
Words such as “expects,” “anticipates,” “intends,” “plans,”
“believes,” “seeks,” “estimates” and similar expressions or
variations of such words are intended to identify forward-looking
statements. For example, Nano Dimension is using forward-looking
statements in this press release when it discusses the potential of
its collaboration with HENSOLDT, the utility of J.A.M.E.S,
including that it will allow members of its AME community to
develop, prototype, market, and trade AME and PE designs, proof of
concepts and products, and that J.A.M.E.S will build a cloud-based
platform. Because such statements deal with future events and are
based on Nano Dimension's current expectations, they are subject to
various risks and uncertainties. Actual results, performance or
achievements of Nano Dimension could differ materially from those
described in or implied by the statements in this press release.
The forward-looking statements contained or implied in this press
release are subject to other risks and uncertainties, including
those discussed under the heading “Risk Factors” in Nano
Dimension’s annual report on Form 20-F filed with the Securities
and Exchange Commission (“SEC”) on March 11, 2021, and in any
subsequent filings with the SEC. Except as otherwise required by
law, Nano Dimension undertakes no obligation to publicly release
any revisions to these forward-looking statements to reflect events
or circumstances after the date hereof or to reflect the occurrence
of unanticipated events. References and links to websites have been
provided as a convenience, and the information contained on such
websites is not incorporated by reference into this press release.
Nano Dimension is not responsible for the contents of third-party
websites.
NANO DIMENSION INVESTOR RELATIONS
CONTACTYael Sandler, CFO | ir@nano-di.com
U.S. Investor Relations:Dave GentryRedChip
Companies Inc.Dave@redchip.com407-491-4498 or 1-800-RED-CHIP
(733-2447)
- Thomas Müller (right) CEO of HENSOLDT
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