Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
December 16 2020 - 10:45AM
Business Wire
Proven flow featuring the Celsius Thermal
Solver and Clarity 3D Solver accelerates 2.5/3D designs for
hyperscale, communications and automotive applications
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that
Samsung Foundry has certified the complete Cadence® system analysis
and advanced packaging design tool flow as a Samsung Multi-Die
Integration (MDI™) advanced packaging reference flow. This proven
on-/off-chip design flow, which features Cadence multi-physics
system analysis tools including the Celsius™ Thermal Solver and
Clarity™ 3D Solver, accelerates the planning, implementation,
verification and signoff of 2.5D and 3D multi-die chip designs
employed in hyperscale computing, 5G communications and automotive
applications, particularly those utilizing artificial intelligence
(AI). For more information, visit
www.cadence.com/go/samsungadvpkg.
Designers of advanced IC packages face many challenges that are
directly addressed by this documented, step-by-step approach to
validate critical electrical and thermal requirements for
first-pass success. Cadence collaborated with Samsung to certify
the flow, which was verified on eight SerDes differential pairs
across a 46mm x 32mm interposer.
Cadence’s multi-physics system analysis solution includes the
Celsius Thermal Solver, Clarity 3D Solver, Voltus™ IC Power
Integrity Solution, Sigrity SystemSI™ technology and Sigrity™
Broadband SPICE® technology, which can be used with the Allegro®
Package Designer Plus for ball-grid array (BGA) substrate layout
and analysis and with the Innovus™ Implementation System for layout
and analysis of 3D-IC chip stacks. Both implementation solutions
integrate seamlessly with Cadence’s OrbitIO™ Interconnect Designer
for system-level planning and optimization, as well as the Pegasus™
Verification System for signoff design rule checks (DRCs) and
layout versus schematic (LVS).
Using the Clarity 3D Solver, the SerDes connections were
extracted with all surrounding power and the complex package with a
level of detail that was not possible with other commercially
available 3D advanced packaging solutions. The SI and EM analyses
were performed by the Sigrity SystemSI technology and the Clarity
3D Solver respectively. The Celsius Thermal Solver directly read
the extracted complex package design and generated the thermal
model that was used in the simulation. The thermal solution was
enabled by the direct read of the chip-level GDS database and
contained more detail than other commercially available thermal
tools, with highly accurate results.
“The results from the Cadence analysis tools, particularly the
Celsius Thermal Solver and Clarity 3D Solver, provide pure 3D
full-wave and highly detailed thermal simulation for much more
accurate results,” said Sangyun Kim, vice president of Foundry
Design Technology Team at Samsung Electronics. “This collaboration
provides our mutual customers with a trusted system design
enablement solution for advanced packages that enables them to
implement state-of-the-art products.”
“This certification helps our mutual customers quickly achieve
lower power and higher performance using a much smaller form factor
in their designs,” stated Ben Gu, vice president of multi-physics
system analysis in the Custom IC & PCB Group at Cadence.
“Extraction accuracy is greatly improved over previous disjointed
approaches from multiple EDA vendors. This flow helps reduce cost
and improve reliability of their products using advanced MDI
packaging techniques.”
The certified Cadence flow supports Cadence’s Intelligent System
Design™ strategy, which enables customers to accelerate system
innovation.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For six
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
© 2020 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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