Applied Materials' New Photomask Etch System Enables the Extension of Multiple Patterning to 10nm and Beyond
April 20 2015 - 7:30AM
- Centura® Tetra(TM) Z
system is industry's first photomask etch
solution for quadruple patterning at 10nm and beyond
- World-class photomask etch
performance and defect control meet advanced patterning
requirements for logic and memory devices
SANTA CLARA, Calif., April 20, 2015 - Applied
Materials today announced the Applied Centura®
Tetra(TM) Z
Photomask Etch system for etching next-generation optical
lithographic photomasks needed by the industry to continue
multiple patterning scaling to the 10nm node and beyond. The new
tool extends the capabilities of Applied's industry-leading Tetra
platform, delivering angstrom-level photomask accuracy for critical
dimension (CD) parameters required to meet stringent patterning
specifications for future logic and memory devices.
"Our Tetra Z system represents the state of the
art in photomask etch technology, employing advances in precision
materials engineering and plasma reaction kinetics to extend the
use of 193nm lithography," said Rao Yalamanchili, general manager
of Applied's Mask Etch product division. "Using the 193nm
wavelength to produce 10nm or 7nm patterns requires a range of
optimization techniques, including immersion and multiple
patterning, which rely heavily on photomasks. Etch technology is
key for photomask fabrication; the Tetra Z system is unique in
delivering the accuracy required to etch next-generation optical
photomasks for patterning advanced node designs."
Applied developed the Tetra Z tool for advanced
chrome, MoSi*, hard mask and quartz (fused silica) etch
applications used to fabricate advanced binary and phase-shift
masks (PSMs). Offering continuous technical innovations and
unprecedented CD performance, the system extends immersion
lithography for quadruple patterning and cutting-edge resolution
enhancement techniques. Vital capabilities ensuring pattern
transfer fidelity include uniform, linear precision etching across
all feature sizes and pattern densities with virtually zero
defectivity.
Excellent CD performance combined with high etch
selectivity enable the use of thinner resist films for achieving
smaller photomask CD patterns on critical device layers.
Controllable CD bias capability expands the system's flexibility to
meet customer specific requirements. Unique quartz etch depth
control ensures precision phase angle and aids integrated circuit
scaling by providing customers the capability to use alternating
aperture PSMs and chromeless phase lithography. These key advances
derive from a variety of system improvements in chamber design,
plasma stability, ion and radical control, flow and pressure
control, and real-time process monitoring and control.
Applied's Tetra systems have been selected by a
majority of mask makers worldwide to etch high-end photomasks over
the past decade.
Applied Materials, Inc. (Nasdaq:AMAT) is the
global leader in precision materials engineering solutions for the
semiconductor, flat panel display and solar photovoltaic
industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and
accessible to consumers and businesses around the world. Learn more
at www.appliedmaterials.com.
*MoSi = molybdenum silicon oxynitride
# # #
Contacts:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
PHOTO: Applied Centura® Tetra™ Z
Photomask Etch System
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Source: Applied Materials via Globenewswire
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