FREMONT, Calif., Jan. 25, 2021 /PRNewswire-PRWeb/ -- YES (Yield
Engineering Systems, Inc.), a leading manufacturer of process
equipment for semiconductor advanced packaging, life sciences and
AR/VR applications, today announced that it has signed an agreement
to license Deca Technologies' Rapid Cure technology. The Deca IP, a
combination of UV and direct thermal exposure that significantly
lowers curing temperature and process time, will enable YES
customers to reduce thermal budgets for the organic and inorganic
thin films used in semiconductor front end, packaging and display
applications.
"We are extremely pleased to join forces with Deca, an
acknowledged leader in the Advanced Packaging field, to enhance our
thermal processing portfolio," said Rezwan
Lateef, President of YES. "The addition of Deca's Rapid Cure
technology to our cure capabilities allows YES to address a broader
variety of Advanced Packaging applications including low
temperature polymer cure, underfill bake, adhesive curing,
degas/curing of low-K films, and a variety of new fan-out
processes. Ultimately, this partnership will provide our customers
with a wider array of thermal processing tools with lower CoO and
better reliability to enable next generation products."
"We are delighted to collaborate with YES's innovative team to
extend Rapid Cure into multiple new product applications," stated
Tim Olson, founder & CEO of
Deca. "M-Series™ technology has demonstrated industry leading
fan-out performance. Rapid Cure has proven to be an integral part
of the process which produces consistently excellent quality and
reliability."
About Rapid Cure
The Rapid Cure process consists of ultraviolet (UV) pre-treatment
to provide preliminary cross-linking of the polymer, followed by
precisely controlled thermal curing. Rapid Cure provides a
significant throughput advantage over conventional curing, while
delivering comparable or superior properties.
About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of
high-tech, cost-effective equipment for transforming surfaces,
materials and interfaces. The company's product lines include
vacuum cure ovens, chemical vapor deposition (CVD) systems, and
plasma etching tools used for precise surface modification and
thin-film coating of semiconductor wafers, semiconductor and MEMS
devices, and biodevices. With YES, customers ranging from startups
to Fortune 100 companies can create and volume-produce products in
a wide range of markets, including Advanced Packaging, MEMS,
Augmented Reality/Virtual Reality and Life Sciences. YES is
headquartered in Fremont,
California, with a growing global presence. For more
information, please visit http://www.yieldengineering.com.
About Deca Technologies
Deca was born of a passion to transform the way the world builds
advanced electronic devices. In their first decade, Deca's 10X
thinking brought to life exciting breakthroughs for leading mobile
semiconductor companies including M-Series™ FX fan-out and Adaptive
Patterning™. From first-generation applications in traditional
semiconductor packaging to the growth of second-generation
capabilities for chiplets and heterogeneous integration, Deca's
technologies are emerging new standards, providing key foundational
building blocks for the future of the semiconductor industry.
Deca's world-class investors include Infineon, Qualcomm, ASE,
nepes and SunPower, all respected industry leaders that provide
Deca with strength and visibility for continuing innovation. For
more information, please visit http://www.ThinkDeca.com.
Media Contact
Victoria Barnes, Yield
Engineering Systems, Inc., 510-954-6723,
VBarnes@yieldengineering.com
SOURCE Yield Engineering Systems, Inc.