MELVILLE, N.Y., Aug. 9, 2016 /PRNewswire/ -- As mobile
devices become progressively smaller and more energy efficient, the
demand for semiconductor chips with higher levels of integration
and thinner dimensions continues to increase. To help meet
these demands, Canon U.S.A., Inc.,
a leader in digital imaging solutions, has announced that its
parent company, Canon Inc., recently launched the FPA-5520iV, an
i-line stepper1 that succeeds the FPA-5510iV. Launched
in July 2011, the FPA-5510iV is
recognized for its high resolution and overlay accuracy. The new
lithography tool offers improved Fan Out Wafer Level Package
(FOWLP)2 functionality and is designed to help users
enhance their productivity.
FOWLP technology has attracted attention as a next-generation
packaging technology to meet this demand. It enables the
fabrication of thinner System in Package (SiP) modules combining
different semiconductor chips with varying functions, such as
processors and memory, and is expected to support the realization
of higher-integration-level, thinner-package semiconductor devices
with low-production costs.
In addition to inheriting the high-resolution performance (1
μm)3 when equipped with an optional lens component and
high overlay accuracy (0.15 μm) of its predecessor, the new
FPA-5520iVcan provide enhanced support for the processing of warped
wafers and wafers with variations in chip alignment due to wafer
reconstitution. 4 Accordingly, the new system is
designed to better respond to the varied needs of the package
market amid rapid technological advances and diversification.
The FPA-5520iV is designed to help solve various challenges
posed by the mass production of next-generation package
technologies. The system's wafer feeding system employs flexible
pads enabling the processing of warped and distorted wafers. Also,
equipped with Canon's proprietary vacuum system, the wafer stage
makes possible significantly improved suction across the entire
wafer, helping to ensure a high degree of flatness for high optical
performance to support fine-pattern processing. The FPA-5520iV
features an alignment scope with a field of view that offers
approximately twice the area of its predecessor.
As a leading-edge back-end i-line stepper, the FPA-5520iV can
help users achieve among the highest levels of productivity among
same-class i-line steppers.5 Facilitating the detection
of alignment marks, even when handling reconstituted wafers with
inconsistent chip alignments, the system helps deliver improved
operating rates for better efficiency. 6
Employing a newly developed high-intensity illumination optics
system that realizes an approximately 30 percent
improvement7 in illumination intensity, the tool
supports reduced exposure times for the thick photo-resist
processes used by back-end users to boost wafer processing capacity
by approximately 20 percent as compared with the
FPA-5510iV.8
The new lithography tool inherits its predecessor's proven
projection lens optics, which boast high resolving performance, and
alignment system, which makes possible high-precision overlay
accuracy. Additionally, the new FPA-5520iV offers compatible
operation with the earlier FPA-5510iV and makes use of software
that supports easy recipe conversion.
For more information on Canon Industrial Products, please visit
usa.canon.com/industrial.
About Canon U.S.A.,
Inc.
Canon U.S.A., Inc., is
a leading provider of consumer, business-to-business, and
industrial digital imaging solutions to the United States and to Latin America and the Caribbean (excluding Mexico) markets. With approximately
$31 billion in global revenue, its
parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S.
patents granted in 2015† and is one of Fortune
Magazine's World's Most Admired Companies in 2016. Canon
U.S.A. is committed to the highest
level of customer satisfaction and loyalty, providing 100 percent
U.S.-based consumer service and support for all of the products it
distributes. Canon U.S.A. is
dedicated to its Kyosei philosophy of social and
environmental responsibility. In 2014, the Canon Americas
Headquarters secured LEED® Gold certification, a recognition for
the design, construction, operations and maintenance of
high-performance green buildings. To keep apprised of the latest
news from Canon U.S.A., sign up
for the Company's RSS news feed by visiting www.usa.canon.com/rss
and follow us on Twitter @CanonUSA. For media inquiries, please
contact pr@cusa.canon.com.
1 A semiconductor lithography system that employs a
365 nm wavelength mercury lamp as the light source.
2 A type of package technology that offers such
merits as higher levels of integration, a greater number of
external contacts and a smaller package footprint.
3 Micrometer (μm): 1μm = one millionth of a
meter.
4 Wafer reconstitution is an assembly process where
individual die are mounted and encapsulated onto a carrier
substrate for further processing.
5 As of July 4, 2016,
based on a Canon survey.
6 Some wafers may be too distorted to be
processed.
7 Compared with the FPA-5510iV.
8 No. of wafers processed per unit of time when
exposing 300 mm wafers, 60 shots at 10000J/m2.
†Based on weekly patent counts issued by United
States Patent and Trademark Office.
Specifications and availability subject to change without
notice. All referenced product names, and other marks, are
trademarks of their respective owners.
Canon U.S.A. Web
site:
http://www.usa.canon.com
For sales information/customer support:
1-800-OK-CANON
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SOURCE Canon U.S.A., Inc.