Intel Editorial: New Intel Core Processor Combines High-Performance CPU With Custom Discrete Graphics From AMD to Enable Slee...
November 06 2017 - 9:03AM
Business Wire
New Intel Design and Packaging Innovations
Reduce Silicon Footprint by More Than 50%, Enable Real Time Power
Sharing Across CPU and GPU for Optimal Performance
The following is an opinion editorial provided by Christopher
Walker, vice president of the Client Computing Group and general
manager of the Mobile Client Platform at Intel Corporation.
This press release features multimedia. View
the full release here:
http://www.businesswire.com/news/home/20171106005809/en/
Intel introduces a new product in the 8th
Gen Intel Core processor family that combines high-performance CPU
with discrete graphics for a thin, sleek design. (Credit: Intel
Corporation)
We often talk about our focus on driving innovation for the
enthusiast community, a targeted but growing segment of the PC
market. This point is underscored by what we have been delivering
with our Intel® Core™ X-series processors, Intel® Core™ H-series
mobile processors and, more recently, the first of our 8th Gen
Intel® Core™ desktop processors. Each product line offers a range
of new capabilities, workloads and form factors to cater to the
diverse needs of enthusiasts.
But as we looked at this lineup, we recognized an opportunity:
thinner, lighter, more powerful enthusiast mobile platforms that
deliver a premium experience. Currently, most enthusiast mobile PCs
have Intel Core H-series processors plus higher-powered discrete
graphics1, resulting in systems that average 26 mm in height.
Compare this to thin and light laptops that are trending down to 16
mm or less, with some even as thin as 11 mm.
Press Kit: 8th Gen Intel Core
We wanted to find a way to improve this. A way to deliver a
stronger combination of performance-level processors and discrete
graphics that open the door to even smaller form factors. And, we
knew we could do it by combining our Embedded Multi-Die
Interconnect Bridge (EMIB) technology with a new power-sharing
framework.
Today, we’re sharing initial details on a new product that does
exactly that, reducing the usual silicon footprint to less than
half that of standard discrete components on a motherboard. That’s
more freedom for OEMs to be creative and deliver innovative thin
and light designs with improved thermal dissipation. It also
delivers space to add new features, create new board layouts,
explore new cooling solutions or increase battery life.
The new product, which will be part of our 8th Gen Intel Core
family, brings together our high-performing Intel Core H-series
processor, second generation High Bandwidth Memory (HBM2) and a
custom-to-Intel third-party discrete graphics chip from AMD’s
Radeon Technologies Group* – all in a single processor package.
It’s a prime example of hardware and software innovations
intersecting to create something amazing that fills a unique market
gap. Helping to deliver on our vision for this new class of
product, we worked with the team at AMD’s Radeon Technologies
Group. In close collaboration, we designed a new semi-custom
graphics chip, which means this is also a great example of how we
can compete and work together, ultimately delivering innovation
that is good for consumers.
“Our collaboration with Intel expands the installed base for AMD
Radeon GPUs and brings to market a differentiated solution for
high-performance graphics,” said Scott Herkelman, vice president
and general manager, AMD Radeon Technologies Group. “Together we
are offering gamers and content creators the opportunity to have a
thinner-and-lighter PC capable of delivering discrete
performance-tier graphics experiences in AAA games and content
creation applications. This new semi-custom GPU puts the
performance and capabilities of Radeon graphics into the hands of
an expanded set of enthusiasts who want the best visual experience
possible.”
At the heart of this new design is EMIB, a small intelligent
bridge that allows heterogeneous silicon to quickly pass
information in extremely close proximity. EMIB eliminates height
impact as well as manufacturing and design complexities, enabling
faster, more powerful and more efficient products in smaller sizes.
This is the first consumer product that takes advantage of
EMIB.
Similarly, the power sharing framework is a new connection
tailor-made by Intel among the processor, discrete graphics chip
and dedicated graphics memory. We’ve added unique software drivers
and interfaces to this semi-custom discrete GPU that coordinate
information among all three elements of the platform. Not only does
it help manage temperature, power delivery and performance state in
real time, it also enables system designers to adjust the ratio of
power sharing between the processor and graphics based on workloads
and usages, like performance gaming. Balancing power between our
high-performing processor and the graphics subsystem is critical to
achieve great performance across both processors as systems get
thinner.
Additionally, this solution is the first mobile PC to use HBM2,
which consumes much less power and takes up less space compared to
traditional discrete graphics-based designs using dedicated
graphics memory, like GDDR5 memory.
This new addition to the 8th Gen Intel Core processor family
builds on our strong portfolio of mobile and graphics solutions.
Our 8th Gen and 7th Gen Intel Core processors brought capabilities
like brilliant 4K content creation and consumption in amazing new
designs. And as the leading supplier of PC Graphics, media and
display technologies2, we deliver the visual experience to the
majority of computers with our Intel HD and UHD graphics. Now,
we’re opening the door for thinner, lighter devices across
notebooks, 2 in 1s and mini desktops, while delivering incredible
performance and graphics for enthusiasts.
Some might say the PC market is mature and has been for some
time. At Intel, we challenge that notion every day. We are always
creating new possibilities people haven’t seen or experienced. Look
for more to come in the first quarter of 2018, including systems
from major OEMs based on this exciting new technology.
1 1H’17 GFK Retail Notebook Sales out data/1H’17 NPD Retail
Notebook Sell Through data
2 Mercury Research, PC Graphics Report, Q3 2017
*Other names and brands may be claimed as the property of
others.
View source
version on businesswire.com: http://www.businesswire.com/news/home/20171106005809/en/
Intel CorporationEileen Wongeileen.wong@intel.com
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