ROUSSET, France, May 28, 2018 /PRNewswire-PRWeb/ -- Specially
developed by SPS having in mind the needs for smart card vendors
operating on highly competitive markets, the Dual 6 micromodules
allow them to integrate easily dual interface cards in their
product offer. Dual 6 micromodules are based on SPS eBooster®
technology allowing to manufacture dual interface cards, that
operate in contact and contactless modes, thanks to electromagnetic
coupling between the antenna and the module (no physical connection
between the chip and the antenna).
SPS Dual 6 micromodules have exactly the same dimensions and
physical characteristics as regular contact micromodules. This way,
smart card manufacturers can seamlessly expand their offer to dual
interface cards without having to invest in costly new
manufacturing tools. In addition, they gain in flexibility as they
can produce batches of contact cards and dual interface cards on
the same equipment, without any modification.
This way, smart card vendors that choose SPS Dual 6 micromodules
are in the best position to support financial institutions
worldwide in their evolution from contact cards to dual interface
cards. Especially card issuers in Russia, the CIS and North as well as
Latin America are in the process
of switching massively from contact cards to dual interface
cards.
As the dimensions of SPS Dual 6 are exactly the same as the
dimensions of traditional contact micromodules, technical
departments at banks can propose contactless payment as a new
technology feature without having to require their marketing
departments to change artworks, which may be costly given the
variety of offers at banks nowadays.
In addition, Dual 6 micromodules are compatible with all
features needed by issuers to offer their customers a full range of
cards. Dual 6 micromodules can be embedded in colored core cards
thanks to pre-laminated antennas available in different colors
developed by SPS; they are also compatible with metallic and
non-metallic foils that allow a wide variety of designs for
high-end cards.
SPS Dual 6 micromodule is certified by Visa, MasterCard, Amex
and Discover with semiconductors coming from all leading providers
of chips for banking cards. SPS has obtained multiple LoAs (Letter
of Approval) for combinations of its Dual 6 micromodules with
various semiconductors and various operating systems.
Olivier Brunet, Product &
Marketing director, SPS declares: "The fact that already 50 million
cards based on our Dual 6 micromodules are on the field worldwide
is the best proof the flexibility provided by our technology is
praised by smart card vendors and allows them to be totally
reactive to the variety of requirements coming from financial
institutions."
Smart Packaging Solutions (SPS) will be exhibiting at
International PLUS Forum, a major event for the secure transactions
industry, taking place in Moscow,
Exhibition and Convention Centre "Sokolniki", on May 30-31, 2018. Come and visit us!
About SPS
Smart Packaging Solutions is specialized in the design,
manufacturing and sale of contactless solutions dedicated to ID
cards, e-passport and dual interface banking cards. Headquartered
in Rousset, France, with a
subsidiary in Singapore, SPS
employs 140 people. Part of the French IN Groupe, the company
specializes in contactless and dual-interface products, with a
recognized micro packaging expertise. SPS has filed over 120
patents supporting its exclusive technologies. More information at
http://www.s-p-s.com
SPS is part of the IN Groupe.
The IN Groupe is a global leader in secure identity
solutions.
In a mobile and digital world where data security has become the
major issue, the IN Groupe offers States, governments and
businesses trusted solutions including added value electronic
components for banking, identity solutions including electronic
components, cutting-edge secure credentials and safe and reliable
interoperable systems, but also innovative and efficient digital
services, and secure solutions for complex printings and
workflows.
Real engineering company, the IN Groupe is specialized in the
integration of electronic and biometrics in identity documents and
in polycarbonate cards. Thanks to its innovative new products and
its strengthened security, the IN Groupe has become a worldwide
leader with major customers in over 68 countries.
Based in Paris, the IN Groupe
has two production centers and employs more than 900 employees, of
which over a third is dedicated to technology development.
Follow us on:
Contact: IN Groupe
Romain Galesne-Fontaine | +33 1 40 58 30 00
| media(at)ingroupe(dot)com
SOURCE Smart Packaging Solutions