PITTSBURGH, April 14, 2021 /PRNewswire/ --
/ Key Highlights
- H3C Semiconductor designers used Ansys' comprehensive
multiphysics platform — including Ansys SIwave, Ansys HFSS, and
Ansys RedHawk-SC — to engineer a state-of-the-art network processor
chip featuring 56G Serdes and LPDDR5 interfaces
- Using Ansys solutions, H3C Semiconductor designers managed
multifaceted design issues from chip design to signoff,
co-simulating the chip and package to power advanced routing, 5G
backhaul, artificial intelligence (AI) and cybersecurity
applications
H3C Semiconductor leveraged Ansys (NASDAQ: ANSS) simulation
solutions to launch ENGIANT 660, a highly sophisticated network
processor chip that enables routing, AI, 5G backhaul and
cybersecurity applications. H3C Semiconductor designers used Ansys'
cutting-edge multiphysics simulation platform to enhance product
signoff efficiency, spur product development and pass stringent
testing requirements.
To innovate a large-scale complex network processor chip for
advanced processes, reduce development costs and solve a myriad of
complicated design issues, H3C Semiconductor designers employed a
broad spectrum of multiphysics simulation solutions. Ansys
solutions empowered designers to perform comprehensive analysis of
power noise, signal integrity, thermal reliability and structural
dependability from chip design to signoff. This ensured the highly
reliable processor chip met demanding design specifications and
accelerated the development of chip, package and system.
By integrating Ansys simulations into their workflow, H3C
Semiconductor designers cut hardware costs and substantially sped
production of next-gen chips for routing, AI, 5G backhaul and
cybersecurity applications. Designers used Ansys®
Redhawk-SC™ with its cloud-native, elastic compute
Ansys® SeaScape™ database to validate
full-chip power integrity and slash analysis times by 10x.
Additionally, they harnessed Ansys® SIwave™
to analyze signal integrity, leveraged Ansys®
HFSS™ to optimize 3D electromagnetic performance and
used Ansys® Mechanical™ and Ansys®
Icepak® to solve difficult thermal and structural
reliability issues.
"As enterprise customers rapidly develop high-end core routers,
5G backhaul, SDN/NFV, AI, Firewall and Load Balancing applications
around the world, Ansys' multiphysics simulation solutions for chip
packaging systems address the thermal and structural reliability
and power integrity challenges associated with large-scale chips,"
said David Dai, vice president of
engineering operations at H3C Semiconductor. "Collaborating with
Ansys proved instrumental to our design team, which heavily relied
on simulations to create ENGIANT 660, the first network processor
chip independently developed by H3C Semiconductor."
"Engineering new chips for exciting new routing, 5G, AI and
cybersecurity applications creates complex power noise and
electromagnetic, thermal and structural challenges that can only be
overcome with simulation," said John
Lee, vice president and general manager at Ansys. "Our
continued collaboration with H3C Semiconductor will drive new
designs with increased confidence and help ensure first-time design
success across their organization."
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–C
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
Investors
|
Kelsey
DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
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SOURCE Ansys