Advantest Launches TS9000 System for Semiconductor Packaging Inspection
September 30 2014 - 11:24AM
Business Wire
Innovative new metrology tool applies
terahertz analysis to high-volume manufacturing
Leading semiconductor test equipment supplier Advantest
Corporation (TSE: 6857, NYSE:ATE) announced today that a new mold
thickness metrology system, the TS9000, for measuring the thickness
of semiconductor packaging, is available for purchase. The system
is based on advances in Terahertz (THz) technology pioneered by
Advantest.
The TS9000 Mold Thickness Analysis (MTA) System is a new
metrology tool that performs non-destructive analysis of the
thickness of semiconductor packaging. Meeting the high standards of
speed and accuracy required for high-volume manufacturing, its
innovative inspection capabilities are expected to contribute
significantly to product quality improvement amid the trends
towards smaller device sizes and higher integration, driven in part
by the widespread adoption of smartphones and tablets.
Already installed and in use, the TS9000 heralds a new product
family of analysis systems for high-volume manufacturing. Future
systems from the THz product family will target the pharmaceutical,
automotive, ceramic and other industrial markets in addition to
semiconductors. . Advantest is leveraging its leading capabilities
in terahertz technology to bring cutting-edge non-destructive
analysis to industrial production lines.
Background
The worldwide embrace of smartphones and other advanced consumer
electronics is driving demand for smaller, more highly integrated
semiconductor devices. Semiconductor packages for this market must
be compact, thin, and tough enough to stand up to mobile usage. The
semiconductor industry has few higher priorities than achieving an
optimal balance of package durability and thinness.
However, existing metrology methods are not suitable for volume
production lines. Manufacturers have had to test package thickness
by inspecting samples late in the production process. Existing
metrology methods are slow, laborious and destructive and not
compatible with quality control in a high volume environment. This
makes it difficult to assess the quality of the entire production
run and problematic to trace the root cause of any defects in the
final product.
Advantest’s TS9000 solves these issues by enabling rapid,
repeatable, and highly accurate measurements of mold thickness,
without the limitations of existing measurement methods. Highly
adaptable, it can be deployed at various points in the assembly and
packaging process, even immediately after the curing process,
enabling earlier detection of production issues and improving
product quality and yield.
Product Features
- Non-Destructive Terahertz
Technology
The TS9000 exploits the unique characteristics of terahertz
radiation, which have high penetration into many materials,
including ceramics, silicon and plastic polymers, even if those
materials are optically opaque. This allows for non-destructive
layer thickness measurements in a wide variety of materials.
- Suitable for High Volume
Manufacturing Environments
Advantest’s proprietary technologies, such as rapid fiber
coupled pulsed laser generation and detection of THz waves, enable
the TS9000 to meet the highest industry standards for measurement
speed and accuracy. This first-in-class system delivers throughput
suitable for a high-volume manufacturing environment.
The TS9000 can be implemented early in the process and be used
to measure strip packages—before units are cut into single devices.
This, coupled with the significantly higher throughput compared to
conventional mold thickness measurements, makes this a tool which
can drastically improve process quality control.
In addition to strip units, the highly adaptable TS9000 supports
measurement of individual devices handled using industry standard
JEDEC trays, making it flexible and compatible with existing sample
handling methods.
Key Specifications:
Application: Semiconductor package thickness inspection
Measurable Layer Thickness: 30µm ~ 600µm Accuracy: Better than 3µm
Operating Environment: Temperature: +10℃ ~ +30℃; humidity: <80%
Dimensions: Analysis unit: 430 (W) × 540 (D) × 330 (H) mm / 30 kg
or less Optical unit: 430 (W) × 240 (D) × 220 (H) mm / 14 kg or
less Measurement unit: 1050 (W) × 650(D) × 450 (H) mm/67kg or less
About Advantest Corporation
A world-class technology company, Advantest is the leading
producer of automatic test equipment (ATE) for the semiconductor
industry and a premier manufacturer of measuring instruments used
in the design and production of electronic instruments and systems.
Its leading-edge systems and products are integrated into the most
advanced semiconductor production lines in the world. The company
also focuses on R&D for emerging markets that benefit from
advancements in nanotech and terahertz technologies, and has
introduced multi-vision metrology scanning electron microscopes
essential to photomask manufacturing, as well as groundbreaking 3D
imaging and analysis tools. Founded in Tokyo in 1954, Advantest
established its first subsidiary in 1982, in the USA, and now has
subsidiaries worldwide. More information is available at
www.advantest.com.
###
All information supplied in this release is correct at the time
of publication, but may be subject to change.
Further Inquiries:Advantest CorporationHiroki Yanagita,
+81-3-3214-7500info_t@jp.advantest.comor in the U.S.,
TAS_info@advantest.com
Advantest (PK) (USOTC:ATEYY)
Historical Stock Chart
From Apr 2024 to May 2024
Advantest (PK) (USOTC:ATEYY)
Historical Stock Chart
From May 2023 to May 2024