MELVILLE, N.Y., July 7, 2020 /PRNewswire/ -- Canon
U.S.A., Inc. today announced that
its parent company, Canon Inc., expects to commence sales in early
July 2020 of the FPA-8000iW i-line
stepper1, a new Semiconductor Lithography System for
advanced chip packaging. This system combines fine 1 μm2
resolution with support for customer's large panel substrates with
sizes up to 515 x 510 mm.
This new product marks the first Canon Semiconductor Lithography
system to support manufacturing using large panels that are common
in back-end processing. Integrating a Canon proprietary projection
optical system, the FPA-8000iW offers a wide exposure field and
fine 1 μm pattern resolution. The FPA-8000iW was designed to meet
the needs of manufacturers who are aiming for high-production
efficiency by using 515 x 510 mm organic (e.g., carbon based) panel
substrates for Panel Level Packaging (PLP) applications. PLP
processes typically involve mounting and processing a large number
of semiconductor chips on large, thin panels to produce packages
that can help increase communication bandwidth and reduce power
consumption of high performance computing systems.
Future customer requirements for PLP processes include cost
reduction and further shrinking of semiconductor packaging that can
help protect delicate internal semiconductor circuity from outside
environments and electrically connects to external
components. The FPA-8000iW supports PLP cost reduction and
package scaling by providing high-productivity panel processing
with a large exposure field and high resolution.
In response to packaging processes that use panel substrates,
Canon developed this new FPA-8000 Body platform capable of handling
large 515 x 510 mm panel substrates. Severe warpage is also common
in large-panel substrates and the new platform and panel-feeding
system can overcome up to 10 mm of panel warpage. As a
result, the FPA-8000iW can help customers realize high-productivity
and efficiency for PLP production of large packages.
The FPA-8000iW stepper employs Canon's proprietary projection
optical system that supports a wide 52 x 68 mm exposure field while
achieving 1.0 μm resolution, which is the finest resolution among
lithography systems that support large panel substrate
processes3. As a result, advanced packaging
technology such as PLP can help customers innovate to provide high
integration and flexibility in electronic system design.
About Canon U.S.A.
Inc.
Canon U.S.A., Inc.,
is a leading provider of consumer, business-to-business, and
industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately
$33 billion in global revenue, its
parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S.
patents granted in 2019† and was named one of Fortune
Magazine's World's Most Admired Companies in 2020. Canon
U.S.A. is dedicated to its
Kyosei philosophy of social and environmental
responsibility. To keep apprised of the latest news from Canon
U.S.A., sign up for the Company's
RSS news feed by visiting www.usa.canon.com/rss and follow us on
Twitter @CanonUSA.
1 i-line stepper: A semiconductor
lithography system that utilizes a 365 nm wavelength mercury lamp
as the light source. 1 nm (1 nanometer) = 1 billionth of a
meter
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2 1μm (1
micrometer) = one millionth of a meter = one thousandth of a
millimeter
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3
According to Canon research and public third party data, as well as
industry information as of June 22nd, 2020
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†Based on
weekly patent counts issued by United States Patent and Trademark
Office.
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Availability and
specifications are subject to change without notice.
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All referenced
product names, and other marks, are trademarks of their respective
owners.
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SOURCE Canon U.S.A., Inc.