Fonon Highlights BlackStar Wafer Dicing Machine for Semiconductor Industry Applications
March 29 2024 - 5:16PM
Business Wire
Fonon Corporation, a multi-market holding company, R&D
center, equipment designer and manufacturer of advanced laser
material processing systems for subtractive and additive
manufacturing, highlights its BlackStar Wafer Dicing Machine for
applications in the semiconductor industry.
The BlackStar is powered by Fonon’s patented Fantom Width Laser
Dicing technology (FWLD), an innovative next-generation method of
splitting brittle materials in a cost-effective way that involves
no material loss.
The manufacturing of semiconductor chips involves cutting, or
singulating, small-scale dies out of silicon wafers. Common
challenges in this process include the high potential for defects
and distortions, as well as the unavoidable material waste. Silicon
sawing tools can cause cracks and chipping, while also resulting in
material waste at the line of blade contact.
Fonon’s BlackStar offers a solution to these challenges,
providing for a higher yield of dies per wafer and maximizing
throughput while maintaining the integrity of the material. The
FWLD technology splits materials at the molecular level at
tremendous speed with near-zero kerf width. In summary, a narrower
kerf width results in more chips per wafer, hence the material loss
is reduced. Eliminating such manufacturing waste lowers production
time and costs.
Non-contact laser processing separates wafers effectively,
preventing flaking at the cut edge. With Fonon’s automated
single-step processing, the quality of the edges – one of the
critical criteria for fracture resistance – is further improved.
Increased die strength during chip package construction also
directly impacts dependability and quality.
Fonon’s FWLD technology allows for the production of multiple
size dies on the same wafer and the dicing of complex shapes. Each
die can be cut individually regardless of shape, size, or position.
The process can involve using a backing tape frame for stability,
along with dry processing, which eliminates water use and extra
handling steps.
The BlackStar can dice a wide variety of semiconductor
materials, including silicon, gallium arsenide, germanium, indium
phosphide, silicon carbide, gallium nitride, gallium phosphide and
other compound materials.
About Fonon Corporation
Fonon Corporation is a diversified industrial laser equipment
company with a continuously growing umbrella of building-block
technologies supported by patents, licenses, next-generation
hardware, and proprietary metal processing IP. The company is
dedicated to advancing industrial technology and designing
specialized 3D metal printing systems for manufacturing purposes,
representing the fastest path to Manufacturing Readiness Level
10.
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Fonon Corporation Media Relations 1 (844) 366-6624
Marketing@fonon.com