(Name, Telephone, Email and/or Facsimile
number and Address of Company Contact Person)
Securities registered or to be registered
pursuant to Section 12(b) of the Act:
*Traded
in the form of American Depositary Receipts evidencing American Depositary Shares (the “ADSs”), each
representing five common shares of Advanced Semiconductor Engineering, Inc.
Securities registered
or to be registered pursuant to Section 12(g) of the Act:
Securities for which there
is a reporting obligation pursuant to Section 15(d) of the Act:
Indicate the number of outstanding shares
of each of the issuer’s classes of capital or common stock as of the close of the period covered by the annual report:
Indicate by check mark if the registrant is
a well-known seasoned issuer, as defined in Rule 405 of the Securities Act.
If this report is an annual or transition
report, indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or 15(d) of the Securities
Exchange Act of 1934.
Indicate by check mark whether the Registrant
(1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding
12 months (or for such shorter period that the Registrant was required to file such reports) and (2) has been subject to such filing
requirements for the past 90 days.
Indicate by check mark whether the registrant
has submitted electronically and posted on its corporate Web site, if any, every Interactive Data File required to be submitted
and posted pursuant to Rule 405 of Regulation S-T (§232.405 of this chapter) during the preceding 12 months (or for such shorter
period that the registrant was required to submit and post such files).
Indicate by check mark whether the registrant
is a large accelerated filer, an accelerated filer, or a non-accelerated filer. See definition of “accelerated filer and
large accelerated filer” in Rule 12b-2 of the Exchange Act. (Check one):
Indicate by check mark which basis of accounting
the registrant has used to prepare the financial statements included in this filing:
If “Other” has been checked in
response to the previous question, indicate by check mark which financial statement item the registrant has elected to follow:
If this is an annual report, indicate by check
mark whether the registrant is a shell company (as defined in Rule 12b-2 of the Exchange Act).
** As a result of the exercise of employee
stock options subsequent to December 31, 2015, as of March 31, 2016, we had 7,918,272,896 shares outstanding.
Unless the context otherwise requires,
references in this annual report to:
We publish our financial statements in
New Taiwan dollars, the lawful currency of the ROC. In this annual report, references to “United States dollars,” “U.S.
dollars” and “US$” are to the currency of the United States; references to “New Taiwan dollars,”
“NT dollars” and “NT$” are to the currency of the ROC; references to “RMB” are to the currency
of the PRC; references to “JP¥” are to the currency of Japan; references to “MYR” are to the currency
of Malaysia; references to “SGD” are to the currency of Republic of Singapore; references to “KRW” are
to the currency of Republic of Korea; and references to “EUR” are to the currency of the European Union. Unless otherwise
noted, all translations from NT dollars to U.S. dollars were made at the exchange rate as set forth in the H.10 weekly statistical
release of the Federal Reserve System of the United States (the “Federal Reserve Board”) as of December 31, 2015, which
was NT$32.79=US$1.00, and all translations from RMB to U.S. dollars were made at the exchange rate as set forth in the H.10 weekly
statistical release of the Federal Reserve Board as of December 31, 2015, which was RMB6.4778=US$1.00. All amounts translated into
U.S. dollars in this annual report are provided solely for your convenience and no representation is made that the NT dollar, RMB
or U.S. dollar amounts referred to herein could have been or could be converted
into U.S. dollars or NT dollars/RMB, as the case may be, at any particular rate or at all. On April 22, 2016, the exchange rate
between NT dollars and U.S. dollars as set forth in the H.10 weekly statistical release by the Federal Reserve Board was NT$32.36=US$1.00.
On April 22, 2016, the exchange rate between RMB and U.S. dollars as set forth in the H.10 weekly statistical release by the Federal
Reserve Board was RMB6.5004 =US$1.00.
This annual report on Form 20-F contains
“forward-looking statements” within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange
Act. Although these forward-looking statements, which may include statements regarding our future results of operations, financial
condition or business prospects, are based on our own information and information from other sources we believe to be reliable,
you should not place undue reliance on these forward-looking statements, which apply only as of the date of this annual report.
The words “anticipate,” “believe,” “estimate,” “expect,” “intend,”
“plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in
this annual report. Our actual results of operations, financial condition or business prospects may differ materially from those
expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality
and market conditions in the semiconductor or electronics industry; changes in our regulatory environment, including our ability
to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor
packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive
semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive;
international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties
as to whether we can complete the acquisition of 100% of SPIL shares not otherwise owned by ASE; the strained relationship
between the ROC and the PRC; general economic and political conditions; the recent global economic crisis; possible disruptions
in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other
factors. For a discussion of these risks and other factors, see “Item 3. Key Information—Risk Factors.”
PART I
Item 1. Identity of Directors, Senior Management and Advisers
Not applicable.
Item 2. Offer Statistics and Expected Timetable
Not applicable.
Item 3. Key Information
SELECTED
FINANCIAL DATA
The selected consolidated statements of
comprehensive income data and cash flow data for the years ended December 31, 2013, 2014 and 2015, and the selected consolidated
balance sheet data as of December 31, 2014 and 2015 set forth below are derived from our audited consolidated financial statements
included in this annual report and should be read in conjunction with, and are qualified in their entirety by reference to, these
consolidated financial statements, including the notes thereto. The selected consolidated statements of comprehensive income data
and cash flow data for the year ended December 31, 2012 and the selected consolidated balance sheet data as of December 31, 2012
and 2013 set forth below are derived from our audited consolidated financial statements not included herein.
Our consolidated financial statements have
been prepared and presented in accordance with IFRS. Until and including our consolidated financial statements included in our
annual report on Form 20-F for the year ended December 31, 2012, we prepared our consolidated financial statements in accordance
with ROC GAAP with reconciliations to U.S. GAAP.
We adopted IFRS for certain filings with
the SEC, starting from the filing of our annual report on Form 20-F for the year ended December 31, 2013. Historical financial
results as of and for the year ended December 31, 2012 included herein have been adjusted and presented in accordance with IFRS,
which differs from the results included in our annual report on Form 20-F for the year ended December 31, 2012. Meanwhile, as required
by the FSC, we adopted Taiwan-IFRS for reporting of our annual and interim consolidated financial statements in the ROC beginning
on January 1, 2013. Taiwan-IFRS differs from IFRS in certain respects, including, but not limited to the extent that any new or
amended standards or interpretations applicable under IFRS may not be timely endorsed by the FSC. See “Item 3. Key Information—Risk
Factors—Risks Relating to Our Business—Our adoption of new financial reporting standards, effective January 1, 2013,
may have material impact on our financial statements thereafter” for more information.
Following our adoption of IFRS for SEC
filing purposes, pursuant to the rule amendments adopted by the SEC that became effective on March 4, 2008, we were no longer required
to reconcile our consolidated financial statements with U.S. GAAP. Historical selected financial data as of and for the year ended
December 31, 2011 derived from our consolidated financial statements prepared in accordance with ROC GAAP have not been included
below.
|
|
As of and for the Year Ended December 31,
|
IFRS
|
|
2012
|
|
2013
|
|
2014
|
|
2015
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
US$
|
|
|
(in millions, except earnings per share and per ADS data)
|
Statement of Comprehensive Income Data:
|
|
|
|
|
|
|
|
|
|
|
Operating revenues
|
|
|
193,972.4
|
|
|
|
219,862.4
|
|
|
|
256,591.4
|
|
|
|
283,302.5
|
|
|
|
8,639.9
|
|
Operating costs
|
|
|
(157,342.7
|
)
|
|
|
(177,040.4
|
)
|
|
|
(203,002.9
|
)
|
|
|
(233,167.3
|
)
|
|
|
(7,110.9
|
)
|
Gross profit
|
|
|
36,629.7
|
|
|
|
42,822.0
|
|
|
|
53,588.5
|
|
|
|
50,135.2
|
|
|
|
1,529.0
|
|
Operating expenses
|
|
|
(18,922.6
|
)
|
|
|
(20,760.4
|
)
|
|
|
(23,942.7
|
)
|
|
|
(25,250.6
|
)
|
|
|
(770.1
|
)
|
Other operating income and expenses, net
|
|
|
83.2
|
|
|
|
(1,348.2
|
)
|
|
|
228.7
|
|
|
|
(251.5
|
)
|
|
|
(7.6
|
)
|
Profit from operations
|
|
|
17,790.3
|
|
|
|
20,713.4
|
|
|
|
29,874.5
|
|
|
|
24,633.1
|
|
|
|
751.3
|
|
Non-operating income (expense), net
|
|
|
(1,181.6
|
)
|
|
|
(1,343.6
|
)
|
|
|
(1,339.4
|
)
|
|
|
660.1
|
|
|
|
20.1
|
|
|
|
As of and for the Year Ended December 31,
|
IFRS
|
|
2012
|
|
2013
|
|
2014
|
|
2015
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
US$
|
|
|
(in millions, except earnings per share and per ADS data)
|
Profit before income tax
|
|
|
16,608.7
|
|
|
|
19,369.8
|
|
|
|
28,535.1
|
|
|
|
25,293.2
|
|
|
|
771.4
|
|
Income tax expense
|
|
|
(2,960.4
|
)
|
|
|
(3,499.6
|
)
|
|
|
(5,666.0
|
)
|
|
|
(4,311.1
|
)
|
|
|
(131.5
|
)
|
Profit for the year
|
|
|
13,648.3
|
|
|
|
15,870.2
|
|
|
|
22,869.1
|
|
|
|
20,982.1
|
|
|
|
639.9
|
|
Attributable to
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Owners of the Company
|
|
|
13,191.6
|
|
|
|
15,404.5
|
|
|
|
22,228.6
|
|
|
|
20,013.5
|
|
|
|
610.4
|
|
Non-controlling interests
|
|
|
456.7
|
|
|
|
465.7
|
|
|
|
640.5
|
|
|
|
968.6
|
|
|
|
29.5
|
|
|
|
|
13,648.3
|
|
|
|
15,870.2
|
|
|
|
22,869.1
|
|
|
|
20,982.1
|
|
|
|
639.9
|
|
Other comprehensive income (loss), net of income tax
|
|
|
(3,830.7
|
)
|
|
|
3,233.3
|
|
|
|
5,504.4
|
|
|
|
(147.6
|
)
|
|
|
(4.5
|
)
|
Total comprehensive income for the year
|
|
|
9,817.6
|
|
|
|
19,103.5
|
|
|
|
28,373.5
|
|
|
|
20,834.5
|
|
|
|
635.4
|
|
Attributable to
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Owners of the Company
|
|
|
9,420.4
|
|
|
|
18,509.6
|
|
|
|
27,394.3
|
|
|
|
19,940.4
|
|
|
|
608.1
|
|
Non-controlling interests
|
|
|
397.2
|
|
|
|
593.9
|
|
|
|
979.2
|
|
|
|
894.1
|
|
|
|
27.3
|
|
|
|
|
9,817.6
|
|
|
|
19,103.5
|
|
|
|
28,373.5
|
|
|
|
20,834.5
|
|
|
|
635.4
|
|
Earnings per common share
(1)
:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Basic
|
|
|
1.77
|
|
|
|
2.05
|
|
|
|
2.89
|
|
|
|
2.62
|
|
|
|
0.08
|
|
Diluted
|
|
|
1.73
|
|
|
|
1.99
|
|
|
|
2.79
|
|
|
|
2.51
|
|
|
|
0.08
|
|
Dividends per common share
(2)
|
|
|
2.05
|
|
|
|
1.05
|
|
|
|
1.29
|
|
|
|
2.00
|
|
|
|
0.06
|
|
Earnings per equivalent ADS
(1)
:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Basic
|
|
|
8.86
|
|
|
|
10.26
|
|
|
|
14.46
|
|
|
|
13.08
|
|
|
|
0.40
|
|
Diluted
|
|
|
8.65
|
|
|
|
9.96
|
|
|
|
13.93
|
|
|
|
12.55
|
|
|
|
0.38
|
|
Number of common shares
(3)
:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Basic
|
|
|
7,445.5
|
|
|
|
7,508.5
|
|
|
|
7,687.9
|
|
|
|
7,652.8
|
|
|
|
7,652.8
|
|
Diluted
|
|
|
7,568.2
|
|
|
|
7,747.6
|
|
|
|
8,220.7
|
|
|
|
8,250.1
|
|
|
|
8,250.1
|
|
Number of equivalent ADSs
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Basic
|
|
|
1,489.1
|
|
|
|
1,501.7
|
|
|
|
1,537.6
|
|
|
|
1,530.6
|
|
|
|
1,530.6
|
|
Diluted
|
|
|
1,513.6
|
|
|
|
1,549.5
|
|
|
|
1,644.1
|
|
|
|
1,650.0
|
|
|
|
1,650.0
|
|
Balance Sheet Data:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Current assets
|
|
|
97,495.6
|
|
|
|
132,176.5
|
|
|
|
159,955.2
|
|
|
|
156,732.8
|
|
|
|
4,779.9
|
|
Investments - non-current
(4)
|
|
|
2,267.8
|
|
|
|
2,345.5
|
|
|
|
2,409.3
|
|
|
|
38,328.0
|
|
|
|
1,168.9
|
|
Property, plant and equipment, net
|
|
|
127,197.8
|
|
|
|
131,497.3
|
|
|
|
151,587.1
|
|
|
|
149,997.1
|
|
|
|
4,574.5
|
|
Intangible assets
|
|
|
12,361.3
|
|
|
|
11,953.6
|
|
|
|
11,913.3
|
|
|
|
11,888.6
|
|
|
|
362.6
|
|
Long-term prepayment for lease
|
|
|
4,164.1
|
|
|
|
4,072.3
|
|
|
|
2,586.0
|
|
|
|
2,556.2
|
|
|
|
77.9
|
|
Others
(5)
|
|
|
4,236.0
|
|
|
|
4,676.9
|
|
|
|
5,267.9
|
|
|
|
5,765.5
|
|
|
|
175.8
|
|
Total assets
|
|
|
247,722.6
|
|
|
|
286,722.1
|
|
|
|
333,718.8
|
|
|
|
365,268.2
|
|
|
|
11,139.6
|
|
Short-term debts
(6)
|
|
|
36,884.9
|
|
|
|
44,618.2
|
|
|
|
41,176.0
|
|
|
|
36,983.4
|
|
|
|
1,127.9
|
|
Current portion of long-term debts
|
|
|
3,213.8
|
|
|
|
6,016.5
|
|
|
|
2,835.5
|
|
|
|
16,843.3
|
|
|
|
513.7
|
|
Long-term debts
(7)
|
|
|
44,591.7
|
|
|
|
50,166.5
|
|
|
|
55,375.8
|
|
|
|
66,535.1
|
|
|
|
2,029.1
|
|
Other liabilities
(8)
|
|
|
53,211.8
|
|
|
|
60,176.9
|
|
|
|
78,640.1
|
|
|
|
78,700.1
|
|
|
|
2,400.1
|
|
Total liabilities
|
|
|
137,902.2
|
|
|
|
160,978.1
|
|
|
|
178,027.4
|
|
|
|
199,061.9
|
|
|
|
6,070.8
|
|
Share capital
|
|
|
76,047.7
|
|
|
|
78,180.3
|
|
|
|
78,715.2
|
|
|
|
79,185.7
|
|
|
|
2,414.9
|
|
Non-controlling interests
|
|
|
3,505.7
|
|
|
|
4,128.4
|
|
|
|
8,209.9
|
|
|
|
11,492.5
|
|
|
|
350.5
|
|
Equity attributable to owners of the Company
|
|
|
106,314.7
|
|
|
|
121,615.6
|
|
|
|
147,481.5
|
|
|
|
154,713.8
|
|
|
|
4,718.3
|
|
Cash Flow Data:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Capital expenditures
|
|
|
(39,029.5
|
)
|
|
|
(29,142.7
|
)
|
|
|
(39,599.0
|
)
|
|
|
(30,280.1
|
)
|
|
|
(923.5
|
)
|
Depreciation and amortization
|
|
|
23,435.9
|
|
|
|
25,470.9
|
|
|
|
26,350.8
|
|
|
|
29,518.7
|
|
|
|
900.2
|
|
Net cash inflow from operating activities
|
|
|
33,038.0
|
|
|
|
41,296.0
|
|
|
|
45,863.5
|
|
|
|
57,548.3
|
|
|
|
1,755.1
|
|
Net cash outflow from investing activities
|
|
|
(43,817.8
|
)
|
|
|
(29,925.8
|
)
|
|
|
(38,817.9
|
)
|
|
|
(63,351.4
|
)
|
|
|
(1,932.0
|
)
|
Net cash inflow (outflow) from financing activities
|
|
|
8,455.8
|
|
|
|
12,794.9
|
|
|
|
(2,797.0
|
)
|
|
|
8,636.3
|
|
|
|
263.4
|
|
|
|
As of and for the Year Ended December 31,
|
IFRS
|
|
2012
|
|
2013
|
|
2014
|
|
2015
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
US$
|
|
|
(in millions, except earnings per share and per ADS data)
|
Segment Data:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Operating revenues:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
104,298.3
|
|
|
|
112,603.9
|
|
|
|
121,336.5
|
|
|
|
116,607.3
|
|
|
|
3,556.2
|
|
Testing
|
|
|
22,657.0
|
|
|
|
24,732.2
|
|
|
|
25,874.7
|
|
|
|
25,191.9
|
|
|
|
768.3
|
|
Electronic manufacturing services
|
|
|
62,747.7
|
|
|
|
78,530.6
|
|
|
|
105,784.4
|
|
|
|
138,242.1
|
|
|
|
4,216.0
|
|
Others
|
|
|
4,269.4
|
|
|
|
3,995.7
|
|
|
|
3,595.8
|
|
|
|
3,261.2
|
|
|
|
99.4
|
|
Gross profit:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
19,812.5
|
|
|
|
23,673.7
|
|
|
|
33,040.2
|
|
|
|
30,348.5
|
|
|
|
925.5
|
|
Testing
|
|
|
7,601.0
|
|
|
|
9,079.4
|
|
|
|
9,632.0
|
|
|
|
9,025.7
|
|
|
|
275.3
|
|
Electronic manufacturing services
|
|
|
7,241.3
|
|
|
|
8,054.3
|
|
|
|
9,118.9
|
|
|
|
9,433.4
|
|
|
|
287.7
|
|
Others
|
|
|
1,974.9
|
|
|
|
2,014.6
|
|
|
|
1,797.4
|
|
|
|
1,327.6
|
|
|
|
40.5
|
|
__________________
|
(1)
|
The denominators for diluted earnings per common share and diluted earnings per equivalent ADS are calculated to account for
the potential diluted factors, such as the exercise of options and conversion of our convertible bonds into our common shares.
|
|
(2)
|
Dividends per common share issued as a cash dividend, a stock dividend and distribution from capital surplus.
|
|
(3)
|
Represents the weighted average number of shares after retroactive adjustments to give effect to stock dividends. Common shares
held by consolidated subsidiaries are classified as “treasury stock,” and are deducted from the number of common shares
outstanding.
|
|
(4)
|
Including available-for-sale financial assets — non-current and investments accounted for using the equity method.
|
|
(5)
|
Including deferred tax assets, other financial assets — non-current and other non-current assets.
|
|
(6)
|
Including short-term bank loans and short-term bills
payable.
|
|
(7)
|
Including bonds payable, long-term borrowings (consisted of bank loans and bills payable) and capital lease obligations.
|
|
(8)
|
Including (x) current liabilities other than short-term
debts and current portion of long-term debts and (y) non-current liabilities other than long-term debts.
|
Exchange Rates
Fluctuations in the exchange rate between
NT dollars and U.S. dollars will affect the U.S. dollar equivalent of the NT dollar price of our common shares on the Taiwan Stock
Exchange and, as a result, will likely affect the market price of the ADSs. Fluctuations will also affect the U.S. dollar conversion
by the depositary under our ADS deposit agreement referred to below of cash dividends paid in NT dollars on, and the NT dollar
proceeds received by the depositary from any sale of, common shares represented by ADSs, in each case, according to the terms of
the deposit agreement dated September 29, 2000 and as amended and supplemented from time to time among us, Citibank N.A., as depositary,
and the holders and beneficial owners from time to time of the ADSs, which we refer to as the deposit agreement.
The following table sets forth, for the
periods indicated, information concerning the number of NT dollars for which one U.S. dollar could be exchanged. The exchange rates
reflect the exchange rates set forth in the H.10 statistical release of the Federal Reserve Board.
|
|
Exchange Rate
|
|
|
Average
(1)
|
|
High
|
|
Low
|
|
Period End
|
2011
|
|
|
29.42
|
|
|
|
30.67
|
|
|
|
28.50
|
|
|
|
30.27
|
|
2012
|
|
|
29.47
|
|
|
|
30.28
|
|
|
|
28.96
|
|
|
|
29.05
|
|
2013
|
|
|
29.73
|
|
|
|
30.20
|
|
|
|
28.93
|
|
|
|
29.83
|
|
2014
|
|
|
30.38
|
|
|
|
31.80
|
|
|
|
29.85
|
|
|
|
31.60
|
|
2015
|
|
|
31.80
|
|
|
|
33.17
|
|
|
|
30.37
|
|
|
|
32.79
|
|
October
|
|
|
32.44
|
|
|
|
32.81
|
|
|
|
31.92
|
|
|
|
32.46
|
|
November
|
|
|
32.61
|
|
|
|
32.87
|
|
|
|
32.43
|
|
|
|
32.53
|
|
December
|
|
|
32.79
|
|
|
|
33.01
|
|
|
|
32.53
|
|
|
|
32.79
|
|
2016
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
January
|
|
|
33.43
|
|
|
|
33.74
|
|
|
|
33.14
|
|
|
|
33.43
|
|
February
|
|
|
33.24
|
|
|
|
33.51
|
|
|
|
32.95
|
|
|
|
33.22
|
|
March
|
|
|
32.59
|
|
|
|
33.09
|
|
|
|
32.16
|
|
|
|
32.18
|
|
April (through April 22, 2016)
|
|
|
32.33
|
|
|
|
32.44
|
|
|
|
32.11
|
|
|
|
32.36
|
|
_________________
|
(1)
|
Annual averages were calculated by using the average of the exchange rates on the last day of each month during the relevant
year. Monthly averages were calculated by using the average of the daily rates during the relevant month.
|
On April 22, 2016, the exchange rate as
set forth in the H.10 weekly statistical release by the Federal Reserve Board was NT$32.36=US$1.00.
CAPITALIZATION
AND INDEBTEDNESS
Not applicable.
REASON
FOR THE OFFER AND USE OF PROCEEDS
Not applicable.
RISK
FACTORS
Risks Relating to Our Business
Since we are dependent on the highly
cyclical semiconductor and electronics industries and conditions in the markets for the end-use applications of our products, our
revenues and net income may fluctuate significantly.
Our business is affected by market conditions
in the highly cyclical semiconductor and electronics industries. Most of our customers operate in this industry, and variations
in order levels from our customers and service fee rates may result in volatility in our revenues and net income. From time to
time, the semiconductor and electronics industries have experienced significant, and sometimes prolonged, downturns. As our business
is, and will continue to be, dependent on the requirements for independent packaging, testing and electronic manufacturing services,
any future downturn in the industry would reduce demand for our services. For example, in the fourth quarter of 2008, the global
economic crisis resulted in a significant deterioration in demand for our customers’ products, which in turn affected demand
for our services and adversely affected our operating results. Although demand has recovered, we expect there to be continued downward
pressure on our average selling prices and continued volatility with respect to our sales volumes in the future. If we cannot reduce
our costs or adjust our product mix to sufficiently offset any decline in sales volumes, our profitability will suffer, and we
may incur losses.
Market conditions in the semiconductor
and electronics industries depend to a large degree on conditions in the markets for the end-use applications of various products,
such as communications, computing and consumer electronics products. Any deterioration of conditions in the markets for the end-use
applications would reduce demand for our services, and would likely have a material adverse effect on our financial condition and
results of operations. In 2015, approximately 54.7%, 11.1% and 34.2% of our operating revenues from packaging and testing were
attributed to the packaging and testing of semiconductors used in communications, computing and consumer electronics/industrial/automotive/other
applications, respectively. In the same year, approximately 53.2%, 14.3%, 18.7%, 8.1% and 4.9% of our operating revenues from electronic
manufacturing services were attributed to the communications, computing, consumer electronics applications, industrial and automotive
applications, respectively. Across end-use applications, our customers face intense competition and significant shifts in demand,
which could put pricing pressure on our services and may adversely affect our revenues and net income.
A reversal or slowdown in the outsourcing
trend for semiconductor packaging and testing services and electronic manufacturing services could adversely affect our growth
prospects and profitability.
Semiconductor manufacturers that have their
own in-house packaging and testing capabilities, known as integrated device manufacturers and original equipment manufacturers,
have increasingly outsourced stages of the production process, including packaging, testing, electronic manufacturing and assembly,
to independent companies in order to reduce costs, eliminate product complexity and meet fast-to-market requirements. In addition,
the availability of advanced independent semiconductor manufacturing services has also enabled the growth of so-called “fabless” semiconductor companies
that focus exclusively on design and marketing and outsource their manufacturing, packaging and testing requirements to independent
companies. We cannot assure you that these manufacturers and companies will continue to outsource their packaging, testing and
manufacturing requirements to third parties like us. Furthermore, during an economic downturn, these integrated device manufacturers
typically rely more on their own in-house packaging and testing capabilities, therefore decreasing their need to outsource. A reversal
of, or a slowdown in, this outsourcing trend could result in reduced demand for our services and adversely affect our growth prospects
and profitability.
Any global economic downturn could adversely
affect the demand for our products and services, and a protracted global economic crisis would have a material adverse effect on
us.
The global financial markets experienced
significant disruptions in 2008 and the United States, Europe and other economies went into recession. The recovery from the lows
of 2008 and 2009 was uneven and it is facing new challenges, including a European sovereign debt crisis that began in 2011 and
continuing high unemployment rates in much of the world. It is unclear what the long-term impact of the European sovereign debt
crisis will be and uncertainty remains over the long-term effects of the expansionary monetary and fiscal policies that have been
adopted by the central banks and financial authorities of some of the world’s leading economies. Any economic downturn or
crisis may cause our customers to do the following:
|
·
|
cancel or reduce planned expenditures for our products and services;
|
|
·
|
seek to lower their costs by renegotiating their contracts with us;
|
|
·
|
consolidate the number of suppliers they use, which may result in our loss of customers; and
|
|
·
|
switch to lower-priced products or services provided by our competitors.
|
Any uncertainty or significant volatility
in global economic conditions may also make it difficult for our customers to accurately forecast and plan future business activities
and may have a material adverse effect on us.
If we are unable to compete favorably
in the highly competitive markets of semiconductor packaging and testing and electronic manufacturing services, our revenues and
net income may decrease.
The markets of semiconductor packaging
and testing and electronic manufacturing services are very competitive. We face competition from a number of sources, including
other independent semiconductor packaging and testing companies, integrated device manufacturers, and other electronic manufacturing
services providers with large-scale manufacturing capabilities who can quickly react to market changes. We believe that the principal
competitive factors in our industry are:
|
·
|
technological expertise;
|
|
·
|
the ability to provide total solutions to our customers, including integrated design, manufacturing, packaging and testing
and electronic manufacturing services;
|
|
·
|
ability to offer interconnect technologies at an optimal scale for our businesses;
|
|
·
|
range of package types and testing platforms available;
|
|
·
|
the ability to work closely with our customers at the product development stage;
|
|
·
|
responsiveness and flexibility;
|
|
·
|
fast-to-market product development;
|
|
·
|
diversity in facility locations;
|
We face increasing competition, as most
of our customers obtain services from more than one source. Rapid technological advances and aggressive pricing strategies by our
competitors may continue to increase competition. Our ability to compete depends on factors both within and outside of our control
and may be constrained by the distinct characteristics and production requirements of individual products. We cannot assure you
that we will be able to continue to improve production efficiency and maintain reasonable profit for all of our products.
In addition, some of our competitors may
have superior financial, marketing, manufacturing, research and development and technological resources than we do. For example,
the central government of the PRC as well as provincial and municipal governments have provided various incentives to domestic
companies in the semiconductor industry, including major semiconductor testing and packaging providers such as Jiangsu Changjiang
Electronics Technology Co., Ltd. Similarly, our customers may face competition from their competitors in the PRC, and such competitors
may also receive significant subsidies from the PRC government. As we are downstream suppliers, the impact of such government policies
on competition and price pressure of our customers may negatively impact our own business. Increasing competition may lead to declines
in product prices and profitability and could have a material adverse effect on our business, financial condition, results of operations
and future prospects.
Our profitability depends on our ability
to respond to rapid technological changes in the semiconductor industry.
The semiconductor industry is characterized
by rapid increases in the diversity and complexity of semiconductors. As a result, we expect that we will need to constantly offer
more sophisticated packaging and testing technologies and processes in order to respond to competitive industry conditions and
customer requirements. We have successfully combined our packaging, testing and materials technologies with the expertise of electronic
manufacturing services at the systems level to develop our SiP business. Success of a new product depends on a number of factors
such as product acceptance by the market. New products are developed in anticipation of future demand. We cannot assure you that
the launch of any new product will be successful, or that we will be able to produce sufficient quantities of these products to
meet market demand. If we fail to develop, or obtain access to, advances in packaging or testing technologies or processes, we
may become less competitive and less profitable. In addition, advances in technology typically lead to declining average selling
prices for semiconductors packaged or tested with older technologies or processes. As a result, if we cannot reduce the costs associated
with our services, the profitability of a given service and our overall profitability may decrease over time.
Our operating results are subject to
significant fluctuations, which could adversely affect the market value of your investment.
Our operating results have varied significantly
from period to period and may continue to vary in the future. Downward fluctuations in our operating results may result in decreases
in the market price of our common shares and the ADSs. Among the more important factors affecting our quarterly and annual operating
results are the following:
|
·
|
changes in general economic and business conditions, particularly the cyclical nature of the semiconductor and electronics
industries and the markets served by our customers;
|
|
·
|
our ability to quickly adjust to unanticipated declines or shortfalls in demand and market prices;
|
|
·
|
changes in prices for our products or services;
|
|
·
|
volume of orders relative to our packaging, testing and manufacturing capacity;
|
|
·
|
changes in costs and availability of raw materials, equipment and labor;
|
|
·
|
our ability to obtain or develop substitute raw materials with lower cost;
|
|
·
|
our ability to successfully develop or market new products or services;
|
|
·
|
our ability to successfully manage product mix in response to changes in market demand and differences in margin associated
with different products;
|
|
·
|
timing of capital expenditures in anticipation of future orders;
|
|
·
|
our ability to acquire or design and produce cost-competitive interconnect materials, and provide integrated solutions for
electronic manufacturing services;
|
|
·
|
fluctuations in the exchange rate between the NT dollar or RMB and foreign currencies, especially the U.S. dollar; and
|
|
·
|
typhoons, earthquakes, drought, epidemics, tsunami and other natural disasters, as well as industrial and other incidents such
as fires and power outages.
|
Due to the factors listed above, our future
operating results or growth rates may be below the expectations of research analysts and investors. If so, the market price of
our common shares and the ADSs, and thus the market value of your investment, may fall.
Due to our high percentage of fixed costs,
we may be unable to maintain our gross margin at past levels if we are unable to achieve relatively high capacity utilization rates.
Our operations, in particular our testing
operations, are characterized by relatively high fixed costs. We expect to continue to incur substantial depreciation and other
expenses in connection with our acquisitions of equipment and facilities. Our profitability depends not only on the pricing levels
for our services or products, but also on utilization rates for our machinery and equipment, commonly referred to as “capacity
utilization rates.” In particular, increases or decreases in our capacity utilization rates can significantly affect gross
margins since the unit cost generally decreases as fixed costs are allocated over a larger number of units. In periods of low demand,
we experience relatively low capacity utilization rates in our operations, which leads to reduced margins. For example, in the
fourth quarter of 2008, we experienced lower than anticipated utilization rates in our operations due to a significant decline
in worldwide demand for our packaging and testing services, which resulted in reduced margins during that period. Although capacity
utilization rates have recovered since 2009, we cannot assure you that we will be able to maintain or surpass our past gross margin
levels if we cannot consistently achieve or maintain relatively high capacity utilization rates.
If we are unable to manage our expansion
or investments effectively, our growth prospects may be limited and our future profitability and core business operations may be
adversely affected.
We have significantly expanded our operations
through both organic growth and acquisitions in recent years. For example, we acquired the controlling interest of Universal Scientific
in 2010 to expand our product offering scope to electronic manufacturing services; we also entered into a joint venture agreement
with TDK Corporation in May 2015 to further expand our business in embedded substrates. We expect that we will continue to expand
our operations in the future. The purpose of our expansion is mainly to provide total solutions to existing customers or to attract
new customers and broaden our product range for a variety of end-use applications. However, rapid expansion may place a strain
on our managerial, technical, financial, operational and other resources. As a result of our expansion, we have implemented and
will continue to implement additional operational and financial controls and hire and train additional personnel. Any failure to
manage our growth effectively could lead to inefficiencies and redundancies and result in reduced growth prospects and profitability.
In addition, we have recently made investments
in real estate development businesses mostly in China. The PRC property market is volatile and may experience undersupply or oversupply
and property price fluctuations. The central and local governments frequently adjust monetary and other fiscal policies to prevent
and curtail the overheating of the economy. Such policies may lead to changes in market conditions, including price instability
and imbalance of supply and demand in respect of office, residential, retail, entertainment, cultural and intellectual properties.
We may continue to make investments in this area in the future and our diversification in this industry may put pressure on our
managerial, financial, operational and other resources. Our exposure to risks related to real estate development may also increase
over time as a result of our expansion into such a business. There can be no assurance that our investments in such a business
will yield the anticipated returns and that our expansion into such a business, including the resulting diversion
of management’s attention, will not adversely affect our core business operations.
We may not be successful in pursuing
mergers and acquisitions. Any mergers or acquisitions we make may lead to a diversion of management resources.
Our future success may depend on acquiring
businesses and technologies, making investments or forming joint ventures that complement, enhance or expand our current product
offerings or otherwise offer us growth opportunities. In pursuing such acquisitions, we may face competition from other companies
in the semiconductor industry. Our ability to acquire or invest in suitable targets may be limited by applicable laws and regulations
in Taiwan, the United States and other jurisdictions where we do business. Even if we are successful in making such acquisitions
or investments, we may have to expend substantial amounts of cash, incur debt, assume loss-making divisions and incur other types
of expenses. We may also face challenges in successfully integrating any acquired companies into our existing organization or in
creating the anticipated cost synergies. Each of these risks could have a material adverse effect on our business, financial condition
and results of operations.
The financial performance of our equity
method investments could adversely affect our results of operations.
As part of our business strategy, we have
and may continue to pursue acquisitions of businesses and assets, strategic alliances and joint ventures. We currently have equity
investments in certain entities and the accounting treatment applied for these investments varies depending on a number of factors,
including, but not limited to, our percentage ownership and the level of influence or control we have over the relevant entity. Any
losses experienced by these entities could adversely affect our results of operations and the value of our investment. In
addition, if these entities were to fail and cease operations, we may lose the entire value of our investment and the stream of
any shared profits.
For example, on September 22, 2015, upon
the expiration of the Initial SPIL Tender Offer period, we acquired 779,000,000 common shares (including those represented by American
depositary shares) of SPIL through the Initial SPIL Tender Offer. We subsequently acquired an additional 258,300,000 common shares
of SPIL (including those represented by American depositary shares) through open market purchases in March and April 2016. As of
April 28, 2016, we beneficially own 1,037,300,000 common shares of SPIL (calculated as the sum of 935,596,800 common shares of
SPIL and 101,703,200 common shares of SPIL underlying 20,340,640 American depositary shares of SPIL), representing 33.29% of the
issued and outstanding share capital of SPIL (calculated based on 3,116,361,139 common shares of SPIL (including those represented
by American depositary shares) outstanding as of March 31, 2016 as reported in SPIL’s annual report on Form 20-F for the
year ended December 31, 2015). See “Item 4. Information on the Company— History and Development of the Company—Acquisition
of Common Shares and American Depositary Shares of SPIL.” Although we are currently a 33.29% shareholder of SPIL, we currently
do not control SPIL and do not have the power to direct SPIL or its management. As the investment in SPIL is accounted for by the
equity method, to the extent that SPIL has net losses, our financial results will be adversely affected to the extent of our pro
rata portion of these losses. In addition, as we currently do not control SPIL and do not have the power to direct SPIL or its
management, we do not have access to SPIL’s books and records and may not be able to obtain SPIL’s financial information
on a timely basis. SPIL’s reporting time for its financial statements may affect our ability to timely report our own financial
statements or meet scheduled announcements for earnings releases.
There can be no assurance that we will
be able to maintain or enhance the value or performance of our investee companies, including SPIL, or that we will achieve the
returns or benefits sought from such investments. If our interests differ from those of other investors in our investee companies,
we may not be able to enjoy synergies with the investee and it may adversely affect our financial results or financial condition.
We may not be successful in our acquisition
of 100% of SPIL shares not otherwise owned by us.
On September 22, 2015, upon the expiration
of the Initial SPIL Tender Offer period, we acquired 779,000,000 common shares (including those represented by American depositary
shares) of SPIL through the Initial SPIL Tender Offer. In December 2015, following an announcement by SPIL that it plans to issue
1,033 million shares, if approved by SPIL shareholders, to a third party pursuant to a share placement agreement, we submitted
a written proposal to SPIL’s Board proposing to acquire all SPIL shares not otherwise owned by ASE, contingent upon the termination
of the share purchase agreement, and later launched the Second SPIL Tender Offer on December 29, 2015 to offer to purchase up to 770,000,000
common shares of SPIL (including those represented by American depositary shares). On March 17, 2016, we announced that the Second
SPIL Tender Offer was unsuccessful because the Taiwan Fair Trade Commission (the “TFTC”) did not render its decision
before the expiration of the Second SPIL Tender Offer. The TFTC subsequently suspended its review on March 23, 2016. Notwithstanding
the failure of the Second SPIL Tender Offer, we announced that we will continue to seek to obtain control of SPIL, with the purpose
of effecting an acquisition of 100% of the common shares and American depositary shares of SPIL not owned by us (“SPIL Merger”).
See “Item 4. Information on the Company— History and Development of the Company—Acquisition of Common Shares
and American Depositary Shares of SPIL.”
The successful consummation of the SPIL
Merger is subject to a number of factors, including, among other things, obtaining all necessary antitrust or other regulatory
approvals in Taiwan, the United States and other jurisdictions where we do business. In the event these conditions cannot be satisfied,
we may re-evaluate our interest in SPIL and may consider, among other legally permissible alternatives, to dispose our SPIL shares
at a loss, which may significantly affect our financial position. In addition, the interest we acquired in SPIL from the Initial
SPIL Tender Offer is currently being reviewed by the ROC court. See “Item 8. Financial Information—Consolidated Statements
and Other Financial Information—Legal Proceedings” for more information. If a dismissal is not granted or a settlement
is not reached, such a lawsuit could result in substantial costs to ASE and divert management’s attention and resources,
which may cause a material adverse effect on our results of operations, financial condition and business. We are also unable to
quantify the harm to our reputation should any adverse findings be made against us. If our interest in SPIL from the Initial Tender
Offer is voided by ROC courts, we may not realize the anticipated synergies, cost savings and benefits and growth opportunities
that would otherwise have resulted from our acquisition of 779,000,000 common shares of SPIL.
Notwithstanding the above, even if we are
successful in consummating the SPIL Merger, we may face challenges in successfully integrating SPIL into our existing organization
or in realizing anticipated benefits and cost synergies. Each of these risks could have a material adverse effect on our business
and operations, including our relationship with customers, suppliers, employees and other constituencies, or otherwise adversely
affect our financial condition and results of operations.
There may be risks associated with the
proposed holding company structure.
We announced in March 2016 that upon the
successful completion of the SPIL Merger, we plan to establish a holding company in Taiwan that will hold 100% of the equity interests
in both ASE and SPIL such that ASE and SPIL will be wholly owned subsidiaries of such holding company. The proposed holding company
will maintain all current operations of ASE and SPIL in Taiwan. The implementation of such corporate structure restructuring plan
may require approvals from relevant regulators and may result in unforeseen contingent risks, including increase in tax liabilities
or trading discounts relating to a holding company discount that may become apparent in the future.
The packaging and testing businesses
are capital intensive. If we cannot obtain additional capital when we need it, our growth prospects and future profitability may
be adversely affected.
The packaging and testing business is capital
intensive. We will need capital to fund the expansion of our facilities as well as fund our research and development activities
in order to remain competitive. We believe that our existing cash, marketable securities, expected cash flow from operations and
existing credit lines under our loan facilities will be sufficient to meet our capital expenditures, working capital, cash obligations
under our existing debt and lease arrangements, and other requirements for at least the next twelve months.
However,
future capacity expansions or market or other developments may cause us to require additional funds. Our ability to obtain external
financing in the future is subject to a variety of uncertainties, including:
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our future financial condition, results of operations and cash flows;
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general market conditions for financing activities by semiconductor or electronics companies; and
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economic, political and other conditions in Taiwan and elsewhere.
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If we are unable to obtain funding in a
timely manner or on acceptable terms, our results of operations and financial conditions may be materially and adversely affected.
Restrictive covenants and broad default
provisions in our existing debt agreements may materially restrict our operations as well as adversely affect our liquidity, financial
condition and results of operations.
We are a party to numerous loans and other
agreements relating to the incurrence of debt, many of which include restrictive covenants and broad default provisions. In general,
covenants in the agreements governing our existing debt, and debt we may incur in the future, may materially restrict our operations,
including our ability to incur debt, pay dividends, make certain investments and payments, other than in connection with restructurings
of consolidated entities, and encumber or dispose of assets. In addition, any global economic deterioration or ineffective expansion
may cause us to incur significant net losses or force us to assume considerable liabilities. We cannot assure you that we will
be able to remain in compliance with our financial covenants, which, as a result, may lead to a default. This may thereby restrict
our ability to access unutilized credit facilities or the global capital markets to meet our liquidity needs. Furthermore, a default
under one agreement by us or one of our subsidiaries may also trigger cross-defaults under our other agreements. In the event of
default, we may not be able to cure the default or obtain a waiver on a timely basis. An event of default under any agreement timely
governing our existing or future debt, if not cured or waived, could have a material adverse effect on our liquidity, financial
condition and results of operations.
We have on occasion failed to comply with
certain financial covenants in some of our loan agreements. Such non-compliance may also have, through broadly worded cross-default
provisions, resulted in default under some of the agreements governing our other existing debt. For example, we failed to comply
with certain financial covenants in some of our loan agreements as a result of our acquisition of the controlling interest of Universal
Scientific in February 2010, for which we have timely obtained waivers from our counterparties. If we are unable to timely remedy
any of our non-compliance under such loan agreements or obtain applicable waivers or amendments, we would breach our financial
covenants and our financial condition would be adversely affected. As of December 31, 2015, we were not in breach of any of the
financial covenants under our existing loan agreements, although we cannot provide any assurance that we will not breach any of
such financial covenants in the future.
We depend on select personnel and could
be affected by the loss of their services.
We depend on the continued service of our
executive officers and skilled technical personnel. Our business could suffer if we lose the services of any of these personnel
and cannot adequately replace them. Although some of these management personnel have entered into employment agreements with us,
they may nevertheless leave before the expiration of these agreements. We are not insured against the loss of the services of any
of our personnel. In addition, these proceedings may divert these and other employees’ attention from our business operations.
In addition, we may be required to increase
substantially the number of these employees in connection with our expansion plans, and there is intense competition for their
services in this industry. We may not be able to either retain our present personnel or attract additional qualified personnel
as and when needed. In addition, we may need to increase employee compensation levels in order to attract and retain our existing
officers and employees and the additional personnel that we expect to require. Furthermore, a portion of the workforce at our facilities
in Taiwan are foreign workers employed by us under work permits, which are subject to government regulations on renewal and other
terms. Consequently, our business could also suffer if the Taiwan regulations relating to the employment of foreign workers were
to become significantly more restrictive or if we are otherwise unable to attract or retain these workers at a reasonable cost.
If we are unable to obtain additional
packaging and testing equipment or facilities in a timely manner and at a reasonable cost, our competitiveness and future profitability
may be adversely affected.
The semiconductor packaging and testing
businesses are capital intensive and require significant investment in expensive equipment manufactured by a limited number of
suppliers. The market for semiconductor packaging and testing equipment is characterized, from time to time, by intense demand,
limited supply and long delivery cycles. Our operations and expansion plans depend on our ability to obtain a significant amount
of such equipment from a limited number of suppliers. From time to time we have also leased certain equipment. We have no binding
supply agreements with any of our suppliers and acquire our packaging and testing equipment on a purchase order basis, which exposes
us to changing market conditions and other substantial risks. For example, shortages of capital equipment could result in an increase
in the price of equipment and longer delivery times. Semiconductor packaging and testing also require us to operate sizeable facilities.
If we are unable to obtain equipment or facilities in a timely manner, we may be unable to fulfill our customers’ orders,
which could adversely affect our growth prospects as well as financial condition and results of
operations. See “Item 4. Information on the Company—Business Overview—Equipment.”
Fluctuations in exchange rates could
result in foreign exchange losses.
Currently, the majority of our revenues
are denominated in U.S. dollars, with a portion denominated in NT dollars and Japanese yen. Our operating costs and operating
expenses, on the other hand, are incurred in several currencies, primarily NT dollars, U.S. dollars, RMB, Japanese yen, Korean
won, as well as, to a lesser extent, Singapore dollars and Malaysian ringgit.
In addition, a substantial portion
of our capital expenditures, primarily for the purchase of packaging and testing equipment, has been, and is expected to continue
to be, denominated in U.S. dollars, with the remainder in Japanese yen. Fluctuations in exchange rates, primarily among the
U.S. dollar against the NT dollar, the Japanese yen and RMB, will affect our costs and operating margins. In addition, these fluctuations
could result in exchange losses and increased costs in NT dollar and other local currency terms. Despite hedging and mitigating
techniques implemented by us, fluctuations in exchange rates have affected, and may continue to affect, our financial condition
and results of operations. We recognized net foreign exchange losses of NT$276.2 million, NT$1,222.0 million and NT$713.2 million
(US$21.8 million) in 2013, 2014 and 2015, respectively. We cannot assure you that we will achieve foreign exchange gains in the
future. See “Item 11. Quantitative and Qualitative Disclosures about Market Risk—Market Risk—Foreign Currency
Exchange Rate Risk.”
The loss of a large customer or disruption
of our strategic alliance or other commercial arrangements with semiconductor foundries and providers of other complementary semiconductor
manufacturing services may result in a decline in our revenues and profitability.
Although we have a large customer base,
we have derived and expect to continue to derive a large portion of our revenues from a small group of customers during any particular
period due in part to the concentration of market share in the semiconductor and electronics industries. Our five largest customers
together accounted for approximately 37.2%, 40.3% and 48.2% of our operating revenues in 2013, 2014 and 2015, respectively. One
customer accounted for more than 10.0% of our operating revenues in 2013, 2014 and 2015. The demand for our services from a customer
is directly dependent upon that customer’s level of business activity, which could vary significantly from year to year.
Our key customers typically operate in the cyclical semiconductor and electronic business and, in the past, have varied, and may
vary in the future, order levels significantly from period to period. Some of these companies are relatively small, have limited
operating histories and financial resources, and are highly exposed to the cyclicality of the industry. We cannot assure you that
these customers or any other customers will continue to place orders with us in the future at the same levels as in past periods.
The loss of one or more of our significant customers, or reduced orders by any one of them, and our inability to replace these
customers or make up for such orders, could adversely affect our revenues and profitability. In addition, we have in the past reduced,
and may in the future be requested to reduce, our prices to limit the level of order cancellations. Any price reduction would likely
reduce our margins and profitability.
Since 1997, we have maintained a strategic
alliance with Taiwan Semiconductor Manufacturing Company Limited, or TSMC, one of the world’s largest dedicated semiconductor
foundries. TSMC designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured
by TSMC.
In addition, we entered into a joint venture agreement with TDK Corporation in May 2015 to further expand
our business in embedded substrates. Such strategic alliances, as well as our other commercial arrangements with providers of other
complementary semiconductor manufacturing services, enable us to offer total semiconductor manufacturing solutions to our customers.
These strategic alliances and other commercial arrangements may not achieve their anticipated commercial benefits and may be terminated
at any time. Any failure in successfully maintaining such alliances, any termination of such alliances or our failure to enter
into substantially similar strategic alliances or commercial arrangements may adversely affect our competitiveness and our revenues
and profitability.
We rely on a limited number of key customers
in certain products for our revenues, and our results of operations may be adversely affected by a reduction of business from our
key customers.
Our results of operations also depends
on the performance and business of our key customers. Accordingly, risks that could seriously harm our key customers could harm
us as well, including:
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loss of market share for our key customers’
products;
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recession in our key customers’ markets;
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failure of their products to gain wide-spread commercial
acceptance; and
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our key customers’ inability to manage their
operations efficiently and effectively.
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The launch and market acceptance of our
individual key customers’ products could significantly impact our product and customer mix, resulting in significant volatility
in the demand for the solutions we offer and our results of operations. It is also possible that a key customer’s market
share with respect to its product may decline as its competitors introduce new products, which could adversely affect our results
of operations, particularly if we are unable to sell our solutions to such competitors. Furthermore, sales of our key customers’
products are subject to seasonal fluctuation.
Our revenues and profitability may decline
if we are unable to obtain adequate supplies of raw materials in a timely manner and at a reasonable price.
Our operations, such as packaging operations,
substrate operations and electronic manufacturing services, require that we obtain adequate supplies of raw materials on a timely
basis. Shortages in the supply of raw materials have in the past resulted in occasional price increases and delivery delays. In
addition, the operations of some of our suppliers are vulnerable to natural disasters, such as earthquakes and typhoons, the occurrences
of which may deteriorate and prolong the shortage or increase the uncertainty of the supply of raw materials. For example, on March
11, 2011, a major earthquake occurred off the coast of Japan resulting in a large tsunami and radiation leak at the Fukushima nuclear
power plant. We experienced a disruption to the supply of raw materials from Japan for about three to four weeks due to the fear
of radiation contamination and the reduction or postponement in production by some of our Japanese suppliers.
Although
the purchase of supplies from Japan has been restored to the previous level, we cannot assure you that we will not suffer long-term
from the impact of the earthquake and the tsunami. In addition, further earthquakes, aftershocks thereof or other disasters in
Japan or other regions in which we operate may cause a decline in our sales. Any of the above events or developments may have a
material adverse effect on our business, results of operations and financial condition.
Raw materials such as IC substrates are
prone to supply shortages since such materials are produced by a limited number of suppliers such as Nanya Printed Circuit Board
Corporation, LG Innotek Co., Ltd., Kinsus Interconnect Technology Corporation and Unimicron Technology Corp. Our operations conducted
through our wholly owned subsidiaries ASE Electronics and ASE Shanghai have improved our ability to obtain IC substrates on a timely
basis and at a reasonable cost. In 2015, our interconnect materials operations supplied approximately 27.2% of our consolidated
substrate requirements by value.
We do not expect that our internal interconnect materials operations will be able
to meet all of our interconnect materials requirements. Consequently, we will remain dependent on market supply and demand for
our raw materials. In addition, recent fluctuations in prices of precious metals, such as gold, have also affected the price at
which we have been able to purchase the principal raw materials we use in our packaging processes. We cannot guarantee that we
will not experience shortages in the near future or that we will be able to obtain adequate supplies of raw materials in a timely
manner or at a reasonable price. Our revenues and net income could decline if we are unable to obtain adequate supplies of high
quality raw materials in a timely manner or if there are significant increases in the costs of raw materials that we cannot pass
on to our customers.
Regulations related to conflict minerals
could adversely affect our business, financial condition and results of operations.
The Dodd-Frank Wall Street Reform and Consumer
Protection Act contains provisions to improve transparency and accountability concerning the supply of certain minerals, known
as conflict minerals, which are defined as cassiterite, columbite-tantalite, gold, wolframite or their derivatives and other minerals
determined by the U.S. government to be financing conflict in the Democratic Republic of Congo and adjoining countries. As a result,
in August 2012 the SEC adopted annual disclosure and reporting requirements for those companies who use conflict minerals in their
products. These rules require companies that manufacture or contract to manufacture products for which conflict minerals are necessary
to the functionality or production to begin scrutinizing the origin of conflict minerals in their products starting from January
1, 2013, and file a new form, Form SD, containing the conflict minerals disclosure by May 31 for the prior calendar year, beginning
May 31, 2014. We filed a specialized disclosure report on Form SD for the years
ended December 31, 2013 and 2014 on May 30, 2014 and June 1, 2015, respectively. Pursuant to the SEC rules governing conflict minerals
disclosures, we have engaged an independent auditing firm to conduct audits on our due diligence framework to provide a private
sector report for our specialized disclosure report on Form SD for the years ended December 31, 2014 and 2015. As a result, there
will be costs associated with complying with these disclosure requirements, including costs for diligence to determine the sources
of conflict minerals used in our products and other potential changes to products, processes or sources of supply as a consequence
of such verification activities. The implementation of these rules could adversely affect the sourcing, supply and pricing of materials
used in our products. As there may be only a limited number of suppliers offering “conflict free” minerals, we cannot
be sure that we will be able to obtain necessary “conflict free” minerals from such suppliers in sufficient quantities
or at competitive prices. Also, we may face adverse effects to our reputation if we determine that certain of our products contain
minerals not determined to be conflict free or if we are unable to sufficiently verify the origins for all conflict minerals used
in our products through the procedures we may implement.
System security risks, data protection
breaches or unexpected system outage or failures could harm our business, financial condition and results of operations.
We rely on the efficient and uninterrupted
operation of complex information technology applications, systems and networks to operate our business. Our systems are vulnerable
to damage or interruption from earthquakes, terrorist attacks, floods, fires, power loss, telecommunications failures, cyber-attacks,
computer viruses, computer denial of service attacks or other attempts to harm our system, and similar events.
In recent years, the risks that we face from cyber-attacks have increased significantly. Some of these attacks may originate
from well-organized, highly skilled organizations. Although there have not been reported major cyber-attacks against our systems
in the recent years, any such attack or system or network disruption could result in a loss of our intellectual property, the release
of commercially sensitive information, customer or employee personal data. Failures to protect the privacy of customer and employee
confidential data against breaches of network security could result in damage to our reputation.
Furthermore, some of our data centers are
located in areas with a high risk of major earthquakes. Our data centers are also subject to break-ins, sabotage and intentional
acts of vandalism, and to potential disruptions if the operators of these facilities have financial difficulties. Some of our systems
are not fully redundant, and our disaster recovery planning cannot account for all eventualities. The occurrence of a natural disaster,
a decision to close a facility we are using without adequate notice for financial reasons or other unanticipated problems at our
data centers could result in loss of production capabilities and lengthy interruptions in our service. Any damage to or failure
of our systems could result in interruptions in our service. Interruptions in our service could materially and adversely affect
our business, financial condition and results of operations.
Any environmental claims or failure to
comply with any present or future environmental regulations, as well as any fire or other industrial accident, may require us to
spend additional funds and may materially and adversely affect our financial condition and results of operations.
We are subject to various laws and regulations
relating to the use, storage, discharge and disposal of chemical by-products of, and water used in, our packaging and interconnect
materials production processes, and the emission of volatile organic compounds and the discharge and disposal of solid industrial
wastes from electronic manufacturing services operations. In the recent years, we have been subject to environmental administrative
actions and judicial proceedings related to certain wastewater discharge incidents that occurred at our facilities. As a result
of these proceedings, we have been subject to monetary fines as well as sanctions, including orders to suspend or limit our operations
and criminal charges against us.
In December 2013, the Kaohsiung City Environmental
Protection Bureau ordered us to suspend the operations at our K7 Plant’s wafer-level process where nickel was used for alleged
wastewater discharge violations and imposed a NT$110.1 million fine against us. The NT$110.1 million fine was later reduced to
NT$109.4 million as ordered by the Kaohsiung City Environmental Protection Bureau. In December 2014, the Kaohsiung City Environmental
Protection Bureau lifted the suspension order and approved the full resumption of operations of our K7 Plant after ordering a series
of examinations, hearings and trial runs. In September 2015, the fine was further reduced to NT$102.0 million (US$3.1 million)
by the Kaohsiung City Environmental Protection Bureau and we received a refund of NT$7.3 million (US$0.2 million) in October 2015.
Although our K7 Plant has resumed full operation, we may be subject to other new
environmental claims, charges or investigations on our K7 Plant or other facilities that may cause similar or more sever interruptions
to our business and operations.
With respect to the NT$102.0 million (US$3.1
million) administrative penalty imposed on us by the Kaohsiung City Environmental Protection Bureau, we appealed to the Kaohsiung
High Administrative Court in August 2014 seeking to (i) revoke Kaohsiung City Government’s decision, (ii) lift the administrative
penalty imposed on us and (iii) demand a refund of the administrative penalty. On March 22, 2016, the Kaohsiung High Administrative
Court revoked Kaohsiung City Government’s decision and lifted the administrative penalty. Our demand for a refund of the
fine was dismissed. We appealed to the Supreme Administrative Court on April 14, 2016 against the Kaohsiung High Administrative
Court’s unfavorable ruling in dismissing a refund. The outcome of the proceeding cannot be predicted with certainty.
In connection with the same alleged violations
at our K7 plant, in October 2014, the Kaohsiung District Court ruled that we were in violation of the ROC Waste Disposal Act and
imposed on us a criminal penalty of NT$3.0 million. We appealed the case to the Taiwan High Court Kaohsiung District Branch in
November 2014. In September 2015, the Taiwan High Court Kaohsiung District Branch overturned the decision made by Kaohsiung District
Court and found the Company not guilty and repealed the criminal penalty imposed on the Company. The verdict was final and not
appealable. For additional details of these administrative actions and judicial proceedings related to our K7 Plant see “Item
4. Information on the Company—Business Overview—Environmental Matters,” “Item 4. Information on the Company—Property,
Plants and Equipment” and “Item 8. Financial Information—Consolidated Statements and Other Financial Information—Legal
Proceedings.” Defending against any of these pending or future actions will likely be costly and time-consuming and could
significantly divert management’s efforts and resources. Any penalties, fines, damages or settlements made in connection
with any criminal, civil, and/or administrative investigations and/or lawsuits may have a material adverse effect on our business,
results of operations and future prospects.
We have made, and expect to continue to
make, expenditures to maintain strict compliance with such environmental laws and regulations. For example, in order to demonstrate
our commitment to environmental protection, in December 2013, our board of directors approved contributions to environmental protection
efforts in Taiwan in a total amount of not less than NT$3,000.0 million, to be made in the next 30 years. For the years ended December
31, 2014 and 2015, we have made contributions in the amount of NT$100.0 million (US$3.0 million) each, respectively, through ASE Cultural
and Educational Foundation to fund various environmental projects and our board of directors have resolved in a resolution in January
2016 to contribute NT$100.0 million (US$3.0 million) through ASE Cultural and Educational Foundation in environmental projects
in 2016. The costs of current and future compliance with environmental laws and regulations could require us to acquire costly
equipment or to incur other significant expenses that may have a material adverse effect on our financial condition and results
of operations.
Negative publicity may adversely affect
our brand and reputation, which may result in a material adverse impact on our business, results of operations and prospects and
cause fluctuations in the price of our common shares and ADSs.
Any negative publicity may damage our brand
and reputation, harm our ability to attract and retain customers and result in a material adverse impact on our results of operations
and prospects as well as cause fluctuations in the trading price of our common shares and ADSs. In addition, any change in policy
or directions in which we carry out our corporate social responsibility or corporate sustainability activities may also have an
adverse effect on our reputation. Furthermore, in recent years, we have experienced and may continue to experience negative publicity
in connection with administrative penalties and criminal charges related to alleged violations of environmental regulations and
laws. For further details, see “—Any environmental claims or failure to comply with any present or future environmental
regulations, as well as any fire or other industrial accident, may require us to spend additional funds and may materially and
adversely affect our financial condition and results of operations,” “Item 4. Information on the Company—Business
Overview—Environmental Matters,” “Item 4. Information on the Company—Property, Plants and Equipment”
and “Item 8. Financial Information—Consolidated Statements and Other Financial Information—Legal Proceedings.”
Climate change, other environmental concerns
and green initiatives also presents other commercial challenges, economic risks and physical risks that could harm our results
of operations or affect the manner in which we conduct our business.
Increasing climate change and environmental
concerns could affect the results of our operations if any of our customers request that we exceed any standards set for environmentally
compliant products and services, or if raw materials and/or products are required to meet strict inspection standards with respect
to any radioactive contamination as a result of concerns arising from radiation leaking incidents, such as the radiation leak,
which occurred in March 2011 in Japan. If we are unable to offer such products or offer products that are compliant, but are not
as reliable due to the lack of reasonably available alternative technologies, it may harm our results of operations.
Furthermore, energy costs in general could
increase significantly due to climate change regulations. Therefore, our energy costs may increase substantially if utility or
power companies pass on their costs, fully or partially, such as those associated with carbon taxes, emission cap and carbon credit
trading programs.
We may be subject to intellectual property
rights disputes, which could materially adversely affect our business.
Our ability to compete successfully and
achieve future growth depends, in part, on our ability to develop and protect our proprietary technologies and to secure on commercially
acceptable terms certain technologies that we do not own. We cannot assure you that we will be able to independently develop, obtain
patents for, protect or secure from any third party, the technologies required.
Our ability to compete successfully also
depends, in part, on our ability to operate without infringing the proprietary rights of others. In particular, the semiconductor
and electronics industries are characterized by frequent litigation regarding patent and other intellectual property rights. In
February 2006, Tessera filed a suit against us and others alleging patent infringement. In February 2014, ASE Inc. and our U.S.
subsidiary, ASE (U.S.) Inc. reached a term sheet agreement with Tessera to fully resolve the remaining legal proceedings between
each other, under which we would pay a total of US$30.0 million to Tessera (which was fully recognized by us in the fourth
quarter of 2013) and both Tessera and we would dismiss all pending claims against each other. The final settlement agreement was
entered into among the parties in October 2014 and the final settlement amount was reduced to US$27.0 million. In October 2014,
the United States District Court for the Northern District of California dismissed all claims between Tessera and us. We have fully
paid the settlement amount in January 2015 and reversed the settlement amount of US$3.0 million in the fourth quarter of 2014.
Any litigation, whether as plaintiff or
defendant and regardless of the outcome, is costly and diverts company resources. Any of the foregoing could harm our competitive
position and render us unable to provide some of our services operations.
Our major shareholders may take actions
that are not in, or may conflict with, our public shareholders’ best interest.
Members of the Chang family own, directly
or indirectly, a significant interest in our outstanding common shares. See “Item 7. Major Shareholders and Related Party
Transactions—Major Shareholders.” Accordingly, these shareholders will continue to have the ability to exercise a significant
influence over our business, including matters relating to:
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our management and policies;
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the timing and distribution of dividends; and
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the election of our directors.
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Members of the Chang family may take actions
that you may not agree with or that are not in our or our public shareholders’ best interests.
We are an ROC company and, because the
rights of shareholders under ROC law differ from those under U.S. law and the laws of certain other countries, you may have
difficulty protecting your shareholder rights.
Our corporate affairs are governed by our
Articles of Incorporation and by the laws governing corporations incorporated in the ROC. The rights of shareholders and the responsibilities
of management and the members of the board of directors under ROC law are different from those applicable to a corporation incorporated
in the United States and certain other countries. As a result, public shareholders of ROC companies may have more difficulty in
protecting their interests in connection with actions taken by management or members of the board of directors than they would
as public shareholders of a corporation in the United States or certain other countries.
We have made investments in, and are
exploring the possibility of expanding our businesses and operations to, or making additional investments in, the PRC, which may
expose us to additional political, regulatory, economic and foreign investment risks.
We currently maintain packaging and testing
facilities and electronic manufacturing services sites in the PRC. We also made substantial investments in PRC real estate development
through our subsidiaries in the PRC. Under PRC laws and regulations, foreign investment projects, such as our subsidiaries, must
obtain certain approvals from the relevant governmental authorities in the provinces or special economic zones in which they are
located and, in some circumstances, from the relevant authorities in the PRC’s central government. Foreign investment projects
must also comply with certain regulatory requirements. However, PRC laws and regulations are often subject to varying interpretations
and means of enforcement, and additional approvals from the relevant governmental authorities may be required for the operations
of our PRC subsidiaries. If required, we cannot assure you that we will be able to obtain these approvals in a timely manner, if
at all. Because the PRC government holds significant discretion in determining matters relating to foreign investment, we cannot
assure you that the relevant governmental authorities will not take action that is materially adverse to our PRC operations.
In addition, the PRC stock market is subject
to extreme price and volume fluctuations. We are the controlling shareholder of Universal Scientific Shanghai, which is an entity
currently listed on the Shanghai Stock Exchange. The PRC securities markets have recently experienced, and may experience in the
future, significant price declines and volatility. Any volatility may have a significant effect on Universal Scientific Shanghai’s
share price and may indirectly affect the market price of our common shares and ADSs.
Our global manufacturing and sales activities
subject us to risks associated with legal, political, economic or other conditions or developments in various jurisdictions, including
in particular the ROC and the PRC, which could negatively affect our business and financial status and therefore the market value
of your investment.
Our principal executive office and our
principal production facilities are located in the ROC, and a substantial majority of our net revenues are derived from our operations
in the ROC and the PRC. In addition, we have operations worldwide and a significant percentage of our revenue comes from sales
to locations outside the ROC or the PRC. Operating in the ROC, PRC and other overseas locations exposes us to changes in policies
and laws, as well as the general political and economic conditions, security risks, health conditions and possible disruptions
in transportation networks, in the various countries in which we operate, which could result in an adverse effect on our business
operations in such countries. If any of our global operations are affected by the legal, political, economic or other conditions
in the jurisdiction we operate, our results of operations as well as market price and the liquidity of our ADSs and common shares
may be materially and adversely affected.
Any impairment charges may have a material
adverse effect on our net income.
Under IFRS, we are required to evaluate
our assets, such as equipment, goodwill and investments, for possible impairment at least annually or whenever there is an indication
of impairment. If certain criteria are met, we are required to record an impairment charge.
With respect to assets, we recognized
impairment charges of NT$691.9 million, NT$308.1 million and NT$258.1 million (US$7.9 million) in 2013, 2014 and 2015,
respectively, primarily as a result of an impairment charge related to buildings and improvement, and impaired equipment and
investment. See “Item 5. Operating and Financial Review and Prospects—Operating Results and Trend
Information—Critical Accounting Policies and Estimates—Impairment of Tangible and Intangible Assets Other Than
Goodwill,” “Item 5. Operating and Financial Review and Prospects—Operating Results and Trend
Information—Critical Accounting Policies and Estimates— Valuation of Investments” and “Item
5. Operating and Financial Review and Prospects—Operating Results and Trend Information—Critical Accounting Policies
and Estimates—Goodwill.”
We are unable to estimate the extent and
timing of any impairment charges for future years and we cannot give any assurance that impairment charges will not be required
in periods subsequent to December 31, 2015. Any impairment charge could have a material adverse effect on our net income. The determination
of an impairment charge at any given time is based significantly on our expected results of operations over a number of years in
the future. As a result, an impairment charge is more likely to occur during a period in which our operating results and outlook
are otherwise already depressed.
Our adoption of new financial reporting
standards, effective January 1, 2013, may have material impact on our financial statements thereafter.
We have historically presented our consolidated
financial statements for and prior to the year ended December 31, 2012 in accordance with ROC GAAP for purposes of our filings
with the Taiwan Stock Exchange, with reconciliation to U.S. GAAP for certain filings with the SEC. According to the announcement
of the FSC, on May 14, 2009, effective January 1, 2013, companies listed on the Taiwan Stock Exchange, including us, must report
their financial statements in accordance with the Taiwan-IFRS. Accordingly, we have adopted Taiwan-IFRS in the ROC for our interim
quarterly earnings releases beginning in the first quarter of 2013 and our annual consolidated financial statements beginning in
2013. While we have adopted Taiwan-IFRS for ROC reporting purposes, we have also adopted and will continue to adopt IFRS, which
differs from Taiwan-IFRS, for certain filings with the SEC, including this annual report and future reports on Form 20-F. Following
our adoption of IFRS for SEC filing purposes, we will no longer be required to reconcile net income and balance sheet differences
under our consolidated financial statements with U.S. GAAP.
Taiwan-IFRS differs from IFRS in certain
respects, including, but not limited to the extent that any new or amended standards or interpretations applicable under IFRS may
not be timely endorsed by the FSC. Because of the differences in accounting treatments, the adoption of Taiwan-IFRS and IFRS may
have material impact on our results of operations and financial condition in our reported financial statements going forward.
Provisions of our outstanding convertible
bonds could discourage an acquisition of us by a third party.
In September 2013, we completed an offering
of US$400.0 million in aggregate principal amount of convertible bonds due 2018 (“2018 Convertible Bonds”), and in
July 2015, we completed an offering of US$200.0 million in aggregate principle amount of NTD-linked convertible bonds due 2018
(“2018 NTD-linked Convertible Bonds”). Certain provisions of our convertible bonds could make it more difficult or
more expensive for a third party to acquire us. In the event that (1) our common shares cease to be listed on the Taiwan Stock
Exchange; (2) any person or persons acting together acquire control of us if such person or persons do not have, and would not
be deemed to have, control of us as of a specified date; (3) we consolidate with or merge into or sell or transfer all or substantially
all of our assets to any other person, unless the consolidation, merger, sale or transfer will not result in the other person or
persons acquiring control over us or the successor entity; or (4) one or more other persons acquire the legal or beneficial ownership
of all or substantially all of our capital stock, holders of these bonds shall have the right to require us to repurchase all or
any portion of the principal amount thereof (which is US$200,000 or any integral multiples thereof) of such holder’s bonds.
“Control” means the right to appoint and/or remove all or the majority of the members of our board of directors or
other governing body, whether obtained directly or indirectly, and whether obtained by ownership of share capital, the possession
of voting rights, contract or otherwise. However, a “change of control” will not be deemed to have occurred (i) solely
as a result of the issuance or transfer, with the Company’s corporation, of any preferred shares in the Company’s capital
or (ii) if the closing price per common share for any five trading days within the period of 10 consecutive trading days ending
immediately after the later of the change of control or the public announcement of the change of control equals or exceeds 110%
of the conversion price in effect on each of those five trading days.
The accounting treatment for our outstanding
convertible bonds, including the treatment for conversion option, redemption option and put option embedded in our outstanding
convertible bonds, could have a material effect on our reported financial results.
In September 2013, we completed the offering
of the 2018 Convertible Bonds. Since the 2018 Convertible Bonds are denominated in U.S. dollars, which is different from our functional
currency under IFRS, we separated the conversion option, redemption option and
put option embedded in 2018 Convertible Bonds (collectively, the “Bond Options”) and recognized them as a freestanding
derivative at fair value through profit or loss. To determine the fair value of the Bond Options of the 2018 Convertible Bonds,
we are subject to a mark-to-market accounting on the Bond Options embedded in the 2018 Convertible Bonds. As a result, if the fair
value of our common shares rises, mark to market of the Bond Options would lead to losses in our financial statements. For each
reporting period over the term of the convertible bonds, a gain (or loss) will be reported in our consolidated statement of comprehensive
income to the extent the fair value of the Bond Options changes from the previous period. Changes in fair value of the Bond Options
generated a loss for NT$75.0 million, NT$777.6 million and NT$112.0 million (US$3.4 million) in 2013, 2014 and 2015, respectively.
See note 18 to our audited consolidated financial statements included in this annual report.
Any failure to achieve and maintain effective
internal controls could have a material adverse effect on our business and results of operations.
We are subject to reporting obligations
under the U.S. securities laws. The SEC as required by Section 404 of the Sarbanes-Oxley Act of 2002 adopted rules requiring every
public company to include a management report on the effectiveness of such company’s internal control over financial reporting
in its annual report. In addition, an independent registered public accounting firm must report on such company’s internal
control over financial reporting.
Our management concluded that our internal
control over financial reporting was effective as of December 31, 2015 and our independent registered public accounting firm has
issued an attestation report concluding that our internal control over financial reporting was effective in all material aspects.
As effective internal control over financial reporting is necessary for us to produce reliable financial reports and is important
to help prevent fraud, any failure to maintain effective internal control over financial reporting could harm our business and
result in a loss of investor confidence in the reliability of our financial statements, which in turn could negatively impact the
trading price of our common shares and ADSs. Furthermore, we may need to incur additional costs and use additional management and
other resources in an effort to comply with Section 404 of the Sarbanes-Oxley Act and other requirements going forward.
We could potentially face tax uncertainties
arising from the decisions, activities, and operations undertaken by us.
There are many business activities
that may give rise to tax issues in our daily operations, ranging from procurement, research and development activities,
manufacturing to product storage and distribution, among other activities. Additional tax liabilities such as double
taxation, inapplicability of tax incentives, tax adjustment and related interest and penalties may arise if all these tax
issues are not dealt with properly. The development and evolution of tax laws and regulations present considerable
uncertainties in interpretation and enforcement, which could call for more onerous compliance measures and tax audits in the
jurisdictions in which we operate. Failure to comply with any change in tax laws could result in unfavorable tax consequences
to us and have an adverse impact on our business, financial condition and results of operations.
Risks Relating to Taiwan, ROC
Strained relations between the ROC and
the PRC and disruptions in Taiwan’s political environment caused by domestic political events could negatively affect our
business and the market value of your investment.
Our principal executive offices and our
principal facilities are located in Taiwan and approximately 48.5%, 52.1% and 46.9% of our operating revenues in 2013, 2014 and
2015, respectively, were derived from our operations in Taiwan. Accordingly, our business and financial condition may be affected
by changes in local governmental policies and political and social instability.
The ROC has a unique international political
status. The government of the PRC asserts sovereignty over all of China, including Taiwan, and does not recognize the legitimacy
of the ROC government. Although significant economic and cultural relations have been established in recent years between the ROC
and the PRC, relations have often been strained. Any major change in the Taiwanese political environment, including the outcome
of presidential or municipal elections, or potential shifts in government policy, may affect the direction of economic and political
developments and negatively impact the economic and political environment in Taiwan. Past developments related to the interaction
between the ROC and the PRC, domestic political events or election results have on occasion depressed the market prices of the securities
of Taiwanese or Taiwan-related companies, including our own. Relations between the ROC and the PRC and other factors affecting
the political or economic conditions in Taiwan could have a material adverse effect on our financial condition and results of operations,
as well as the market price and the liquidity of our common shares and ADSs.
Currently, we manufacture interconnect
materials in the PRC through our wholly owned subsidiary, ASE Shanghai. We also provide packaging and testing services in the PRC
through some of our subsidiaries. In addition, we engage in the PRC in real estate development and the manufacture of computer
peripherals and electronic components through our subsidiaries in the PRC. See “Item 4. Information on the Company—Organizational
Structure—Our Consolidated Subsidiaries.” In the past, ROC companies, including ourselves, were prohibited from investing
in facilities for the packaging and testing of semiconductors in the PRC. Although the prohibitions have been relaxed since February
2010, the ROC government currently still restricts certain types of investments by ROC companies, including ourselves, in the PRC.
We do not know when or if such laws and policies governing investment in the PRC will be amended, and we cannot assure you that
such ROC investment laws and policies will permit us to make further investments of certain types in the PRC in the future that
we consider beneficial to us. Our growth prospects and profitability may be adversely affected if we are restricted from making
certain additional investments in the PRC and are not able to fully capitalize on the growth of the semiconductor industry in the
PRC.
As a substantial portion of our business
and operations is located in Taiwan, we are vulnerable to earthquakes, typhoons, drought and other natural disasters, as well as
power outages and other industrial incidents, which could severely disrupt the normal operation of our business and adversely affect
our results of operations.
Taiwan is susceptible to earthquakes and
has experienced severe earthquakes which caused significant property damage and loss of life, particularly in the central and eastern
parts of Taiwan. Earthquakes have damaged production facilities and adversely affected the operations of many companies involved
in the semiconductor and other industries. For example, in February 2016, an earthquake measuring 6.4 on the Richter magnitude
scale occurred in Kaohsiung caused several death and property damages. However, the earthquake did not have a material impact on
our operations. We have never experienced structural damage to our facilities or damage to our machinery and equipment as a result
of these earthquakes. In the past, however, we have experienced interruptions to our production schedule primarily as a result
of power outages caused by earthquakes.
Taiwan is also susceptible to typhoons,
which may cause damage and business interruptions to companies with facilities located in Taiwan. For example, on August 8, 2015,
Taiwan experienced severe damage from typhoon Soudelor that caused several deaths, severe flooding, extensive property damage and
loss of electricity for millions of households. Taiwan has experienced severe droughts in the past. Although we have not been directly
affected by droughts, we are dependent upon water for our packaging and substrates operations and a drought could interrupt such
operations. In addition, a drought could interrupt the manufacturing process of the foundries located in Taiwan, in turn disrupting
some of our customers’ production, which could result in a decline in the demand for our services. In addition, the supply
of electrical power in Taiwan, which is primarily provided by Taiwan Power Company, the state-owned electric utility, is susceptible
to disruption that could be prolonged and frequent, caused by overload as a result of high demand or other reasons.
Kaohsiung is one of the major industrial
cities in Taiwan. Our testing and packaging businesses have been founded in Kaohsiung and currently our primary testing and packaging
operations are located in Kaohsiung. In July 2014, following leaks from underground propene pipes, a series of propene pipeline
explosions occurred in the Cian-Jhen and Ling-Ya districts of Kaohsiung. 32 people were killed and 321 others were injured from
this incident. Although we have not been directly affected by the explosion, future industrial incidents could negatively affect
our operation and result in interruption or delay of our operation or production capacity.
Our production facilities as well as many
of our suppliers and customers and providers of complementary semiconductor manufacturing services, including wafer foundries,
are located in Taiwan. If our customers are affected by an earthquake, a typhoon, a drought or any other natural disasters, or
power outage or other industrial incidents, it could result in a decline in the demand for our services. If our suppliers or providers
of complementary semiconductor manufacturing services are affected, our production schedule could be interrupted or delayed. As
a result, a major earthquake, typhoon, drought or other natural disaster in Taiwan, or a power outage or other industrial incident
could severely disrupt the normal operation of our business and have a material adverse effect on our financial condition and results
of operations.
We face risks related to health epidemics
and outbreaks of contagious diseases, including H5N1 influenza, H7N9 influenza, H9N2 influenza, Severe Acute Respiratory Syndrome,
or SARS, Middle East Respiratory Syndrome, or MERS, Ebola virus and Zika virus.
There have been reports of outbreaks of
a highly pathogenic influenza caused by the H5N1, H7N9 and H9N2 viruses, in certain regions of Asia and other parts of the world.
In recent years, Ebola virus disease broke out in West Africa, with a number of people having died of the disease in countries
such as Guinea, Sierra Leone and Liberia. There are also cases of patients diagnosed with Ebola in the United States and Europe.
In addition, Zika virus disease broke out in the Americas in 2015 and is currently ongoing, infecting people throughout South America,
Central America, Mexico and the Caribbean. The disease is strongly linked to cases of microcephaly and Guillain–Barré
syndrome in Brazil. An outbreak of such contagious diseases in the human population could result in a widespread health crisis
that could adversely affect the economies and financial markets of many countries. Additionally, a recurrence of SARS, a highly
contagious form of atypical pneumonia, similar to the occurrence in 2003, which affected the PRC, Hong Kong, Taiwan, Singapore,
Vietnam and certain other countries, and MERS, a viral respiratory infection which affected South Korea in 2015, would also have
similar adverse effects. Since most of our operations and customers and suppliers are based in Asia (mainly in Taiwan and the PRC),
an outbreak of H5N1 influenza, H7N9 influenza, H9N2 influenza, SARS, MERS, Ebola, Zika virus or other contagious diseases in Asia
or elsewhere, or the perception that such an outbreak could occur, and the measures taken by the governments of countries affected,
including the ROC and the PRC, could adversely affect our business, financial condition or results of operations.
Risks Relating to Ownership of Our Common Shares and the
ADSs
The market for our common shares and
the ADSs may not be liquid.
Active, liquid trading markets generally
result in lower price volatility and more efficient execution of buy and sell orders for investors, compared to less active and
less liquid markets. Liquidity of a securities market is often a function of the volume of the underlying shares that are publicly
held by unrelated parties.
There has been no trading market outside
the ROC for our common shares and the only trading market for our common shares is the Taiwan Stock Exchange. The outstanding ADSs
are listed on the New York Stock Exchange. There is no assurance that the market for our common shares or the ADSs will be active
or liquid.
Although ADS holders are entitled to withdraw
our common shares underlying the ADSs from the depositary at any time, ROC law requires that our common shares be held in an account
in the ROC or sold for the benefit of the holder on the Taiwan Stock Exchange. In connection with any withdrawal of common shares
from our ADS facility, the ADSs evidencing these common shares will be cancelled. Unless additional ADSs are issued, the effect
of withdrawals will be to reduce the number of outstanding ADSs. If a significant number of withdrawals are effected, the liquidity
of our ADSs will be substantially reduced. We cannot assure you that the ADS depositary will be able to arrange for a sale of deposited
shares in a timely manner or at a specified price, particularly during periods of illiquidity or volatility.
If a non-ROC holder of ADSs withdraws
and holds common shares, such holder of ADSs will be required to appoint a tax guarantor, local agent and custodian in the ROC
and register with the Taiwan Stock Exchange or the Taipei Exchange in order to buy and sell securities on the Taiwan Stock Exchange.
When a non-ROC holder of ADSs elects to
withdraw and hold common shares represented by ADSs, such holder of the ADSs will be required to appoint an agent for filing tax
returns and making tax payments in the ROC. Such agent will be required to meet the qualifications set by the ROC Ministry of Finance
and, upon appointment, becomes the guarantor of the withdrawing holder’s tax payment obligations. Evidence of the appointment
of a tax guarantor, the approval of such appointment by the ROC tax authorities and tax clearance certificates or evidentiary documents
issued by such tax guarantor may be required as conditions to such holder repatriating the profits derived from the sale of common
shares. We cannot assure you that a withdrawing holder will be able to appoint, and obtain approval for, a tax guarantor in a timely
manner.
In addition, under current ROC law, such
withdrawing holder is required to register with the Taiwan Stock Exchange or the Taipei Exchange and appoint a local agent in the
ROC to, among other things, open a bank account and open a securities trading account with a local securities brokerage firm, pay
taxes, remit funds and exercise such holder’s rights as a shareholder. Furthermore, such withdrawing holder must appoint
a local bank or a local securities firm to act as custodian for confirmation
and settlement of trades, safekeeping of securities and cash proceeds and reporting and declaration of information. Without satisfying
these requirements, non-ROC withdrawing holders of ADSs would not be able to hold or otherwise subsequently sell our common shares
on the Taiwan Stock Exchange or otherwise.
Pursuant to Mainland Investors Regulations,
only QDIIs or persons that have otherwise obtained the approval from the MOEAIC and registered with the Taiwan Stock Exchange are
permitted to withdraw and hold our shares from a depositary receipt facility. In order to hold our shares, such QDIIs are required
to appoint an agent and custodian as required by the Mainland Investors Regulations. If the aggregate amount of our shares held
by any QDII or shares received by any QDII upon a single withdrawal or in the aggregate accounts for 10.0% of our total issued
and outstanding shares, such QDII must obtain the prior approval from the MOEAIC. We cannot assure you that such approval would
be granted.
The market value of your investment may
fluctuate due to the volatility of the ROC securities market.
The trading price of our ADSs may be affected
by the trading price of our common shares on the Taiwan Stock Exchange. The ROC securities market is smaller and more volatile
than the securities markets in the United States and in many European countries. The Taiwan Stock Exchange has experienced substantial
fluctuations in the prices and volumes of sales of listed securities and there are currently limits on the range of daily price
movements on the Taiwan Stock Exchange. The Taiwan Stock Exchange Index peaked at 12,495.3 in February 1990, and subsequently
fell to a low of 2,560.5 in October 1990. On March 13, 2000, the Taiwan Stock Exchange Index experienced a 617-point drop, which
represented the single largest decrease in the Taiwan Stock Exchange Index in its history. During the period from January 1, 2015
to December 31, 2015, the Taiwan Stock Exchange Index peaked at 9,973.12 on April 27, 2015, and reached a low of 7,410.34 on August
24, 2015. Over the same period, the trading price of our common shares ranged from NT$48.05 per share to NT$29.75 per share. On
April 28, 2016, the Taiwan Stock Exchange Index closed at 8,473.87, and the closing value of our common shares was NT$32.20 per share.
The Taiwan Stock Exchange is particularly
volatile during times of political instability, including when relations between Taiwan and the PRC are strained. Several investment
funds affiliated with the ROC government have also from time to time purchased securities from the Taiwan Stock Exchange to support
the trading level of the Taiwan Stock Exchange. Moreover, the Taiwan Stock Exchange has experienced problems such as market manipulation,
insider trading and settlement defaults. The recurrence of these or similar problems could have an adverse effect on the market
price and liquidity of the securities of ROC companies, including our common shares and ADSs, in both the domestic and international
markets.
Holders of common shares and ADSs may
experience dilution if we issue stock bonuses and stock options to employees or sell additional equity or equity-linked securities.
Similar to other ROC technology companies,
we issue bonuses from time to time in the form of common shares. Prior to 2009, bonuses issued in the form of our common shares
were valued at par. Beginning in 2009, bonuses in the form of our common shares are valued at the closing price of our common shares
on the day prior to our shareholders’ meeting. In addition, under the ROC Company Law we may, upon approval from our board
of directors and the ROC Securities and Futures Bureau of the FSC, establish employee stock option plans provided that shareholders’
approval is required if the exercise price of an option would be less than the closing price of our common shares on the Taiwan
Stock Exchange on the grant date of the option. ASE Inc. currently maintains three employee stock option plans pursuant to which
our full-time employees, including our domestic and foreign subsidiaries, are eligible to receive stock option grants. As of December
31, 2015, 252,606,950 options granted by ASE Inc. were outstanding. In December 2014, the board of directors approved the 5
th
Employee Share Option plans, and in April 2015, the FSC approved the 5
th
Employee Share Option plans, under which 94,270,000
options were granted in September 2015. See “Item 6. Directors, Senior Management and Employees—Compensation—ASE
Inc. Employee Bonus and Stock Option Plans.” The issuance of our common shares pursuant to stock bonuses or stock options
may have a dilutive effect on the holders of outstanding common shares and ADSs.
In addition, the sale of additional
equity or equity-linked securities may result in additional dilution to our shareholders. In September 2013, we issued 2018
Convertible Bonds to fund procurement of raw materials from overseas. The bonds are convertible by holders at any time on or
after October 16, 2013 and up to (and including) August 26, 2018. As of December 31, 2015, none of the bonds has been
converted into our common shares, and the balance of the outstanding bonds was US$400.0 million. The initial conversion price
was NT$33.085 per common share, subject to adjustment upon the occurrence of certain events, such as the Capital Increase and
cash dividend distribution. As of the date of this annual report, the conversion price is NT$30.28 per common share. Upon
full conversion, the outstanding bonds will be converted into 395,719,947 common shares if based on the current conversion
price, representing 5.0% of our outstanding shares at the end of December 31, 2015. Any conversion of bonds, in full or in
part, would dilute the ownership interest of our existing shareholders and our earnings per share and could adversely affect
the market price of our ADSs. Moreover, in September 2013, we issued 130,000,000 common shares for public subscription, which
was effected by way of an increase in our authorized share capital in the amount of NT$1,300.0 million. The issuance of
the zero coupon convertible bonds due 2018 and the Capital Increase could cause dilution to our ADS holders.
Restrictions on the ability to deposit
our common shares into our ADS facility may adversely affect the liquidity and price of our ADSs.
The ability to deposit common shares into
our ADS facility is restricted by ROC law. A significant number of withdrawals of common shares underlying our ADSs would reduce
the liquidity of the ADSs by reducing the number of ADSs outstanding. As a result, the prevailing market price of our ADSs may
differ from the prevailing market price of our common shares on the Taiwan Stock Exchange. Under current ROC law, no person or
entity, including you and us, may deposit our common shares in our ADS facility without specific approval of the FSC, unless:
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(1)
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we pay stock dividends on our common shares;
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(2)
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we make a free distribution of common shares;
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(3)
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holders of ADSs exercise preemptive rights in the event of capital increases; or
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(4)
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to the extent permitted under the deposit agreement and the relevant custody agreement, investors purchase our common shares,
directly or through the depositary, on the Taiwan Stock Exchange, and deliver our common shares to the custodian for deposit into
our ADS facility, or our existing shareholders deliver our common shares to the custodian for deposit into our ADS facility.
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With respect to item (4) above, the depositary
may issue ADSs against the deposit of those common shares only if the total number of ADSs outstanding following the deposit will
not exceed the number of ADSs previously approved by the FSC, plus any ADSs issued pursuant to the events described in items (1),
(2) and (3) above.
In addition, in the case of a deposit of
our common shares requested under item (4) above, the depositary will refuse to accept deposit of our common shares if such deposit
is not permitted under any legal, regulatory or other restrictions notified by us to the depositary from time to time, which restrictions
may include blackout periods during which deposits may not be made, minimum and maximum amounts and frequency of deposits.
The depositary will not offer holders of
ADSs preemptive rights unless the distribution of both the rights and the underlying common shares to our ADS holders are either
registered under the Securities Act or exempt from registration under the Securities Act.
Holders of ADSs will not have the same
voting rights as our shareholders, which may affect the value of their ADSs.
The voting rights of a holder of ADSs as
to our common shares represented by its ADSs are governed by the deposit agreement. Holders of ADSs will not be able to exercise
voting rights on an individual basis. If holders representing at least 51% of the ADSs outstanding at the relevant record date
instruct the depositary to vote in the same manner regarding a resolution, including the election of directors, the depositary
will cause all common shares represented by the ADSs to be voted in that manner. If the depositary does not receive timely instructions
representing at least 51% of the ADSs outstanding at the relevant record date to vote in the same manner for any resolution, including
the election of directors, holders of ADSs will be deemed to have instructed the depositary or its nominee to authorize all our
common shares represented by the ADSs to be voted at the discretion of our chairman or his designee, which may not be in the interest
of holders of ADSs. Moreover, while shareholders who own 1% or more of our outstanding shares are entitled to submit one proposal
to be considered at our annual general meetings of shareholders, only holders representing at least 51% of our ADSs outstanding
at the relevant record date are entitled to submit one proposal to be
considered at our annual general meetings of shareholders. Hence, only one proposal may be submitted on behalf of all ADS holders.
The right of holders of ADSs to participate
in our rights offerings is limited, which could cause dilution to your holdings.
We may from time to time distribute rights
to our shareholders, including rights to acquire our securities. Under the deposit agreement, the depositary will not offer holders
of ADSs those rights unless both the distribution of the rights and the underlying securities to all our ADS holders are either
registered under the Securities Act or exempt from registration under the Securities Act. Although we may be eligible to take advantage
of certain exemptions under the Securities Act available to certain foreign issuers for rights offerings, we can give no assurances
that we will be able to establish an exemption from registration under the Securities Act, and we are under no obligation to file
a registration statement for any of these rights. Accordingly, holders of ADSs may be unable to participate in our rights offerings
and may experience dilution of their holdings.
If the depositary is unable to sell rights
that are not exercised or not distributed or if the sale is not lawful or reasonably practicable, it will allow the rights to lapse,
in which case holders of ADSs will receive no value for these rights.
Changes in exchange controls, which restrict
your ability to convert proceeds received from your ownership of ADSs, may have an adverse effect on the value of your investment.
Under current ROC law, the depositary,
without obtaining approvals from the Central Bank of the Republic of China (Taiwan) or any other governmental authority or agency
of the ROC, may convert NT dollars into other currencies, including U.S. dollars, for:
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the proceeds of the sale of common shares represented by ADSs or received as stock dividends from our common shares and deposited
into the depositary receipt facility; and
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any cash dividends or distributions received from our common shares.
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In addition, the depositary may also convert
into NT dollars incoming payments for purchases of common shares for deposit in the ADS facility against the creation of additional
ADSs. The depositary may be required to obtain foreign exchange approval from the Central Bank of the Republic of China (Taiwan)
on a payment-by-payment basis for conversion from NT dollars into foreign currencies of the proceeds from the sale of subscription
rights for new common shares. Although it is expected that the Central Bank of the Republic of China (Taiwan) will grant this approval
as a routine matter, we cannot assure you that in the future any approval will be obtained in a timely manner, or at all.
Under the ROC Foreign Exchange Control
Law, the Executive Yuan of the ROC government may, without prior notice but subject to subsequent legislative approval, impose
foreign exchange controls in the event of, among other things, a material change in international economic conditions. We cannot
assure you that foreign exchange controls or other restrictions will not be introduced in the future.
The value of your investment may be reduced
by possible future sales of common shares or ADSs by us or our shareholders.
While we are not aware of any plans by
any major shareholders to dispose of significant numbers of common shares, we cannot assure you that one or more existing shareholders
or owners of securities convertible or exchangeable into or exercisable for our common shares or ADSs will not dispose of significant
numbers of common shares or ADSs. In addition, several of our subsidiaries and affiliates hold common shares, depositary shares
representing common shares and options to purchase common shares or ADSs. They may decide to sell those securities in the future.
See “Item 7. Major Shareholders and Related Party Transactions—Major Shareholders” for a description of our significant
shareholders and affiliates that hold our common shares.
We cannot predict the effect, if any, that
future sales of common shares or ADSs, or the availability of common shares or ADSs for future sale, will have on the market price
of our common shares or the ADSs prevailing from time to time. Sales of substantial numbers of common shares or ADSs in the public
market, or the perception that such sales may occur, could depress the prevailing market prices of our common shares or the ADSs.
Item 4. Information on the Company
HISTORY AND DEVELOPMENT OF THE
COMPANY
Advanced Semiconductor Engineering, Inc.
was incorporated on March 23, 1984 as a company limited by shares under the ROC Company Law, with facilities in the Nantze Export
Processing Zone located in Kaohsiung, Taiwan. Our principal executive offices are located at 26 Chin Third Road, Nantze Export
Processing Zone, Nantze, Kaohsiung, Taiwan, ROC and our telephone number at the above address is (886) 7-361-7131. Our common shares
have been listed on the Taiwan Stock Exchange under the symbol “2311” since July 1989, and ADSs representing our common
shares have been listed on the New York Stock Exchange under the symbol “ASX” since September 2000.
Acquisition of Common Shares and American
Depositary Shares of SPIL
In August 2015, we announced an offer to
purchase 779,000,000 common shares (including those represented by American depositary shares) of SPIL through concurrent tender
offers in the ROC and the U.S., at a price of NT$45 per SPIL common share and NT$225 per SPIL American depositary share. The Initial
SPIL Tender Offer expired on September 22, 2015, with 1,147,898,165 common shares (including those represented by American depositary
shares) validly tendered and not validly withdrawn, exceeding the offer cap, and as a result, after proration, 725,749,060 SPIL
common shares and 10,650,188 SPIL American depositary shares were accepted for purchase. On October 1, 2015, we became a shareholder
holding approximately 24.99% of the issued and outstanding share capital in SPIL.
In December 2015, following an announcement
by SPIL that it plans to issue 1,033 million shares, if approved by SPIL shareholders, to a third party pursuant to a share placement
agreement, we submitted a written proposal to SPIL’s Board proposing to acquire all SPIL shares not otherwise owned by ASE,
contingent upon the termination of the share placement agreement. The board of directors of SPIL (“SPIL Board”) did
not respond to our acquisition proposal. Subsequently, we launched an offer to purchase 770,000,000 common shares (including those
represented by American depositary shares) of SPIL through concurrent tender offers in the ROC and the U.S., at a price of NT$55
per SPIL common share and NT$275 per SPIL American depositary share. The Second SPIL Tender Offer expired on March 17, 2016. Because
the TFTC did not render a decision before the expiration of the Second SPIL Tender Offer, resulting in the failure to satisfy one
of the tender offer conditions, the Second SPIL Tender Offer was not successful. The TFTC subsequently suspended its review on
March 23, 2016.
Notwithstanding the failure of the Second
SPIL Tender Offer, we announced that we will continue to seek control of SPIL, with the purpose of effecting the SPIL Merger. In
order to implement the SPIL Merger, we announced that we intend to seek to discharge the SPIL Board at one or more shareholders’
meetings, or await the expiration of the current SPIL Board’s term, and elect new nominees to the SPIL Board. If after such
election one half or more of the SPIL Board is composed of candidates nominated or designated by us, we intend, in accordance with
the Enterprise Mergers and Acquisitions Act, to cause the SPIL Board to resolve in favor a SPIL Merger.
We expect to continue to seek the support
of SPIL shareholders in order to acquire 100% of the issued and outstanding share capital of SPIL not owned by us, by all legally
available means, and will continue to seek all necessary antitrust or other regulatory approvals in Taiwan, the United States and
other jurisdictions where we do business. In addition, upon the completion of the SPIL Merger, we plan to establish a holding company
in Taiwan that will hold 100% of the equity interests in both ASE and SPIL such that ASE and SPIL will be wholly owned subsidiaries
of such holding company. The proposed new holding company will maintain all current operations of ASE and SPIL in Taiwan.
In March and April 2016, we acquired an
additional 258,300,000 common shares of SPIL (including those represented by American depositary shares) through open market purchases.
As of April 28, 2016, we beneficially own 1,037,300,000 common shares of SPIL (calculated as the sum of 935,596,800 common shares
of SPIL and 101,703,200 common shares of SPIL underlying 20,340,640 American depositary shares of SPIL), representing 33.29% of
the issued and outstanding share capital of SPIL (calculated based on 3,116,361,139 common shares of SPIL (including those represented
by American depositary shares) outstanding as of March 31, 2016 as reported in SPIL’s annual report on Form 20-F for the
year ended December 31, 2015).
We will otherwise continue to seek
opportunities for cooperation with SPIL, subject to applicable law. In addition, we intend to consider other possibilities,
including further acquisitions of common shares of SPIL, including those represented by American depositary shares, whether
in the market, privately negotiated transactions, or through one or more tender offers, or one or more other potential
transactions. We will continue to review our investment in SPIL on the basis of available information and reserve the right
to increase or decrease our ownership stake from time to time.
There were no public takeover offers by
third parties of ASE’s shares which occurred in 2014 and 2015.
2018 NTD-linked Convertible Bonds
In July 2015, we completed an offering
of US$200.0 million aggregate principal amount of NTD-linked zero coupon convertible bonds due 2018. The 2018 NTD-linked Convertible
Bonds were offered to persons outside of the United States in compliance with Regulation S under the Securities Act. The bonds
will mature on March 27, 2018, unless previously repurchased or converted in accordance with their terms prior to such date. The
net proceeds from the offering were used to fund procurement of equipment from overseas. Please refer to note 18 of our consolidated
financial statements included in this annual report for more information. As of December 31, 2015, the balance of the outstanding
convertible bonds was US$200.0 million.
ASEEE
On May 8, 2015, we entered into a
joint venture agreement with TDK Corporation, under which both parties would invest in ASE Embedded Electronics Inc.
(“ASEEE”), a company limited by shares incorporated under ROC law. ASEEE will engage in the business of
manufacture, marketing, distribution and sale of embedded substrates and it plans to leverage TDK Corporation’s
expertise, patents and knowledge in the field of SESUB technology. In August 2015, we invested NT$618.1 million (US$18.9
million) for 51% shareholding in ASEEE. The investment in ASEEE is accounted for using the equity method. See “Item 10.
Material Contracts—Joint Venture Agreement between ASE and TDK Corporation” for more information.
USI Group Restructuring
In April 2015, our subsidiary Universal
Scientific completed a spin-off of its subsidiaries to USI Inc.. As a result of such spin-off, as of April 1, 2015, ASE Inc. held
approximately 99.01% of Universal Scientific and approximately 99.17% of USI Inc.
Universal Scientific, USI Inc. and USI
Inc.’s directly and indirectly held subsidiaries (collectively, the “USI Group”) primarily engage in electronic
manufacturing services in relation to computers, consumer electronics, communications, industrial and automotive, among other services
and businesses. As part of our corporate reorganization to align each business function to different legal entity groups, the board
of directors of ASE Inc. passed a resolution on September 24, 2015 and approved the sale of all ASE Inc.’s shareholding in
Universal Scientific to UGTW, an indirectly held subsidiary of USI Inc., which will result in USI Inc. indirectly holding Universal
Scientific (the “Universal Scientific Share Transfer”). The Universal Scientific Share Transfer was approved by the
Investment Commission of MOEA on February 3, 2016 and the majority of ASE Inc.’s shares in Universal Scientific were transferred
to UGTW in March 2016, with the remaining shares to be transferred in May 2016.
For more information on our history and
development, see “—Organizational Structure.”
Our principal capital expenditures
for the years ended December 31, 2013, 2014 and 2015 have been for machinery and equipment procurements and investments in
buildings and improvement in connection with the expansion of our capacity expansion, for which we spent NT$27,044.1 million,
NT$43,448.6 million and NT$28,280.8 million (US$862.5 million), respectively. We had commitments for capital expenditures of
approximately US$246.7 million, of which US$53.6 million had been paid as of December 31, 2015, mainly in connection with the
expansion of our packaging and testing services operations primarily in the ROC and the PRC. Any future expansion of our
operating activities could result in additional capital expenditures. We anticipate our capital expenditures in 2016 will be
financed through our existing cash, marketable securities, expected cash flow from operations and existing credit lines under
our loan facilities and will consist of, among other things, additional machinery and equipment procurements for our capacity
expansions. See “Item 5. Operating and Financial Review and Prospects—Liquidity and Capital Resources” for
more information. Other than the acquisition of common shares and American depositary shares of SPIL by way of the Initial
SPIL Tender Offer and through open market purchases, there were no significant financial investments or divestitures in 2013,
2014 and 2015. See “Item 4. Information on the Company—History and Development of the Company—Acquisition
of Common Shares and American Depositary Shares of SPIL” for information.
BUSINESS OVERVIEW
ASE is among the leading providers of semiconductor
packaging and testing services based on 2015 revenues. Our services include semiconductor packaging, production of interconnect
materials, front-end engineering testing, wafer probing and final testing services, as well as integrated solutions for electronic
manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications.
We believe that, as a result of the following strengths, we are able to compete effectively to meet customers’ requirements
across a wide range of end-use applications:
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our ability to provide a broad range of cost-effective semiconductor packaging and testing services on a large-scale turnkey
basis within key centers of semiconductor manufacturing;
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our expertise in developing and providing cost-effective packaging, interconnect materials and testing technologies and solutions;
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our ability to provide proactive original design manufacturing services using innovative solution-based designs;
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our commitment to investing in capacity expansion and research and development, as well as selective acquisitions, that will
benefit customers and our business;
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our geographic presence in key centers of outsourced semiconductor and electronics manufacturing; and
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our long-term relationships with providers of complementary semiconductor manufacturing services, including our strategic alliance
with TSMC, one of the world’s largest dedicated semiconductor foundries.
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We believe that it is still the trend for
semiconductor companies to outsource their packaging, testing and manufacturing requirements as semiconductor companies rely on
independent providers of foundry, packaging and testing and electronic manufacturing services.
In response to the
increased pace of new product development and shortened product life and production cycles, semiconductor companies are increasingly
seeking both independent packaging and testing companies that can provide turnkey services in order to reduce time-to-market and
electronic manufacturing companies with proactive original design capabilities that can provide large-scale production. We believe
that our technological expertise and scale and our ability to integrate our broad range of solutions into turnkey services and
electronic manufacturing services allow us to benefit from the accelerated outsourcing trend and better serve our existing and
potential customers.
We believe that we have benefited, and
will continue to benefit, from our geographic location in Taiwan. Taiwan is currently the largest center for outsourced semiconductor
manufacturing in the world and has a high concentration of electronic manufacturing service providers. Our close proximity to foundries
and other providers of complementary semiconductor manufacturing services is attractive to our customers who wish to take advantage
of the efficiencies of a total semiconductor manufacturing solution by outsourcing several stages of their manufacturing requirements.
We believe that, as a result, we are well positioned to meet the advanced semiconductor engineering and manufacturing requirements
of our customers.
Industry Background
General
Semiconductors are the basic building blocks
used to create an increasing variety of electronic products and systems. Continuous improvements in semiconductor process and design
technologies have led to smaller, more complex and more reliable semiconductors at a lower cost per function. These improvements
have resulted in significant performance and price benefits to manufacturers of electronic products. As a result, semiconductor
demand has grown substantially in our primary end-user markets for communications, computing and consumer electronics, and has
experienced increased growth in other markets such as automotive products and industrial automation and control systems.
The semiconductor industry is characterized
by strong long-term growth, with periodic and sometimes severe cyclical downturns. The Semiconductor Industry Association reported
that worldwide sales of semiconductors increased from approximately US$51.0 billion in 1990 to approximately US$335.2 billion in
2015. We believe that overall growth and cyclical fluctuations will continue over the long-term in the semiconductor industry.
Electronic Manufacturing Services
Electronic manufacturing service providers
typically achieve large economies of scale in manufacturing by pooling together product design techniques and also provide value-added
services such as warranties and repairs. Companies who do not need to manufacture a constant supply of products have increasingly
outsourced their manufacturing to these service providers so that they can respond quickly and efficiently to sudden spikes in
demand without having to maintain large inventories of products.
Electronic manufacturing services are sought
by companies in a wide range of industries including, among others, information, communications, consumer electronics, automotive
electronics, medical treatment, industrial applications, aviation, navigation, national defense and transportation. Although affected
by global economic fluctuations, we expect the electronic manufacturing services industry to continue to grow in the long-term,
and we have enhanced our presence in the industry since 2010 through our acquisition of a controlling interest in Universal Scientific.
Outsourcing Trends in Semiconductor Manufacturing
Historically, semiconductor companies designed,
manufactured, packaged and tested semiconductors primarily within their own facilities. However, there is a clear trend in the
industry to outsource the manufacturing process. Virtually every significant stage of the manufacturing process can be outsourced.
Wafer foundry services, semiconductor packaging and testing services, and electronic manufacturing services are currently the largest
segments of the independent semiconductor manufacturing services market.
The availability of technologically advanced
independent manufacturing services has also enabled the growth of “fabless” semiconductor companies that focus on semiconductor
design and marketing, while outsourcing their wafer fabrication, packaging and testing requirements to independent companies. We
believe that the growth in the number and scale of fabless semiconductor companies that rely solely on independent companies to
meet their manufacturing requirements will continue to be a driver of growth for us. Similarly, the availability of technologically
advanced independent manufacturing services has encouraged integrated device manufacturers, which traditionally have relied on
in-house semiconductor manufacturing capacity, to increasingly outsource their manufacturing requirements to independent semiconductor
manufacturing companies.
We believe the outsourcing of semiconductor
manufacturing services will increase in the future for many reasons, including the following:
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Technological Expertise and Significant Capital Expenditure
. Semiconductor manufacturing processes have become highly
complex, requiring substantial investment in specialized equipment and facilities and sophisticated engineering and manufacturing
expertise. In addition, product life cycles have been shortening, magnifying the need to continuously upgrade or replace manufacturing
equipment to accommodate new products. As a result, new investments in in-house facilities are becoming less desirable to integrated
device manufacturers because of the high investment costs as well as the inability to achieve sufficient economies of scale and
utilization rates necessary to be competitive with the independent service providers. Independent packaging, testing, wafer foundry
and electronic manufacturing services companies, on the other hand, are able to realize the benefits of specialization and achieve
economies of scale by providing services to a large base of customers across a wide range of products. This enables them to reduce
costs and shorten production cycles through high capacity utilization and process expertise. In the process, they are also able
to focus on discrete stages of semiconductor manufacturing and deliver services of superior quality.
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Some semiconductor companies with in-house operations are under increasing pressure to rationalize these operations by relocating
to locations with lower costs or better infrastructure, in order to lower manufacturing costs and shorten production cycle time.
We expect semiconductor companies to increasingly outsource their requirements to take advantage of the advanced technology and
scale of operations of independent packaging
and testing companies and electronic manufacturing services providers.
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Focus on Core Competencies
. As the semiconductor industry becomes more competitive, semiconductor companies are expected
to further outsource their semiconductor manufacturing requirements in order to focus their resources on core competencies, such
as semiconductor design and marketing.
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Time-to-Market Pressure
. The increasingly short product life cycle has accelerated time-to-market pressure for semiconductor
companies, leading them to rely increasingly on outsourced suppliers as a key source for effective manufacturing solutions.
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Capitalize on the High Growth Rates in Emerging Markets
. Emerging markets, and China in particular, have become both
major manufacturing centers for the technology industry and growing markets for technology-based products. Thus, in order to gain
direct access to the Chinese market, many semiconductor companies are seeking to establish manufacturing facilities in China by
partnering with local subcontractors. As a result, certain stages of the semiconductor manufacturing process that were previously
handled in-house will be increasingly outsourced in order to improve efficiency.
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Trends of Mergers and Acquisitions
in the Semiconductor Industry
The global semiconductor industry is highly
competitive, and such competitive landscape is changing as a result of a trend toward consolidation within the industry. In particular,
packaging and testing service providers in the semiconductor industry have engaged in cross-border mergers and acquisitions in
recent years as part of their expansion strategy, which has gradually changed the ecosystem of the semiconductor industry. Examples
of mergers and acquisitions in recent years include mergers and acquisitions by and among semiconductor design companies or integrated
device manufacturers, including Intel Corporation’s acquisition of Altera Corporation, ON Semiconductor Corporation’s
acquisition of Fairchild Semiconductor International, Inc., NXP Semiconductors N.V.’s acquisition of Freescale Semiconductor,
Inc., Avago Technologies Ltd.’s acquisition of Broadcom Corporation and several acquisitions of semiconductor design companies
by MediaTek, Inc., and mergers and acquisitions by and among semiconductor packaging and testing companies, including Jiangsu Changjiang
Electronics Technology Co., Ltd.’s acquisition of STATS ChipPAC Ltd., Nantong Fujitsu Microelectronics Co., Ltd.’s
acquisition of the packaging and testing factory of Advanced Micro Devices, Inc. and Amkor Technology, Inc.’s acquisition
of J-Devices Corporation.
As a result of the aforementioned mergers
and acquisitions, our competitors were able to further strengthen their competitive position by expanding their product offerings
and combining their financial resources. We expect this consolidation trend to continue in 2016.
Overview of Semiconductor Manufacturing
Process
The manufacturing of semiconductors is
a complex process that requires increasingly sophisticated engineering and manufacturing expertise. The manufacturing process can
be generally divided into the following stages:
We are involved in all stages of the semiconductor
manufacturing process except circuit design and wafer fabrication.
Process
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Description
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1. Circuit Design
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The design of a semiconductor is developed by laying out circuit components and interconnections.
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2. Engineering Test
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Throughout and following the design process, prototype semiconductors undergo engineering testing, which involves software development, electrical design validation and reliability and failure analysis.
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3. Wafer Fabrication
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Process begins with the generation of a photomask through the definition of the circuit design pattern on a photographic negative, known as a mask, by an electron beam or laser beam writer. These circuit patterns are transferred to the wafers using various advanced processes.
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4. Wafer Probe
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Each individual die is electrically tested, or probed, for defects. Dies that fail this test are marked to be discarded.
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5. Packaging (or Assembly)
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Packaging, also called assembly, is the processing of bare semiconductors into finished semiconductors and serves to protect the die and facilitate electrical connections and heat dissipation. The patterned silicon wafers received from our customers are diced by means of diamond saws into separate dies, also called chips. Basically each die is attached to a leadframe or a laminate (plastic or tape) substrate by epoxy resin. A leadframe is a miniature sheet of metal, generally made of copper and silver alloys, on which the pattern of input/output leads has been cut. On a laminate substrate, typically used in ball grid array, or BGA, packages, the leads take the shape of small bumps or balls. Leads on the leadframe or the substrate are connected by extremely fine gold or copper wires or bumps to the input/output terminals on the chips, through the use of automated machines known as “bonders.” Each chip is then encapsulated, generally in a plastic casing molded from a molding compound, with only the leads protruding from the finished casing, either from the edges of the package as in the case of the leadframe-based packages, or in the form of small bumps on a surface of the package as in the case of BGA or other substrate-based packages.
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Process
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Description
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6. Final Test
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Final testing is conducted to ensure that the packaged semiconductor meets performance specifications. Final testing involves using sophisticated testing equipment known as testers and customized software to electrically test a number of attributes of packaged semiconductors, including functionality, speed, predicted endurance and power consumption. The final testing of semiconductors is categorized by the functions of the semiconductors tested into logic/mixed-signal/RF/3D IC/discrete final testing and memory final testing. Memory final testing typically requires simpler test software but longer testing time per device tested.
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7. Module, Board Assembly and Test
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Module, board assembly and test refers to the combination of one or more packaged semiconductors with other components in an integrated module or board to enable increased functionality.
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8. Material
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Material refers to the interconnection of materials which connect the input/output on the semiconductor dies to the printed circuit board, such as substrate, leadframe and flip-chip.
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Strategy
Our objective is to provide integrated
solutions that set industry standards, including packaging, testing services, interconnect materials design and production capabilities,
and to lead and facilitate the industry trend toward outsourcing semiconductor manufacturing requirements. The principal elements
of our strategy are to:
Grow Our Packaging Services and Expand
Our Range of Offerings
We believe that an important factor to
attract leading semiconductor companies as our customers has been our ability to fulfill demand for a broad range of packaging
solutions on a large scale. We intend to continue to develop process and product technologies to meet the packaging requirements
of clients. Our expertise in packaging technology has enabled us to develop sophisticated solutions such as flip-chip packaging,
bump chip carrier packaging, stacked die packaging and fine-pitch wire bonding. We are continuously investing in research and development
in response to and in anticipation of migrations in technology and intend to continue to acquire access to new technologies through
strategic alliances and licensing arrangements.
The increasing miniaturization of semiconductors
and the growing complexity of interconnect technology have also resulted in the blurring of the traditional distinctions among
assembly at different levels of integration: chip, module, board and system. In response to this miniaturization and growing complexity,
we have focused on providing module assembly services and, in addition, our subsidiary Universal Scientific has provided us with
access to process and product technologies at the levels of module, board and system assembly and testing, which helps us to better
anticipate industry trends and take advantage of potential growth opportunities. We expect to continue to combine our packaging,
testing and materials technologies with the expertise of Universal Scientific at the systems level to develop our SiP business.
Strategically Expand and Streamline Production
Capacity
To capitalize on the growing demand for
packaging and testing services, we intend to strategically expand our production capacity, both through internal growth and selective
acquisitions and joint ventures, with a focus on providing cost competitive and innovative packaging and testing services.
We intend to invest in trends that are
essential to the development of the industry. We plan to expand our capacity with respect to, but not limited to, 12-inch wafer
process, bumping, FC-CSP and SiP products to meet demand for smaller form factors, higher performance and higher packaging density.
In addition, we intend to promote our
copper wire solutions to our customers in addition to gold wire. Gold wire is a significant raw material for us. Gold prices,
however, are subject to intense fluctuations and have in the past impacted our profitability. We believe that replacing gold
wire in some of our packages with copper wire technology will not only improve our profitability but will also enable us to
provide more value to our customers by providing lower cost solutions, which could enhance our competitiveness and market
share. We are currently the industry leader in terms of copper wire capacity. We thus plan to capitalize on the overall
industry trend of copper conversion by maintaining our leadership and focusing on integrating copper wire into a wider range
of traditional leadframe-based packages and higher end substrate-based packages.
We expect to focus our packaging and testing
on providing cost competitive services through better management of capacity utilization and efficiency improvements and offer
our services on a large scale with the intention of driving more integrated device manufacturer outsourcing in the long-run.
We evaluate acquisition and joint venture
opportunities on the basis of access to new markets and technology, the enhancement of our production capacity, improvement of
research and development capabilities, economies of scale and management resources, and closer proximity to existing and potential
customers. For example, we acquired controlling interests in Universal Scientific in 2010 to broaden our offerings to include integrated
solutions for electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive,
and storage and server applications. In addition, in May 2015, we entered into a joint venture agreement with TDK Corporation to
invest in ASEEE to further expand our business in embedded substrates. We acquired 779,000,000 common shares (including common
shares represented by American depositary shares) of SPIL through the Initial SPIL Tender Offer in September 2015 and attempted
to acquire an additional 770,000,000 common shares (including common shares represented by American depositary shares) of SPIL
on December 29, 2015 through the Second SPIL Tender Offer. Notwithstanding the failure of the Second SPIL Tender Offer, we announced
in March 2016 that we will continue to seek control of SPIL, with the purpose of effecting the SPIL Merger.
Continue to Leverage Our Presence in
Key Centers of Semiconductor and Electronics Manufacturing
We intend to continue leveraging our presence
in key centers of semiconductor and electronics manufacturing to further grow our business. We have significant packaging, testing
and electronic manufacturing services operations in Taiwan, currently one of the leading centers for outsourced semiconductor and
electronics manufacturing in the world. This presence enables our engineers to work closely with our customers as well as wafer
foundries and other providers of complementary semiconductor and electronic manufacturing services early in the design process,
enhances our responsiveness to the requirements of our customers and shortens production cycles. In addition, as a turnkey service
provider, we are able to offer our products to our customers and complementary service providers within relatively close geographic
proximity. Besides our current operations in Taiwan, we intend to expand our operations in our other subsidiaries.
We have primary operations in the following
locations besides our locations in Taiwan:
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PRC — a fast-growing market for semiconductor and electronics manufacturing in the world;
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Korea — an important center for the manufacturing of memory and communications devices;
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Malaysia and Singapore — a center for outsourced semiconductor manufacturing in Southeast Asia;
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Silicon Valley in California — the preeminent center for semiconductor design, with a concentration of fabless customers;
and
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Japan — an emerging market for packaging and testing outsourcing services as Japanese integrated device manufacturers
increasingly outsource their semiconductor manufacturing requirements.
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Strengthen and Develop Strategic Relationships
with Our Customers and Providers of Complementary Semiconductor Manufacturing Services
We intend to strengthen existing and develop
new strategic relationships with our customers and providers of other complementary semiconductor manufacturing services, such
as wafer foundries, as well as equipment vendors, raw material suppliers and technology research institutes, in order to offer
our customers total semiconductor manufacturing solutions covering all stages of the manufacturing of their products from design
to shipment. In addition, we are working with our customers to co-develop new packaging technologies and designs.
Since 1997, we have maintained a strategic
alliance with TSMC, currently one of the world’s largest dedicated semiconductor foundries, which designates us as their
non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC. Through our strategic
alliance with and close geographic proximity to TSMC, we are able to offer our customers a total semiconductor manufacturing solution
that includes access to foundry services in addition to our packaging, testing and direct shipment services.
Principal Products and Services
We offer a broad range of
semiconductor packaging and testing services. In addition, we have provided electronic manufacturing services since our
acquisition of a controlling interest in Universal Scientific in February 2010. Our package types generally employ either
leadframes or substrates as interconnect materials. The semiconductors we package are used in a wide range of end-use
applications, including communications, computing, consumer electronics, industrial, automotive and other applications. Our
testing services include front-end engineering testing, which is performed during and following the initial circuit design
stage of the semiconductor manufacturing process, wafer probe, final testing and other related semiconductor testing
services. We focus on packaging and testing semiconductors. We offer our customers turnkey services, which consist of
packaging, testing and direct shipment of semiconductors to end users designated by our customers. Our electronic
manufacturing services are used in a wide range of end-use applications, including, but not limited to, computers,
peripherals, communications, industrial applications, automotive electronics, and storage and server applications. In 2015,
our revenues generated from packaging, testing and electronic manufacturing services accounted for 41.2%, 8.9% and 48.8% of
our operating revenues, respectively.
Packaging Services
We offer a broad range of package types
to meet the requirements of our customers, including flip-chip BGA, flip-chip CSP, aCSP (advanced chip scale packages), quad flat
packages (QFP), thin quad flat packages (TQFP), bump chip carrier (BCC), quad flat no-lead (QFN) packages, aQFN (advanced QFN)
and Plastic BGA. In addition, we provide 3D chip packages, such as MAP POP (package on package) and aMAP POP (advanced, laser ablation
type), which enable our customers to mount packages more easily. We also offer other forms of stacked die solutions in different
package types, e.g., stacked die QFN, hybrid BGAs containing stacked wire bond and FC die. Meanwhile, we are developing the cost-effective
solutions to 3D packages, such 2.1D (substrate layer modification) and 2.5D (substrate interposer) to fulfill current low cost
and high performance requirement in parallel with 3D packages with TSV (Through Silicon Via) technology. 2.1D and 2.5D are the
low-tier package solutions for 3D packages and use substrate technology on top layer to connect to top package. 2.5D technology
uses substrate interposer for finer pitch requirement on 3D packages for advanced wafer node in reducing the overall 3D package
cost. Our first product has been a CMOS image sensor with TSV to minimize the form factor. In addition, to meet current trends
toward low cost solutions, we provide copper wire bonding solutions which can be applied to current gold wire products. Furthermore,
we also provide, with high volume manufacturing experience, silver wire bonding with current focus on FCCSP Hybrid packages. We
believe we are among the leaders in such packaging processes and technologies and are well positioned to lead the technology migration
in the semiconductor packaging industry.
We have been engaging in the production
of module-based solutions, including Wi-Fi modules and RF modules, for a number of years. Building on our experience with module
based packaging solutions, we provide customized module services with SiP solutions, to meet more complex marketing requirements.
We also provide automotive product development
and production using copper wire in our services to customers. Having accumulated production experience in using gold wire for
automotive devices over several years, we collaborate with certain customers to develop and release
copper wire for advanced wafer process (CMOS065) in automotive devices (various QFP packages) based on AEC Q-100 Grade 0 criteria.
With our success in CMOS065 automotive products, we are continuously supported by the same customers for 40nm automotive product
(copper wire in BGA) development that will fulfill criteria in addition to Grade 0. In addition to wirebonding packaging for automotive
products, we have begun early development for the 28nm wafer process with hybrid packaging structure (FC bonding + wirebonding).
The copper pillar process will be introduced for flip-chip on wafer form and process wirebonding. In addition, we also offer the
FOWLP solution for radar products according to requests from some tier 1 customers.
Our production also supports MEMS sensors
by applying substrate LGA package structure. The small form factor is down to 2x2 device outline, and by applying chip to wafer
structure (TSV+wirebonding), we can further reduce this to 1.25x1.5 package size. By collaborating with worldwide tier 1 MEMS customers,
we can build our capability in motion sensor assembly and develop our knowledge of environment sensors.
Advanced Packages.
The
semiconductor packaging industry has evolved to meet the requirements of high-performance electronics products. We believe
that there will continue to be growing demand for packaging solutions with increased input/output density, smaller size and
better heat dissipation characteristic.
We have focused on developing our
capabilities in certain packaging solutions, such as aCSP (Wafer level chip scale package), flip-chip BGA, Heat-Spreader
FCBGA, flip-chip CSP, Hybrid FCCSP (Flip-Chip + W/B), Flip-Chip PiP (Package in Package), Flip-Chip PoP (Package on Package),
aS 3™ (Advanced Single Sided Substrate), Fan-Out Wafer Level Packaging, SESUB and 2.5D. Flip-chip BGA technology
replaces wire bonding with wafer bumping for interconnections within the package. Wafer bumping involves the placing of tiny
solder balls, instead of wires, on top of dies for connection to substrates. As compared with more traditional packages,
which allow input/output connection only on the boundaries of the dies, flip-chip packages significantly enhance the
input/output flow by allowing input/output connection over the entire surface of the dies.
Chip scale packages typically have an area
no greater than 1.2 times of the silicon die. For wafer level package, the electrical connections are plated or printed directly
onto the wafer itself, resulting in a package very close to the size of the silicon die. Wafer-level packages do not include an
interposer so they are unlike substrate-based packages, where the die is usually mounted on an interposer which contains electrical
connections in the form of small bumps or balls.
aEASI (Advance Embedded Assembly Substrate
Integration) is a technology which allows the embedding thin chips into substrate build-up layers. aEASI can be used in various
technologies tailored to clients’ demand, such as package solution of miniaturization, and has also been proven to have better
electrical/thermal performance. It also provides flexibility in design (such as for MicroSiP) and the electrical contacts to the
chips are realized by
laser-drilled and metallized micro-vias to replace traditional wire bonding process. aEASI are mainly used in power management
applications.
WL MEMs (Wafer-Level MEMs) is advanced
assembly for MEMs in wafer-level type instead of current LGA or leadframe types and to use TSV or chip to wafer technology. WL
MEMs are mainly used in applications such as pressure, temperature, humidity and gyroscope sensors, among others.
HB POP (High-Bandwidth Package on Package)
packages are new package structure that have the characteristics to extend higher top side ball/lead counts to gain better performance.
We provide numerous technologies to meet
various customer demands. The following table sets forth our principal advanced packages.
Package
Types
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Number
of Leads
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Description
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End-Use
Applications
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Wafer Level Chip Scale Package (aCSP)
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6-120
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A wafer level chip scale package that can be directly attached to the circuit board. Provides shortest electrical path from the die pad to the circuit board, thereby enhancing electrical performance.
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Cellular phones, personal digital assistants, watches, MP3 players, digital cameras and camcorders.
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Flip-Chip Chip Scale Package (FC-CSP, a-
fc
CSP)
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16-750
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A lightweight package with a small, thin profile that provides better protection for chips and better solder joint reliability than other comparable package types.
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RFICs and memory ICs such as digital cameras, DVDs, devices that utilize WiMAX technology, cellular phones, GPS devices and personal computer peripherals.
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Flip-Chip PiP (Package in Package) (FC-CSP PiP)
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500-980
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System In Package for Flip-Chip+Memory die inside with a better electrical performance package types.
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Application processor for smartphone, data modern on portable devices.
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Flip-Chip PoP (Package on Package) (FC-CSP PoP)
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500-1100
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SOC (System On Chip) die for Assembly to Bottom package and then applied for Memory die on top inside with a better electrical performance package types.
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High-tier application processor for smartphone, data modern on portable devices.
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Flip-Chip BGA/ HF FCBGA(High Performance / Heat Spreader / FCBGA)
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16-2916
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Using advanced interconnect technology, the flip-chip BGA packages allow higher density of input/output connection over the entire surface of the dies. HF FCBGA is designed for semiconductor high-performance requirement of high density of interconnects.
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High-performance networking, graphics and server and data center processor applications.
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Hybrid (Flip-Chip and Wire Bonding)
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49-608
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A package technology that stacks a die on top of a probed good die to integrate ASIC and memory (flash, SRAM and DDR) into one package and interconnects them with wire bonding and molding. This technology suffers from known good die issues (i.e., one bad die will ruin the entire module). Rework is also not an option in hybrid packages.
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Digital cameras, smartphones, bluetooth applications and personal digital assistants.
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aS3
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up to 300
|
Ultra-thin profile package which is excellent on middle pin count alternative solution;
standard BT material and manufacturing equipment; and lower cost via on pad.
|
High I/O and short wire length package solution in high performance requirement.
|
Package
Types
|
Number
of Leads
|
Description
|
End-Use
Applications
|
Integrated Passive Device (IPD)
|
less than 20
|
IPD can provide high performance/high Q-factor inductor and single/double layers for lower cost and turnkey solutions and integrate passives into one IPD chip. IPD requires less involvement in the Surface Mount Technology (“SMT”) process, and is considered to be more compatible with current assembly process and suitable for all package solutions.
|
Cellular phones, Wi-Fi module, TV, personal digital assistants.
|
IC Wirebonding.
We provide
IC wirebonding, including leadframe-based packages and substrate-based packages. Leadframe-based packages are packaged by connecting
the die, using wire bonders, to the leadframe with gold wire or copper wire. As packaging technology improves, the number of leads
per package increases. In addition, improvements in leadframe-based packages have reduced the footprint of the package on the circuit
board and improved the electrical performance of the package. To have higher interconnected density and better electrical performance,
semiconductor packages have evolved from leadframe-based packages to substrate-based packages. The key differences of these package
types are: the size of the package; the density of electrical connections the package can support; flexibility at lower costs;
the thermal and electrical characteristics of the package; and environmentally conscious designs. Substrate-based packages generally
employ the BGA design. Whereas traditional leadframe technology places the electrical connection around the perimeter of the package,
the BGA package type places the electrical connection at the bottom of the package surface in the form of small bumps or balls.
These small bumps or balls are typically distributed evenly across the bottom surface of the package, allowing greater distance
between individual leads and higher pin-counts. Our expertise in BGA packages also includes capabilities in stacked-die BGA, which
assembles multiple dies into a single package.
3D packaging has recently gained a lot
of publicity because of the advent of TSV (Through Silicon Via) based chip stacking. Chip stacking has been implemented for many
years, albeit without TSVs. Wire bond die is routinely stacked on leadframes as well as BGA substrates. A more recent implementation
is the stacking of packages as package on package (PoP) and the more specialized package in package (PiP). ASE has advanced PoP
by the invention of aMAPPoP which provides the package interconnects by exposing a molded in solder ball with a laser via. Aside
from being cost effective due to block molding, this PoP also has much lower warpage, greatly improving the stacking yield.
The following table sets forth our principal
IC wirebonding packages.
Package
Types
|
Number
of Leads
|
Description
|
End-Use
Applications
|
Advanced Quad Flat No-Lead Package (aQFN)
|
104-276
|
aQFN allows for leadless, multi-row and fine-pitch leadframe packaging and is characterized by enhanced thermal and electrical performance. aQFN is a cost-effective packaging solution due to its cost-effective materials and simpler packaging process.
|
Telecommunications products, wireless local access networks, personal digital assistants, digital cameras, low to medium lead count packaging information appliances.
|
Quad Flat Package (QFP)/Thin Quad Flat Package (TQFP)
|
44-256
|
Designed for advanced processors and controllers, application-specific integrated circuits and digital signal processors.
|
Multimedia applications, cellular phones, personal computers, automotive and industrial products, hard disk drives, communication boards such as ethernet, integrated services digital networks and notebook computers.
|
Quad Flat No-Lead Package (QFN)/ Dual-Row QFN (DR-QFN)/ Microchip Carrier (MCC)
|
12-160
|
QFN/DRQFN, also known as types of MCC, uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with printed circuit boards. Dual-Row is to increase the lead counts for product requirement.
|
Cellular phones, wireless local access networks, personal digital assistant devices and digital cameras.
|
Bump Chip Carrier (BCC)
|
16-156
|
BCC packages use plating metal pads to connect with printed circuit boards, creating enhanced thermal and electrical performance.
|
Cellular phones, wireless local access networks, personal digital assistant devices and digital cameras.
|
Small Outline Plastic Package (SOP)/Thin Small Outline Plastic Package (TSOP)
|
8-56
|
Designed for memory devices including static random access memory, or SRAM, dynamic random access memory, or DRAM, fast static RAM, also called FSRAM, and flash memory devices.
|
Consumer audio/video and entertainment products, cordless telephones, pagers, fax machines, printers, copiers, personal computer peripherals, automotive parts, telecommunications products, recordable optical disks and hard disk drives.
|
Small Outline Plastic J-Bend Package (SOJ)
|
20-44
|
Designed for memory and low pin-count applications.
|
DRAM memory devices, microcontrollers, digital analog conversions and audio/video applications.
|
Plastic Leaded Chip Carrier (PLCC)
|
28-84
|
Designed for applications that do not require low-profile packages with high density of interconnects.
|
Personal computers, scanners, electronic games and monitors.
|
Plastic Dual In-line Package (PDIP)
|
8-64
|
Designed for consumer electronic products.
|
Telephones, televisions, audio/video applications and computer peripherals.
|
Package
Types
|
Number
of Leads
|
Description
|
End-Use
Applications
|
Plastic BGA
|
119-1520
|
Designed for semiconductors which require the enhanced performance provided by plastic BGA, including personal computer chipsets, graphic controllers and microprocessors, application-specific integrated circuits, digital signal processors and memory devices.
|
Telecommunications products, global positioning systems, notebook computers, disk drives and video cameras.
|
Stacked-Die BGA
|
120-1520
|
Combination of multiple dies in a single package enables package to have multiple functions within a small surface area.
|
Telecommunications products, local area networks, graphics processor applications, digital cameras and pagers.
|
Package-on-Package (POP, aMAP POP)
|
136-904
|
This technology places one package on top of another to integrate different functionalities while maintaining a compact size. It offers procurement flexibility, low cost of ownership, better total system cost and faster time to market. Designers typically use the topmost package for memory applications and the bottommost package for ASICs. By using this technology, the memory known good die issue can be mitigated and the development cycle time and cost can be reduced.
|
Cellular phones, personal digital assistants and system boards.
|
Land Grid Array (LGA)
|
10-72
|
Leadless package which is essentially a BGA package without the solder balls. Based on laminate substrate, land grid array packages allow flexible routing and are capable of multichip module functions.
|
High frequency integrated circuits such as wireless communications products, computers servers, personal computer peripherals and MEMS sensors.
|
SiP and Modules
. We assemble
SiP products, which involve the integration of more than one chip into the same package. As miniaturization requirements for electronic
devices increase, smaller and lighter SiPs are garnering much attention within the industry. Wafer level integration-passive device
technology has become increasingly important. Passive devices such as inductors, capacitors, resistors, filters and diplexers are
those components occupying the largest area in printed circuit boards; therefore, miniaturization and integration is key to SiPs.
This can be achieved through integrating passive components on an individual substrate using a thin film process known as MCM-D
or IPD (Integrated Passive Device). The IPD can then be used as a package substrate or interposer for SiP. This manufacturing method
will enhance product performance and also reduce overall costs. The extension of our current RDL (Redistribution) process can be
used to build high quality factor (Q) inductor and RF circuits on top of CMOS (Complementary Metal–Oxide–Semiconductor)
wafers. IPD is an enabling technology for SiP. It can be used in the following three approaches to enhance product performance:
several solutions to replace discrete components such as Balun and Filter, or to integrate certain passive components and act as
interposer, or to replace PWB and act as a substrate of the module. We have the ability to offer any of the packaging methodologies
related to the above technologies. In addition, we also leverage some of our SMT-based technologies, such as compartment shielding,
double sided module and antenna integration.
We also offer module assembly services,
which combine one or more packaged semiconductors with other components in an integrated module to enable increased functionality,
typically using automated SMT machines and other machinery and equipment for system-level assembly. End-use applications for modules
include cellular phones, wireless LAN applications, Bluetooth applications, camera modules, automotive applications, toys, networking,
storage, and power management.
Interconnect Materials
. Interconnect
materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate,
which is a multi-layer miniature printed circuit board, and is an important element of the electrical characteristics and overall
performance of semiconductors. We produce substrates for use in our packaging operations.
The demand for higher performance semiconductors
in smaller packages will continue to spur the development of IC substrates that can support the advancement in circuit design and
fabrication. As a result, we believe that the market for substrates will grow and the cost of substrates as a percentage of the
total packaging process will increase. In the past, substrates we designed for our customers were produced by independent substrate
manufacturers. Since 1997, we have been designing and producing a portion of our interconnect materials in-house. In 2015, our
interconnect materials operations supplied approximately 27.2% of our consolidated substrate requirements by value.
The following table sets forth, for the
periods indicated, the percentage of our packaging revenues accounted for by each principal type of packaging products or services.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
|
|
|
|
|
|
|
Advanced packaging
(1)
|
|
|
26.7
|
%
|
|
|
25.0
|
%
|
|
|
27.1
|
%
|
IC Wirebonding
(2)
|
|
|
62.5
|
|
|
|
64.4
|
|
|
|
61.9
|
|
Discrete and other
|
|
|
10.8
|
|
|
|
10.6
|
|
|
|
11.0
|
|
Total
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
____________________
__
|
(1)
|
Bumping, flip chip, wafer level chip
scale and SiP package.
|
|
(2)
|
Includes leadframe-based packages
such as QFP/TQFP, QFN/MCC and PLCC/PDIP and substrate-based packages, such as various
BGA package types and LGA.
|
Testing Services
We provide a complete range of semiconductor
testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/RF/(2.5D/3D) module
and SiP/ MEMS/Discrete and other test-related services.
The testing of semiconductors requires
technical expertise and knowledge of the specific applications and functions of the semiconductors tested as well as the testing
equipment utilized. We believe that our testing services employ technology and expertise which are among the most sophisticated
in the semiconductor industry. In addition to maintaining different types of testing equipment, which enables us to test a variety
of semiconductor functions, we work closely with our customers to design effective testing solutions on multiple equipment platforms
for particular semiconductors.
In recent years, complex, high-performance
logic/mixed-signal/RF/(2.5D/3D) module and SiP/MEMS semiconductors have accounted for an increasing portion of our testing revenues.
Front-End Engineering Testing
.
We provide front-end engineering testing services, including customized software development, electrical design validation, and
reliability and failure analysis.
|
·
|
Customized Software Development
. Test engineers develop customized software to test the semiconductors using
our equipment. Customized software, developed on specific test platforms, is required to test the conformity of each particular
semiconductor type to its unique functionality and specification.
|
|
·
|
Electrical Design Validation
. A prototype of the designed semiconductor is subjected to electrical tests using
advanced test equipment and customized software. These tests assess whether the prototype semiconductor complies with a variety
of different operating specifications, including functionality, frequency, voltage, current, timing and temperature range.
|
|
·
|
Reliability Analysis
. Reliability analysis is designed to assess the long-term reliability of the semiconductor
and its suitability of use for intended applications. Reliability testing can include “burn-in” services, which electrically
stress a device, usually at high temperature and voltage, for a period of time long enough to cause the failure of marginal devices.
|
|
·
|
Failure Analysis
. In the event that the prototype semiconductor does not function to specifications during either
the electrical design validation or reliability testing processes, it is typically subjected to failure analysis to determine the
cause of the failure to perform as anticipated. As part of this analysis, the prototype semiconductor may be subjected to a variety
of analyses, including electron beam probing and electrical testing.
|
Wafer Probing
. Wafer probing
is the step immediately before the packaging of semiconductors and involves visual inspection and electrical testing of the processed
wafer for defects to ensure that it meets our customers’ specifications. Wafer probing services require expertise and testing
equipment similar to that used in final testing, and most of our testers can also be used for wafer probing.
Logic/Mixed-signal/RF/(2.5D/3D) module
and SiP/Discrete Final Testing
. We conduct final tests of a wide variety of logic/mixed-signal/RF/(2.5D/3D) module and
SiP/ MEMS /discrete semiconductors, with the number of leads or bumps ranging from the single digits to over ten thousand and operating
frequencies of over 12 Gbps for digital semiconductors and 12 GHz for radio frequency semiconductors, which are at the high end
of the range for the industry. The products we test include semiconductors used for wired, wireless and mobile communications,
home entertainment and personal computer applications, as well as a variety of consumer and application-specific integrated circuits
for various specialized applications.
Other Test-Related Services
.
We provide a broad range of additional test-related services, such as:
|
·
|
Electric Interface Board and Mechanical Test Tool Design
. Process of designing individualized testing apparatuses
such as test load boards, sockets, handler change kits, and probe cards for unique semiconductor devices and packages.
|
|
·
|
Program Conversion
. Process of converting a program from one test platform to different test platforms to reduce
testing costs or optimize testing capacity.
|
|
·
|
Program Efficiency Improvement
. Process of optimizing the program code or increasing site count of parallel tests
to improve testing throughout.
|
|
·
|
Burn-in Testing
. Burn-in testing is the process of electrically stressing a device, usually at high temperature
and voltage, for a period of time to simulate the continuous use of the device to determine whether this use would cause the failure
of marginal devices.
|
|
·
|
Module and SiP Testing
. We provide module and SiP testing through integrated bench solution or automatic test
equipment to our customers with a complete solution with respect to finger print sensor module, camera module, wireless connectivity
devices, global positioning system devices, personal navigation devices and digital video broadcasting devices.
|
|
·
|
Tape and Reel
. Process which involves transferring semiconductors from a tray or tube into a tape-like carrier
for shipment to customers.
|
Drop Shipment Services
.
We offer drop shipment services for shipment of semiconductors directly to end users designated by our customers. Drop
shipment services are provided mostly in conjunction with logic/mixed-signal/RF/3D IC/discrete testing. We provide drop
shipment services to a significant percentage of our testing customers. A substantial portion of our customers at each of our
facilities have qualified these facilities for drop shipment services. Since drop shipment eliminates the additional step of
inspection by the customer before shipment to the end user, quality of service is a key
consideration. We believe that our ability to successfully execute our full range of services, including drop shipment services,
is an important factor in maintaining existing customers as well as attracting new customers.
The following table sets forth, for the
periods indicated, the percentage of our testing revenues accounted for by each type of testing service.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
Testing Services:
|
|
|
|
|
|
|
|
|
|
|
|
|
Front-end engineering testing
|
|
|
2.5
|
%
|
|
|
2.9
|
%
|
|
|
4.2
|
%
|
Wafer probing
|
|
|
19.5
|
|
|
|
20.5
|
|
|
|
20.1
|
|
Final testing
|
|
|
78.0
|
|
|
|
76.6
|
|
|
|
75.7
|
|
Total
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
Electronic Manufacturing Services
.
Since our acquisition of a controlling interest in Universal Scientific in February 2010, we also provide integrated solutions
for electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage
and server applications. The key products and services we offer to our customers, for instance, include:
|
·
|
Computers: motherboards for server & desktop PC; peripheral; port replicator; network attached storage; and technical services;
|
|
·
|
Communications: Wi-Fi; SiP;
|
|
·
|
Consumer products: control boards for flat panel devices; SiP;
|
|
·
|
Automotive electronics: automotive electronic manufacturing services; car LED lighting; regulator/rectifier; and
|
|
·
|
Industrial products: point-of-sale systems; smart handheld devices.
|
Seasonality
See “Item 5. Operating and Financial
Review and Prospects—Operating Results and Trend Information—Quarterly Operating Revenues, Gross Profit and Gross Margin.”
Sales and Marketing
Sales and Marketing Presence
We maintain sales and marketing offices
in Taiwan, the United States, Belgium, Singapore, the PRC, Korea, Malaysia, Japan and a number of other countries. We also have
sales representatives operating in certain other countries in which we do not have offices. Our sales and marketing offices in
Taiwan are located in Hsinchu and Kaohsiung. We conduct marketing research through our customer service personnel and through our
relationships with our customers and suppliers to keep abreast of market trends and developments. We also provide advice in the
area of production process technology to our major customers planning the introduction of new products. In placing orders with
us, our customers specify which of our facilities these orders will go to. Our customers conduct separate qualification and correlation
processes for each of our facilities that they use. See “—Qualification and Correlation by Customers.”
Customers
Our five largest customers together accounted
for approximately 37.2%, 40.3% and 48.2% of our operating revenues in 2013, 2014 and 2015, respectively. One customer accounted
for more than 10.0% of our operating revenues in 2013, 2014 and 2015.
We package and test for our customers a
wide range of products with end-use applications in the communications, computing, and consumer electronics/industrial/automotive
sectors. The following table sets forth a breakdown of the percentage of our operating revenues generated from our packaging and
testing services, for the periods indicated, by the principal end-use applications of the products that we packaged and tested.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
Communications
|
|
|
54.6
|
%
|
|
|
53.3
|
%
|
|
|
54.7
|
%
|
Computing
|
|
|
11.0
|
|
|
|
11.6
|
|
|
|
11.1
|
|
Consumer electronics/industrial/automotive/other
|
|
|
34.4
|
|
|
|
35.1
|
|
|
|
34.2
|
|
Total
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
In addition, we have provided electronic
manufacturing services since our acquisition of the controlling interest of Universal Scientific in February 2010. Our electronic
manufacturing services provide a wide range of products with end-use applications. The following table sets forth a breakdown of
the percentage of our operating revenues generated from our electronic manufacturing services for the periods indicated by the
principal end-use applications.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
Communications
|
|
|
45.4
|
%
|
|
|
55.6
|
%
|
|
|
53.2
|
%
|
Computing
|
|
|
21.7
|
|
|
|
18.0
|
|
|
|
14.3
|
|
Consumer electronics
|
|
|
11.7
|
|
|
|
8.9
|
|
|
|
18.7
|
|
Industrial
|
|
|
12.8
|
|
|
|
10.3
|
|
|
|
8.1
|
|
Automotive
|
|
|
7.4
|
|
|
|
6.3
|
|
|
|
4.9
|
|
Other
|
|
|
1.0
|
|
|
|
0.9
|
|
|
|
0.8
|
|
Total
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
We categorize our operating revenues geographically
based on the country in which the customer is headquartered. The following table sets forth, for the periods indicated, the percentage
breakdown by geographic regions of our operating revenues.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
United States
|
|
|
65.4
|
%
|
|
|
67.8
|
%
|
|
|
72.6
|
%
|
Taiwan
|
|
|
14.2
|
|
|
|
14.3
|
|
|
|
11.5
|
|
Asia
|
|
|
10.8
|
|
|
|
9.4
|
|
|
|
8.1
|
|
Europe
|
|
|
9.3
|
|
|
|
8.1
|
|
|
|
7.3
|
|
Other
|
|
|
0.3
|
|
|
|
0.4
|
|
|
|
0.5
|
|
Total
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
Qualification and Correlation by Customers
Customers generally require that our facilities
undergo a stringent qualification process during which the customer evaluates our operations and production processes, including
engineering, delivery control and testing capabilities. The qualification process typically takes up to several weeks, but can
take longer depending on the requirements of the customer. In the case of our testing operations, after we have been qualified
by a customer and before the customer delivers semiconductors to us for testing in volume, a process known as correlation is undertaken.
During the correlation process, the customer provides us with sample semiconductors to be tested and either provides us with the
test program or requests that we develop a conversion program. In some cases, the customer also provides us with a data log of
results of any testing of the semiconductors that the customer may have conducted previously. The correlation process typically
takes up to two weeks, but can take longer depending on the requirements of the customer. We believe our ability to provide turnkey
services reduces the amount of time spent by our customers in the qualification and correlation process. As a result, customers
utilizing our turnkey services are able to achieve shorter production cycles.
Pricing
We price our packaging services and electronic
manufacturing services, taking into account the actual costs, with reference to prevailing market prices. We price our testing
services primarily on the basis of the amount of time, measured in central processing unit seconds, taken by the automated testing
equipment to execute the test programs specific to the products being tested, as well as the cost of the equipment, with reference
to prevailing market prices. Prices for our packaging, testing and electronic manufacturing services are confirmed at the time
orders are received from customers, which is typically several weeks before delivery.
Raw Materials and Suppliers
Packaging
The principal raw materials used in our
packaging processes are interconnect materials such as leadframes and substrates, gold wire and molding compound. The silicon die,
which is the functional unit of the semiconductor to be packaged, is supplied in the form of silicon wafers. Each silicon wafer
contains a number of identical dies. We receive the wafers from the customers or the foundries on a consignment basis. Consequently,
we generally do not incur inventory costs relating to the silicon wafers used in our packaging process.
We do not maintain large inventories of
leadframes, substrates, gold wire or molding compound, but generally maintain sufficient stock of each principal raw material based
on blanket orders and rolling forecasts of near-term requirements received from customers. In addition, several of our principal
suppliers dedicate portions of their inventories as reserves to meet our production requirements. However, shortages in the supply
of materials experienced by the semiconductor industry have in the past resulted in occasional price adjustments and delivery delays.
For example, in the first half of 2000, the industry experienced a shortage in the supply of IC substrates used in BGA packages,
which, at the time, were only available from a limited number of suppliers located primarily in Japan. In order to reduce the adverse
impact caused by the price fluctuations of raw materials, we have developed substitute raw materials, such as copper, the cost
of which is much cheaper than that of gold. However, we cannot guarantee that we will not experience shortages or price increase
in the near future or that we will be able to obtain adequate supplies of raw materials in a timely manner and at a reasonable
price or to develop any substitute raw materials. In the event of a shortage and/or price increase, we generally inform our customers
and work together to accommodate changes in delivery schedules and/or the price increase of raw materials.
We produce substrates for use in our packaging
operations. In 2015, our interconnect materials operations supplied approximately 27.2% of our consolidated substrate requirements
by value. See “—Principal Products and Services—Interconnect Materials.”
As a result of the “Directive 2002/95/EC
on the restriction of the use of certain hazardous substances in electrical and electronic equipment,” or RoHS, which became
effective on July 1, 2006, we have adjusted our purchases of raw materials and our production processes in order to use raw materials
that comply with this legislation for part of our production. This legislation restricts the use in the European Union, or EU,
of certain substances the EU deems harmful to consumers, which includes certain grades of molding compounds, solder and other raw
materials that are used in our products. Manufacturers of electrical and electronic equipment must comply with this legislation
in order to sell their products in an EU member state. Any failure by us to comply with regulatory environmental standards such
as Directive 2002/95/EC may have a material adverse effect on our results of operations.
Testing
For the functional and burn-in testing
of semiconductors, no other raw materials are needed. However, we often design and outsource the manufacturing of test interface
products such as load boards, probe cards and burn-in boards.
Electronic Manufacturing Services
Our manufacturing processes use many raw
materials in our electronic manufacturing services. For 2015, raw materials costs accounted for 78.4% of our operating revenues
from electronic manufacturing services. Our principal raw materials include, among others, printed circuit boards, integrated chips,
ink, semiconductor devices, computer peripherals and related accessories and electronic
components. Our principal raw materials varied in the past, depending on the end-use products we provided.
To ensure quality, on-time delivery and
pricing competitiveness, we have established both a standardized supplier assessment system and an evaluation mechanism, continued
to maintain close working relationships with our suppliers and jointly created a stable and sustainable supply chain. In addition,
we adjusted the procurement strategy in line with industry trends as well as the nature of raw materials and decentralized the
sources of raw materials to lower our supply concentration risk. However, we cannot assure you that we will not experience any
shortages or price increases in the near future. See “Item 3. Key Information—Risk Factors—Risks Relating to
Our Business—Our revenues and profitability may decline if we are unable to obtain adequate supplies of raw materials in
a timely manner and at a reasonable price.”
Equipment
Packaging
Wire bonding process is important for routing
signal out of die to the system for the IC wire-bonding solutions. Thus, wire bonder is the important equipment used for such process.
As products become finer and finer pitch, bumping process will replace wire bonding process for the signal routing purpose. Thus,
sputter and plater will be the crucial equipment for this type of process.
Wire bonders connect the input/output terminals
on the silicon die using extremely fine gold or copper wire to leads on leadframes or substrates. Typically, a wire bonder may
be used, with minor modifications, for the packaging of different products. As of February 29, 2016, we operated an aggregate of
15,592 wire bonders, of which 15,478 were fine-pitch wire bonders. As of the same date, 25 of the wire bonders operated by us were
consigned by customers and none were leased under operating leases. For the packaging of certain types of substrate-based packages,
die bonders are used in place of wire bonders. The number of bonders at a given facility is commonly used as a measure of the packaging
capacity of the facility. In addition to bonders, we maintain a variety of other types of packaging equipment, such as wafer grind,
wafer mount, wafer saw, automated molding machines, laser markers, solder plate, pad printers, dejunkers, trimmers, formers, substrate
saws and scanners. We purchase our packaging equipment from major international manufactures, including Allring Tech Co., Ltd,
Disco Corporation, BE Semiconductor Industries N.V. and Kulicke & Soffa Industries, Inc..
Testing
Testing equipment is the most capital
intensive component of the testing process. We generally seek to purchase testers from different suppliers with similar
functionality and the ability to test a variety of different semiconductors. We purchase testers from major international
manufacturers, including Teradyne, Inc., Advantest Ltd., LTX-Credence Corporation, Seiko Epson and Tokyo Electron Limited.
Upon acquisition of new testers, we install, configure, calibrate, perform burn-in diagnostic tests on and establish
parameters for the testers based on the anticipated requirements of existing and potential customers and considerations
relating to market trends. As of February 29, 2016, we operated an aggregate of 3,418 testers, of which 945 were consigned by
customers and 84 were leased under operating leases. In addition to testers, we maintain a variety of other types of testing
equipment, such as automated handlers and probers (special handlers for wafer probing), scanners, reformers and computer
workstations for use in software development. Each tester may be attached to a handler or prober. Handlers attach to testers
and transport individual packaged semiconductor to the tester interface. Probers similarly attach to the tester and align
each individual die on a wafer with the interface to the tester.
For the majority of our testing equipment,
we often base our purchases on prior discussions with our customers about their forecast requirements. The balance consists of
testing equipment on consignment from customers and which are dedicated exclusively to the testing of these customers’ specific
products.
Test programs, which consist of the software
that drives the testing of specific semiconductors, are written for a specific testing platform. We sometimes perform test program
conversions that enable us to test semiconductors on multiple test platforms. This portability between testers enables us to allocate
semiconductors tested across our available test capabilities and thereby improve capacity utilization rates. In cases where a customer
requires the testing of a semiconductor product that is not yet fully developed, the customer may provide computer workstations
to us to test specific functions. In cases where a customer has specified testing equipment that was not widely applicable to other products that we test,
we have required the customer to furnish the equipment on a consignment basis.
Electronic Manufacturing Services
The SMT assembly line is the key facility
of our electronic manufacturing operations, and generally includes a printer and one or two high-speed mounters and/or a multi-function
mounter. The SMT assembly process primarily consists of the following three manufacturing steps: (i) solder paste stencil printing,
(ii) component placement and (iii) solder reflow. High-speed SMT assembly systems offer both economical and technical advantages
that may reduce both production cost and time while meeting quality requirements. Thus, SMT has become the most popular assembly
method for sophisticated electronic devices. We had 125 SMT lines as of February 29, 2016.
Intellectual Property
As of February 29, 2016, we held 2,012
Taiwan patents, 915 U.S. patents, 915 PRC patents and 17 patents in other countries related to various semiconductor packaging
technologies and invention, utility and design on our electronic manufacturing services. In addition, we also filed several trademarks
applications in Taiwan, the United States, China and the European Union. For example, “ASE”, “aCSP”, “
a-EASI”, “a-fcCSP”, “aQFN” “a-QFN”, “a-TiV”, “iSiP”, “iWLP”
and “aSiM” have been registered in Taiwan.
We have also entered into various non-exclusive
technology license agreements with other companies involved in the semiconductor manufacturing process, including Fujitsu Limited,
Flip Chip International, L.L.C., Mitsui High-Tec, Inc., Infineon Technologies AG, SPIL and STATS Chippac Ltd. The technology we
license from these companies includes solder bumping, redistribution, ultra CSP assembly, advanced QFN assembly, wafer level packaging
and other technologies used in the production of package types, such as BCC, flip-chip BGA, film BGA, aQFN, Package-in-Package
(PiP) and chip embedding. Our license agreements with Flip Chip International, L.L.C. and SPIL will not expire until the expiration
of the patents licensed by the agreement. Our one license agreement with Infineon Technologies AG will expire on November 5, 2017,
and another license agreement with Infineon Technologies AG will remain in effect until expiration of the Infineon’s patents
licensed by the agreement. Our license agreement with Mitsui High-Tec, Inc. renews automatically each year, and our license agreement
with Fujitsu Limited renews automatically each year unless the parties to the agreement agree otherwise. Our license agreement
with STATS Chippac Ltd. will expire on December 31, 2016.
Our success depends in part on our ability
to obtain, maintain and protect our patents, licenses and other intellectual property rights, including rights under our license
agreements with third parties.
Quality Control
We believe that our process technology
and reputation for high quality and reliable services have been important factors in attracting and retaining leading international
semiconductor companies as customers for our services and/or products. We maintain a quality control staff at each of our facilities.
Our quality control staff typically includes engineers, technicians and other employees who monitor the processes in order to ensure
high quality. Our quality assurance systems impose strict process controls, statistical in-line monitors, supplier control, data
review and management, quality controls and corrective action systems. Our quality control employees operate quality control stations
along production lines, monitor clean room environments and follow up on quality through outgoing product inspection and interaction
with customer service staff. We have established quality control systems that are designed to ensure high quality products/service
to customers, high testing reliability and high production yields at our facilities. We also have established an environmental
management system in order to ensure that we can comply with the environmental standards of our customers and the countries within
which they operate. See “—Raw Materials and Suppliers—Packaging.” In addition, our facilities have been
qualified by all of our major customers after satisfying stringent quality standards prescribed by these customers.
Our packaging and testing operations are
undertaken in clean rooms where air purity, temperature and humidity are controlled. To ensure stability and integrity of our operations,
we maintain clean rooms at our facilities that meet U.S. Federal Standard 209E class 1,000, 10,000 and 100,000 standards.
ISE Labs’ testing facilities in Fremont,
California, are considered suitably equipped by the Defense Logistics Agency to perform the MIL-STD-883 tests on monolithic microcircuits
in accordance with the requirements of military specification MIL-PRF-38535.
We have also obtained many certifications
on our packaging, testing and interconnect materials facilities. Some of these certifications are required by some semiconductor
manufacturers as a threshold indicator of company’s quality control standards or needed by many countries in connection with
sales of industrial products. The table below sets forth the certifications we have for our packaging, testing and interconnect
materials.
Location
|
ISO/TS
16949
(1)
|
ISO
9001
(2)
|
ISO
14001
(3)
|
ISO
17025
(4)
|
ISO
14064-1
(5)
|
IECQ
HSPM
QC080000
(6)
|
Sony
Green
(7)
|
OHSAS
18001
(8)
|
TOSHMS
and SA8000
(9)
|
ISO
50001
(10)
|
Taiwan
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
Shanghai, PRC
|
✓
|
✓
|
✓
|
|
✓
|
✓
|
✓
|
✓
|
|
|
Suzhou/Kunshan/
Weihai/
Wuxi, PRC
|
✓
|
✓
|
✓
|
|
✓
|
✓
|
✓
|
✓
|
|
|
Korea
|
✓
|
✓
|
✓
|
|
|
✓
|
✓
|
✓
|
|
|
Japan
|
✓
|
✓
|
✓
|
|
|
✓
|
✓
|
|
|
|
Malaysia
|
✓
|
✓
|
✓
|
|
|
✓
|
✓
|
|
|
|
Singapore
|
✓
|
✓
|
✓
|
|
|
✓
|
|
✓
|
|
|
California
|
|
✓
|
✓
|
✓
|
|
|
|
|
|
|
_______________________
|
(1)
|
ISO/TS16949 standards were originally
created by the International Automotive Task Force in conjunction with the International
Standards Organization, or ISO. These standards provide for continuous improvement with
an emphasis on the prevention of defects and reduction of variation and waste in the
supply chain.
|
|
(2)
|
ISO 9001 quality standards, set by
the ISO, are related to quality management systems and designed to help organizations
ensure that they meet the needs of customers and other stakeholders while meeting statutory
and regulatory requirements related to the product.
|
|
(3)
|
ISO 14001 sets out the criteria for
an environmental management system. It can be used by any organization that wants to
improve resource efficiency, reduce waste and drive down costs.
|
|
(4)
|
ISO 17025 is the main ISO standard
used by testing and calibration laboratories.
|
|
(5)
|
ISO 14064-1 standard is part of the
ISO 14000 series of International Standards for environmental management. The ISO 14064
standard provides governments, businesses, regions and other organizations with a complementary
set of tools for programs to quantify, monitor, report and verify greenhouse gas emissions.
|
|
(6)
|
IECQ HSPM QC080000 is a certification
designed to manage, reduce and eliminate hazardous substances.
|
|
(7)
|
“Sony Green Partner”
indicates our compliance with the “Sony Green Package” standard requirements.
|
|
(8)
|
OHSAS 18001 is a set of standards
designed upon collaboration with occupational health and safety experts and now offered
by many certification organizations as an indication of compliance with certain standards
for occupational health and safety.
|
|
(9)
|
TOSHMS is the Taiwan Occupational
and Health Management System. SA8000 is the most widely recognized global standard for
managing human rights in the workspace.
|
|
(10)
|
ISO50001 is a standard for an energy
management system. It can be used by any organization that wants to reduce energy costs
and use energy more efficiently.
|
Since our
acquisition of a controlling interest in Universal Scientific in February 2010, we began providing electronic manufacturing services,
for which we also have strict process controls. The table below sets forth the certifications we have obtained for our electronic
manufacturing services facilities.
Location
|
ISO/TS
16949
|
ISO
9001
|
ISO
14001
|
ISO
14064-1
|
IECQ
QC
080000
|
TL
9000
(1)
|
OHSAS
18001
|
ISO
50001
|
ISO
17025
|
ISO
13485
(2)
|
Taiwan
|
✓
|
✓
|
✓
|
✓
|
✓
|
|
✓
|
✓
|
|
|
Shenzhen, PRC
|
|
✓
|
✓
|
✓
|
✓
|
|
✓
|
✓
|
|
|
Shanghai, PRC
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
|
Kunshan, PRC
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
✓
|
|
✓
|
Mexico
|
✓
|
✓
|
✓
|
|
✓
|
|
✓
|
|
|
|
__________________
|
(1)
|
TL 9000 quality management system
sets forth the supply chain quality requirements of the global communications industry.
|
|
(2)
|
ISO 13485 quality management system
sets forth the quality requirements for organizations that are required to consistently
meet customers’ requirements and regulatory requirements in the medical devices
and related services industry.
|
In addition, we have received various vendor
awards from our customers for the quality of our products and services.
Competition
The global market for semiconductor packaging
and testing markets is highly competitive. We face competition from a number of sources and integrated device manufacturers with
in-house packaging and testing capabilities and fabless semiconductor design companies with their own in-house testing capabilities.
Some of these integrated device manufacturers have commenced, or may commence, in-house packaging and testing operations in Asia.
Substantially all of packaging and testing companies that compete with us have established operations in Taiwan and across the
region.
Integrated device manufacturers that use
our services continuously evaluate our performance against their own in-house packaging and testing capabilities. These integrated
device manufacturers may have access to more sophisticated technologies and greater financial and other resources than we do. We
believe, however, that we can offer greater efficiency at lower cost while maintaining equivalent or higher quality for several
reasons. First, as we benefit from specialization and economies of scale by providing services to a large base of customers across
a wide range of products, we are better able to reduce costs and shorten production cycles through high capacity utilization and
process expertise. Second, as a result of our customer base and product offerings, our equipment generally has a longer useful
life. Third, as a result of the continuing reduction of investments in in-house packaging and testing capacity and technology at
integrated device manufacturers, we are better positioned to meet their packaging and testing requirements on a large scale.
Our packaging and testing business also
faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and
technical capabilities to enter and compete effectively with us. For example, TSMC has launched integrated fan-out (“InFO”)
technology, which is scheduled to be put into mass production in 2016. InFO is expected to further intensify the competition in
the packaging and testing industry.
In addition, we have provided electronic
manufacturing services since our acquisition of a controlling interest in Universal Scientific in February 2010. As a result of
this, we face significant competition from other electronic manufacturing services providers, such as Hon Hai Precision Ind. Co.,
Ltd., with comprehensive integration, wide geographic coverage and large production capabilities that enable them to achieve economies
of scale. We believe, however, that we can still achieve satisfactory performance in the market given that we have been able to
provide products with high quality and we are capable of designing new products by cooperating with our customers.
Environmental Matters
Our operations of packaging, interconnect
materials and electronic manufacturing services generate environmental wastes, including gaseous chemical, liquid and solid industrial
wastes. We have installed various types of anti-pollution equipment for the treatment of liquid and gaseous chemical waste generated
at our facilities. We believe that we have adopted adequate anti-pollution measures for the effective maintenance of environmental
protection standards that are consistent with industry practice in the countries in which our facilities are located. In addition,
we believe we are in compliance in all material respects with present environmental laws and regulations applicable to our operations
and facilities.
Furthermore, in order to demonstrate our
commitment to environmental protection, in December 2013, our board of directors approved contributions to environmental protection
efforts in Taiwan in a total amount of not less than NT$3,000.0 million, to be made in the next 30 years. For the years ended December
31, 2014 and 2015, we have made contributions in the amount of NT$100.0 million (US$3.0 million) each, respectively, through ASE
Cultural and Educational Foundation to fund various environmental projects and our board of directors have resolved in a resolution
in January 2016 to contribute NT$100.0 million (US$3.0 million) through ASE Cultural and Educational Foundation in environmental
projects in 2016.
ASE Inc. Kaohsiung facility
Our operations involving wafer-level process
and require wastewater treatment at our K7 Plant have been subject to scrutiny by the Kaohsiung City Environmental Protection Bureau
and the Kaohsiung District Prosecutors office as a result of alleged wastewater disposal violations that occurred on October 1,
2013.
In December 2013, the Kaohsiung City Environmental
Protection Bureau ordered us to suspend the operations at our K7 Plant’s wafer-level process where nickel was used for alleged
wastewater discharge violations and imposed a NT$110.1 million fine against us. The NT$110.1 million fine was later reduced to
NT$109.4 million as ordered by the Kaohsiung City Environmental Protection Bureau. In December 2014, the Kaohsiung City Environmental
Protection Bureau lifted the suspension order and approved the full resumption of operations of our K7 Plant after ordering a series
of examinations, hearings and trial runs. In September 2015, the fine was further reduced to NT$102.0 million (US$3.1 million)
by the Kaohsiung City Environmental Protection Bureau and we received a refund of NT$7.3 million (US$0.2 million) in October 2015.
Although our K7 Plant has resumed full operation, we may be subject to other new environmental claims, charges or investigations
of our K7 Plant or other facilities that may cause similar or more severe interruptions to our business and operations.
With respect to the NT$102.0 million (US$3.1
million) administrative penalty imposed on us by the Kaohsiung City Environmental Protection Bureau, we appealed to the Kaohsiung
High Administrative Court in August 2014 seeking to (i) revoke Kaohsiung City Government’s decision, (ii) lift the administrative
penalty imposed on us and (iii) demand a refund of the administrative penalty. On March 22, 2016, the Kaohsiung High Administrative
Court revoked Kaohsiung City Government’s decision and lifted the administrative penalty. Our demand for a refund of the
fine was dismissed. We appealed to the Supreme Administrative Court on April 14, 2016 against the Kaohsiung High Administrative
Court’s unfavorable ruling in dismissing a refund. The outcome of the proceeding cannot be predicted with certainty.
In connection with the same alleged violations
at our K7 plant, in October 2014, the Kaohsiung District Court ruled that we were in violation of the ROC Waste Disposal Act and
imposed on us a criminal penalty of NT$3.0 million. We appealed the case to the Taiwan High Court Kaohsiung District Branch in
November 2014. In September 2015, the Taiwan High Court Kaohsiung District Branch overturned the decision made by Kaohsiung District
Court and found the Company not guilty and repealed the criminal penalty imposed on the Company. The verdict was final and not
appealable. For additional details of these administrative actions and judicial proceedings related to our K7 Plant see “Item
4. Information on the Company—Property, Plants and Equipment” and see “Item 8. Financial Information—Consolidated
Statements and Other Financial Information—Legal Proceedings.” Defending against any of these pending or future actions
will likely be costly and time-consuming and could significantly divert management’s efforts and resources.
Any future suspension of operations at
K7 Plant or our other facilities may adversely affect our business, financial condition, results of operations and cash flows.
See “Item 3. Key Information—Risk Factors—Risks Relating to Our Business—Any environmental claims or failure
to comply with any present or future environmental regulations, as well as any fire or other industrial accident, may require us
to spend additional funds and may materially and adversely affect our financial condition and results of operations.”
Our estimated environmental capital expenditures
for 2016 will be approximately US$35.0 million. In order to demonstrate our commitment to fulfill our corporate social responsibility
toward environmental protection, in December 2013, our board of directors approved contributions to environmental protection efforts
in Taiwan in a total amount of not less than NT$3,000.0 million, at minimum, to be made in the next 30 years.
Insurance
We have insurance policies covering property
damage and damage to our production facilities, buildings and machinery. In addition, we have insurance policies covering our public
and product liabilities. Significant damage to any of our production facilities would have a material adverse effect on our results
of operations.
We are not insured against the loss of
key personnel.
ORGANIZATIONAL STRUCTURE
The following chart illustrates our corporate
structure including our principal manufacturing subsidiaries as of March 31, 2016. The following chart does not include wholly
owned intermediate holding companies, internal trading companies and those companies without active operations.
Our Consolidated Subsidiaries
ASE Test Taiwan
ASE Test Taiwan, which was acquired in
1990, is our wholly owned subsidiary. It is incorporated in Taiwan and is engaged in the testing of integrated circuits.
ASE Test Malaysia
ASE Test Malaysia, which was established
in 1991, is our wholly owned subsidiary. It is incorporated in Malaysia and is engaged in the packaging and testing of integrated
circuits.
ISE Labs
ISE Labs is our wholly owned subsidiary.
It is a semiconductor company specializing in front-end engineering testing that is incorporated in the United States and has its
principal facilities located in Fremont, California. We acquired 70.0% of the outstanding shares of ISE Labs in 1999 through ASE
Test, and increased our holding to 100.0% through purchases made in 2000 and 2002.
ASE Singapore Pte. Ltd.
ASE Singapore Pte. Ltd., our wholly owned
subsidiary, is incorporated in Singapore and provides packaging and testing services. We acquired ASE Singapore Pte. Ltd., which
was wholly owned by ISE Lab, through our acquisition of ISE Lab in 1999. In January 2011, ASE Singapore II Pte. Ltd. (formerly,
EEMS Test Singapore) merged into ASE Singapore Pte. Ltd. after we acquired ASE Singapore II Pte. Ltd. in August 2010.
ASE Electronics
ASE Material was established in 1997 as
an ROC company for the production of interconnect materials, such as substrates, used in the packaging of semiconductors. We initially
held a majority stake in ASE Material, but acquired the remaining equity by means of a merger of ASE Material with and into us
in August 2004. In August 2006, we spun off the operations originally conducted through ASE Material into our wholly owned subsidiary
ASE Electronics. ASE Electronics currently supplies our packaging operations with a substantial portion of our substrate requirements.
The facilities of ASE Electronics are primarily located in the Nantze Export Processing Zone near our packaging and testing facilities
in Kaohsiung, Taiwan.
ASE Chung Li and ASE Korea
In July 1999, we purchased Motorola’s
Semiconductor Products Sector operations in Chung Li, Taiwan and Paju, South Korea for the packaging and testing of semiconductors,
thereby forming ASE Chung Li and ASE Korea.
In August 2004, we acquired the remaining
outstanding shares of ASE Chung Li that we did not already own and merged ASE Chung Li into us.
ASE Japan
ASE Japan, which we acquired from NEC Electronics
Corporation in May 2004, is our wholly owned subsidiary. It is incorporated in Japan and is engaged in the packaging and testing
of semiconductors.
ASE Shanghai
ASE Shanghai was established in 2001 as
a wholly owned subsidiary of ASE Inc. and began operations in June 2004. ASE Shanghai primarily manufactures and supplies interconnect
materials for our packaging operations.
ASESH AT
We acquired 100% of GAPT, now known as
ASESH AT, in January 2007 for a purchase price of US$60.0 million. ASESH AT is a PRC company based in Shanghai, China that
provides packaging and testing services for a wide range of semiconductors.
ASEN
In September 2007, we acquired 60.0% of
ASEN, formerly known as NXP Semiconductors Suzhou Ltd., from NXP Semiconductors for a purchase price of US$21.6 million. NXP Semiconductors
holds the remaining 40.0% of ASEN. ASEN is based in Suzhou, China and is engaged in semiconductor packaging and testing.
ASEWH
In May 2008, we acquired 100.0% of the
shares of ASEWH from Aimhigh Global Corp. and TCC Steel. ASEWH is based in Weihai, Shandong, China and is engaged in semiconductor
packaging and testing.
ASEKS
ASEKS was set up in 2004 and began operating
in 2010. ASEKS is based in Kunshan, China and is engaged in semiconductor packaging and testing.
Wuxi Tongzhi
In May 2013, we, through our subsidiary
ASESH AT, acquired 100.0% of the shares of Wuxi Tongzhi from Toshiba Semiconductor (Wuxi) Co, Ltd. Wuxi Tongzhi is based in Wuxi,
China and is engaged in semiconductor packaging and testing.
USI Group
USI Group engages primarily in electronic
manufacturing services in relation to computers, consumer electronics, communications, industrial and automotive, among other
services and businesses. We purchased 22.6% of the outstanding shares of Universal Scientific in 1999. We subsequently increased
our holding to 23.3% in 2000. As of December 31, 2009, we held approximately 18.1% of Universal Scientific’s outstanding
equity shares, which allowed us to exercise significant influence over Universal Scientific and therefore accounted for this investment
by the equity method. In February 2010, we, along with our two subsidiaries, J&R Holding Limited and ASE Test, through a cash
and stock tender offer, acquired 641,669,316 common shares of Universal Scientific at NT$21 per share, amounting to NT$13,475.1
million in total, resulting in our controlling ownership over Universal Scientific. As a result, Universal Scientific became our
subsidiary. The shares of Universal Scientific were delisted from the Taiwan Stock Exchange on June 17, 2010, which were previously
listed under the symbol “2350.” In August 2010, we acquired additional 222,243,661 shares of Universal Scientific
through another tender offer at NT$21 per share, amounting to NT$4,667.1 million in total. In September 2012, as part of our internal
business restructuring, our subsidiaries transferred their shareholdings in Universal Scientific to ASE Inc.
In February 2012, Universal
Scientific Shanghai completed its IPO on the Shanghai Stock Exchange. The total proceeds from the IPO was approximately
RMB811.7 million prior to deducting underwriting discounts and commissions. In November 2014, Universal Scientific Shanghai
completed its capital increase by way of domestic private placements through a bidding process, raising a total of
RMB2,063.0 million prior to deducting underwriting discounts and commissions. The issue price per share was RMB27.06. As of
March 31, 2016, we indirectly held 77.3% of the total outstanding shares of Universal Scientific Shanghai through our
subsidiaries USI Inc. and ASE Shanghai.
On February 2, 2015, Universal
Scientific’s shareholders passed a resolution at the shareholders’ meeting to spin-off and assign Universal
Scientific’s investment businesses with a then-estimated value of NT$35,537.8 million (US$1,083.8 million) to USI Inc.
In April 2015, Universal Scientific completed a spin-off of its subsidiaries to USI Inc., a company incorporated under ROC
law. As part of our business realignment effort, we acquired 990.1 million shares in USI Inc. on the spin-off record date,
which resulted in us holding 99.2% of the total then outstanding shares of USI Inc. Following Universal Scientific’s
spin-off of its investment businesses to USI Inc., Universal Scientific carried out a capital reduction plan reducing its
capital from NT$16,413.0 million (US$500.5 million) to NT$400.0 million (US$12.2 million). As a result of such spin-off, as
of April 1, 2015, we held approximately 99.0% of the outstanding common shares of Universal Scientific.
Furthermore, as part of our corporate
reorganization to align each business function to different legal entity groups, the board of directors of ASE Inc. passed a
resolution on September 24, 2015, to announce our intention to carry our the Universal Scientific Share Transfer. The
Universal Scientific Share Transfer was approved by the Investment Commission of MOEA on February 3, 2016 and the majority of
shares were transferred in March 2016, with the remaining share transfer to be completed in May 2016. As of March 31, 2016,
ASE Inc. indirectly held 76.5% of Universal Scientific. Following the completion of the Universal Scientific Share
Transfer, USI Group will operate under the legal entities directly and indirectly held under USI Inc. See “Item 4.
Information on the Company—Information on the Company—History and Development of the Company—USI Group
Restructuring” for more information.
PROPERTY, PLANTS AND EQUIPMENT
We operate a number of packaging, testing
and electronic manufacturing facilities in Asia and the United States. Our facilities provide varying types or levels of services
with respect to different end-product focus, customers, technologies and geographic locations. With our diverse facilities we are
able to tailor our packaging, testing and electronic manufacturing solutions closely to our customers’ needs. The following
table sets forth the location, commencement of operation, primary use, approximate floor space and ownership of our principal facilities
as of February 29, 2016.
Facility
|
Location
|
Commencement
of Operation
|
Primary
Use
|
Approximate
Floor Space
(in sq. ft.)
|
Owned
or Leased
|
ASE Inc.
|
Kaohsiung, ROC
|
March 1984
|
Our primary packaging facility, which offers complete semiconductor manufacturing solutions in conjunction with ASE Test Taiwan and foundries located in Taiwan. Focuses primarily on packaging services such as flip-chip, wafer bumping and fine-pitch wire bonding.
|
5,848,000
|
Land: leased Buildings: owned and leased
|
|
Chung Li, ROC
|
Acquired in July 1999
|
An integrated packaging and testing facility that specializes in semiconductors for communications and consumer applications.
|
3,991,000
|
Land and buildings: owned
|
|
Nantou, ROC
|
April 2011
|
Our facility that provides packaging services.
|
80,000
|
Land and buildings: leased
|
Facility
|
Location
|
Commencement
of Operation
|
Primary
Use
|
Approximate
Floor Space
(in sq. ft.)
|
Owned
or Leased
|
ASE Test Taiwan
|
Kaohsiung, ROC
|
Acquired in April 1990
|
Our primary testing facilities, which offer complete semiconductor manufacturing solutions in conjunction with ASE Inc.’s facility in Kaohsiung and foundries located in Taiwan. Focuses primarily on advanced logic/mixed-signal/RF/3D IC testing for integrated device manufacturers, fabless design companies and system companies.
|
951,000
|
Land: leased Buildings: owned and leased
|
|
Chung Li, ROC
|
October 2001
|
Our primary wafer probing testing facilities.
|
116,000
|
Land and building: leased
|
ASE Test Malaysia
|
Penang, Malaysia
|
February 1991
|
An integrated packaging and testing facility that focuses primarily on the requirements of integrated device manufacturers.
|
828,000
|
Land: leased Buildings: owned
|
ASE Korea
|
Paju, Korea
|
Acquired in July 1999
|
An integrated packaging and testing facility that specializes in semiconductors for radio frequency, sensor and automotive applications.
|
1,079,000
|
Land and buildings: owned
|
ISE Labs
|
California, USA
Texas, USA
|
Acquired in May 1999
|
Front-end engineering and final testing facilities located in northern California in close proximity to some of the world’s largest fabless design companies. Testing facilities located in close proximity to integrated device manufacturers and fabless companies in Texas.
|
96,000
|
Land and buildings: owned and leased
|
ASE Singapore
|
Singapore
|
Acquired in May 1999
|
An integrated packaging and testing facility that specializes in semiconductors for communication, computers and consumer applications.
|
282,000
|
Land: leased Buildings: owned and leased
|
ASE Shanghai
|
Shanghai, China
|
June 2004
|
Design and production of semiconductor packaging materials.
|
1,695,000
|
Land: leased Buildings: owned
|
ASE Japan
|
Takahata, Japan
|
Acquired in May 2004
|
An integrated packaging and testing facility that specializes in semiconductors for cellular phone, household appliance and automotive applications.
|
298,000
|
Land and buildings: leased
|
Facility
|
Location
|
Commencement
of Operation
|
Primary
Use
|
Approximate
Floor Space
(in sq. ft.)
|
Owned
or Leased
|
ASE Electronics
|
Kaohsiung, ROC
|
August 2006
|
Facilities for the design and production of interconnect materials such as substrates used in the packaging of semiconductors.
|
612,000
|
Land: leased Buildings: owned and leased
|
ASESH AT
|
Shanghai, China
|
Acquired in January 2007
|
An integrated packaging and testing facility that specializes in semiconductors for communications and consumer applications.
|
1,379,000
|
Land: leased Buildings: owned
|
ASEN
|
Suzhou, China
|
Acquired in September 2007
|
An integrated packaging and testing facility that specializes in communication applications.
|
433,000
|
Land: leased Buildings: owned
|
ASEWH
|
Shandong, China
|
Acquired in May 2008
|
An integrated packaging and testing facility that specializes in semiconductors for communications, computing and consumer applications.
|
759,000
|
Land: leased Buildings: owned
|
ASEKS
|
Kunshan, China
|
July 2010
|
An integrated packaging and testing facility that specializes in semiconductors for communications and consumer applications.
|
2,310,000
|
Land: leased Buildings: owned
|
Wuxi Tongzhi
|
Wuxi, China
|
Acquired in May 2013
|
An integrated packaging and testing facility that specializes in semiconductors for MP3, Vehicle, household appliance and communications applications.
|
78,000
|
Land and buildings: leased
|
Universal Scientific
|
Nantou, ROC
|
Acquired in February 2010
|
Manufacture and marketing of electronic components, accessories and related products.
|
182,000
|
Land: owned Buildings: owned and leased
|
USI Mexico
|
Guadalajara, Mexico
|
Acquired in February 2010
|
Manufacturing site, which offer motherboard manufacture and system assembly.
|
362,000
|
Land: owned Buildings: owned
|
Facility
|
Location
|
Commencement
of Operation
|
Primary
Use
|
Approximate
Floor Space
(in sq. ft.)
|
Owned
or Leased
|
USISZ
|
Shenzhen, China
|
Acquired in February 2010
|
Manufacturing site, design, manufacture and marketing of motherboards, electronic components, accessories and related products in China.
|
683,000
|
Land: leased Buildings: owned
|
Universal Scientific Shanghai
|
Shanghai, China
|
Acquired in February 2010
|
Manufacturing site, design, manufacture and marketing of motherboards, electronic components, accessories and related products in China.
|
1,484,000
|
Land: leased Buildings: owned and leased
|
UGKS
|
Kunshan, China
|
August 2011
|
Manufacturing site, design, manufacture and marketing of motherboards, electronic components, accessories and related products in China.
|
884,000
|
Land: leased Buildings: leased
|
UGTW
|
Nantou, ROC
|
February 2010
|
Design, manufacture and marketing of electronic components, accessories and related products, and provide related research and development services.
|
400,000
|
Land: owned
Buildings: owned and leased
|
UGJQ
|
Shanghai, China
|
Established in September 2013
|
Design, manufacture and marketing of motherboards, electronic components, accessories and related products in China.
|
647,000
|
Land: leased Buildings: leased
|
Our major leased property in Kaohsiung
consists primarily of leases of land in the Kaohsiung Nantze Export Processing Zone between ASE Inc. and ASE Test Taiwan, as the
lessees, and the Export Processing Zones Administration (“the EPZA”), under the Ministry of Economic Affairs. The leases
have ten-year or twenty-year terms that will expire through June 2035. No sublease or lending of the land is allowed. The EPZA
has the right to adjust the rental price in the event the government revalues the land. The leases are typically renewable with
three-month notice prior to the termination date.
ASE Inc. Kaohsiung Facility
In December 2013, the Kaohsiung City Environmental
Protection Bureau ordered us to suspend the operations at our K7 Plant’s wafer-level process where nickel was used for alleged
wastewater discharge violations and imposed a NT$110.1 million fine against us. The NT$110.1 million fine was later reduced to
NT$109.4 million as ordered by the Kaohsiung City Environmental Protection Bureau. In December 2014, the Kaohsiung City Environmental
Protection Bureau lifted the suspension order and approved the full resumption of operations of our K7 Plant after ordering a series
of examinations, hearings and trial runs. In September 2015, the fine was further reduced to NT$102.0 million (US$3.1 million)
by the Kaohsiung City Environmental Protection Bureau and we received a refund of NT$7.3 million (US$0.2 million) in October 2015.
With respect to the NT$102.0 million (US$3.1
million) administrative penalty imposed on us by the Kaohsiung City Environmental Protection Bureau, we appealed to the Kaohsiung
High Administrative Court in August 2014 seeking to (i) revoke Kaohsiung City Government’s decision, (ii) lift the administrative
penalty imposed on us and (iii) demand a refund of the administrative
penalty. On March 22, 2016, the Kaohsiung High Administrative Court revoked Kaohsiung City Government’s decision and lifted
the administrative penalty. Our demand for a refund of the fine was dismissed. We appealed to the Supreme Administrative Court
on April 14, 2016 against the Kaohsiung High Administrative Court’s unfavorable ruling in dismissing a refund. The outcome
of the proceeding cannot be predicted with certainty.
In connection with the same alleged violations
at our K7 plant, in October 2014, the Kaohsiung District Court ruled that we were in violation of the ROC Waste Disposal Act and
imposed on us a criminal penalty of NT$3.0 million. We appealed the case to the Taiwan High Court Kaohsiung District Branch in
November 2014. In September 2015, the Taiwan High Court Kaohsiung District Branch overturned the decision made by Kaohsiung District
Court and found the Company not guilty and repealed the criminal penalty imposed on the Company. The verdict was final and not
appealable. For additional details of these administrative actions and judicial proceedings related to our K7 Plant see “—Environmental
Matters” and “Item 8. Financial Information—Consolidated Statements and Other Financial Information—Legal
Proceedings.”
Any future suspension of operations at
K7 Plant or our other facilities may adversely affect our business, financial condition, results of operations and cash flows.
See “Item 3. Key Information—Risk Factors—Risks Relating to Our Business—Any environmental claims or failure
to comply with any present or future environmental regulations, as well as any fire or other industrial accident, may require us
to spend additional funds and may materially and adversely affect our financial condition and results of operations.”
We currently do not have plans for significant
expansion, but will re-evaluate our need for future expansion based on market condition and future demand requirements to meet
our expected future growth. For information on the aggregate capacity of our facilities we operate, see “—Business
Overview—Equipment.”
Item 4A. Unresolved Staff Comments
None.
Item 5. Operating and Financial Review and Prospects
OPERATING RESULTS AND TREND
INFORMATION
The following discussion of our business,
financial condition and results of operations should be read in conjunction with our consolidated financial statements, which are
included elsewhere in this annual report. This discussion contains forward-looking statements that reflect our current views with
respect to future events and financial performance. Our actual results may differ materially from those anticipated in these forward-looking
statements as a result of any number of factors, such as those set forth under “Item 3. Key Information—Risk Factors”
and elsewhere in this annual report. See “Special Note Regarding Forward-Looking Statements.”
Overview
We offer a broad range of semiconductor
packaging, testing services and we also offer electronic manufacturing services since our acquisition of a controlling interest
in Universal Scientific in February 2010. In addition to offering each service separately, we also offer turnkey services, which
includes integrated packaging, testing and direct shipment of semiconductors to end users designated by our customers and solution-based
proactive original design manufacturing, with our customers. In addition, we started generating revenues from our real estate business
since 2010. Our operating revenues increased from NT$219,862.4 million in 2013 to NT$256,591.4 million in 2014 and NT$283,302.5
million (US$8,639.9 million) in 2015.
Discussed below are several factors that
have had a significant influence on our financial results in recent years.
Pricing and Revenue Mix
We price our services taking into account
the actual costs involved in providing these services, with reference to prevailing market prices. The majority of our prices and
revenues are denominated in U.S. dollars. Any significant fluctuation in exchange rates, especially between NT dollars and U.S.
dollars, will affect our costs and, in turn, our revenues.
In the case of semiconductor packaging,
the cost of the silicon die, typically the most costly component of the packaged semiconductor, is usually not reflected in our
costs (or revenues) since it is generally supplied by our customers on a consignment basis.
The semiconductor industry is characterized
by a general trend toward declining prices for products and services of a given technology over time. In addition, during periods
of intense competition and adverse conditions in the semiconductor industry, the pace of this decline may be more rapid than in
other years. The average selling prices of our packaging and testing services have experienced sharp declines during such periods
as a result of intense price competition from other market participants that attempt to maintain high capacity utilization levels
in the face of reduced demand.
Declines in average selling prices have
been partially offset historically by changes in our revenue mix, and typically the selling price is largely dependable on the
complexity of the services. In particular, revenues derived from more advanced package types, such as flip-chip BGA, higher density
packages with finer lead-to-lead spacing, or pitch, and testing of more complex, high-performance semiconductors have increased
as a percentage of total revenues. We intend to continue to focus on package types such as bumping, flip-chip BGA and SiP, developing
and offering new technologies in packaging and testing services and expanding our capacity to achieve economies of scale, as well
as improving production efficiencies for older technologies, in order to mitigate the effects of declining average selling prices
on our profitability.
Our profitability for a specific package
type does not depend linearly on its average selling price. Some of our more traditional package types, which typically have low
average selling prices, may well command steadier and sometimes higher margins than more advanced package types with higher average
selling prices.
High Fixed Costs
Our operations, in particular our testing
operations, are characterized by relatively high fixed costs. We expect to continue to incur substantial depreciation and other
expenses especially from our acquisitions of packaging and testing equipment and facilities. Our profitability depends in part
not only on absolute pricing levels for our products/services, but also on utilization rates on equipment, commonly referred to
as “capacity utilization rates.” In particular, increases or decreases in our capacity utilization rates could have
a significant effect on gross margins since the unit cost of our products and/or services generally decreases as fixed costs are
allocated over a larger number of units. The capacity utilization rates of the machinery and equipment installed at our production
facilities typically depend on factors such as the volume and variety of products, the efficiency of our operations in terms of
the loading and adjustment of machinery and equipment for different products, the complexity of the different products to be packaged
or tested, the amount of time set aside for the maintenance and repair of the machinery and equipment, and the experience and schedule
of work shifts of operators.
In 2013, 2014 and 2015, our depreciation,
amortization and rental expense included in operating costs as a percentage of operating revenues was 11.1%, 9.9% and 10.0%, respectively.
The increase in depreciation, amortization and rental expense as a percentage of operating revenues in 2015 compared to 2014 was
primarily a result of a decrease in our packaging and testing revenues.
We begin depreciating our equipment when
the machinery is placed into service. There may sometimes be a time lag between when our equipment is available for use and when
it achieves high levels of utilization. In periods of depressed industry conditions, such as the fourth quarter of 2008, we experienced
lower than expected demand from customers, resulting in an increase in depreciation relative to operating revenues. In particular,
the capacity utilization rates for our testing equipment are more severely affected during an industry downturn as a result of
a decrease in outsourcing demand from integrated device manufacturers, which typically maintain larger in-house testing capacity
than in-house packaging capacity.
In addition to purchasing testers, we also
lease a portion of our testers, which we believe allows us to better manage our capacity utilization rates and cash flow. Since
leased testers can be replaced with more advanced testers upon the expiration of the lease, we believe that these operating leases
have enabled us to improve our capacity utilization rates by allowing us to better align our capacity with changes in equipment
technology and the needs of our customers. For more information about our testers, including the number of testers under lease,
see “Item 4. Information on the Company—Business Overview—Equipment—Testing.”
Raw Material Costs
Substantially all of our raw material costs
are accounted for by packaging, the production of interconnect materials and electronic manufacturing services. In particular,
our electronic manufacturing services acquired in 2010 require more significant quantities of raw materials than our packaging
and production of interconnect materials. In 2013, 2014 and 2015, raw material cost as a percentage of our operating revenues was
45.6%, 45.6% and 50.0%, respectively.
We have developed copper wire to gradually
replace gold wire in the packaging processes in order to benefit from the lower material cost of copper. However, gold wire is
still one of the principal raw materials we use in our packaging processes, and the recent volatility in the price of gold has
affected our operating costs. In 2015, the spot rate for gold fluctuated from approximately US$1,049 per ounce to approximately
US$1,298 per ounce according to the statistics published by The London Bullion Market Association. It may be difficult for us to
adjust our average selling prices to account for fluctuations in the price of gold. We expect that gold wire will continue to be
an important raw material for us and we therefore expect to continue to be subject to significant fluctuations in the price of
gold.
Recent Accounting Pronouncements
Adopted standards for current period
In the current year, we have applied the
following new, revised or amended standards and interpretations that have been issued and effective: Amendments to IFRSs
Annual
Improvements to IFRSs: 2010-2012 Cycle
, Amendments to IFRSs
Annual Improvements to IFRSs: 2011-2013 Cycle
and Amendments
to IAS 19
Defined Benefit Plans: Employee Contributions
. We believe that the adoption of aforementioned standards or interpretations
will not have a significant effect on our accounting policies. Please refer to note 3 to our consolidated financial statements
included in this annual report for more information.
Standards not yet adopted
Among the new, revised or amended standards
and interpretations that have been issued but are not yet effective, we believe that the adoption of the following standards and
interpretations will not have a material effect on our accounting policies: Amendments to IFRSs
Annual Improvements to IFRSs:
2012-2014 Cycl
e, Amendments to IFRS 9 and IFRS 7
Mandatory Effective Date of IFRS 9 and Transition Disclosur
es, Amendments
to IFRS 10, IFRS 12 and IAS 28
Investment Entities: Applying the Consolidation Exception,
Amendments to IFRS 11
Accounting
for Acquisitions of Interests in Joint Operations,
IFRS 14
Regulatory Deferral Accounts,
Amendments to IAS 1
Disclosure
Initiative,
Amendments to IAS 7
Disclosure Initiative,
Amendments to IAS 16 and IAS 38
Clarification of Acceptable
Methods of Depreciation and Amortization
and Amendments to IAS 16 and IAS 41
Agriculture: Bearer Plants.
We are currently
evaluating the impact on our financial position and operating results as a result of the initial adoption of the following standards
and interpretations: IFRS 9
Financial Instruments
, IFRS 15
Revenue from Contracts with Customers
, Amendments to IFRS
15
Clarifications to IFRS 15 “Revenue from Contracts with Customers”
, Amendments to IFRS 10 and IAS 28
Sale
or Contribution of Assets between an Investor and its Associate or Joint Venture
, IFRS 16
Leases
and Amendments to IAS
12
Recognition of Deferred Tax Assets for Unrealized Losses
.
Please refer to note 3 to our consolidated
financial statements included in this annual report for more information.
Critical Accounting Policies and Estimates
Preparation of our consolidated financial
statements requires us to make estimates and judgments in applying our critical accounting policies that have a significant impact
on the results we report in our consolidated financial statements. Our principal accounting policies and critical accounting judgments
and key sources of estimation uncertainty are set forth in detail in note 4 and note 5, respectively, to our consolidated financial
statements included in this annual report. We continually evaluate these estimates and assumptions. Actual results may differ from
these estimates under different assumptions and conditions. Significant accounting policies are summarized as follows.
Revenue
Recognition
. Revenue is measured at the fair value of the consideration received or receivable take into account of estimated
customer returns, rebates and other similar allowances. Revenue from the sale of goods and real estate properties is recognized
when the goods and real estate properties are delivered and titles have passed, at the time all the following conditions are satisfied:
|
·
|
we have transferred to the buyer the significant risks and rewards of ownership of the goods and real estate properties;
|
|
·
|
we retain neither continuing managerial involvement to the degree usually associated with ownership nor effective control over
the goods and real estate properties sold;
|
|
·
|
the amount of revenue can be reliably measured;
|
|
·
|
it is probable that the economic benefits associated with the transaction will flow to us; and
|
|
·
|
the costs incurred or to be incurred in respect of the transaction can be reliably measured.
|
Service income is recognized when services
are rendered.
Our customers bear the title and risk of
loss for those bare semiconductor wafers that we receive and package into finished semiconductors and/or those packaged semiconductors
that we receive and test for performance specifications. Accordingly, the cost of customer-supplied semiconductor materials is
not included in our consolidated financial statements.
A sales discount and return allowance is
recognized in the period during which the sale is recognized, and is estimated based on historical experience, the management’s
judgment and relevant factors.
Impairment of Accounts Receivable
.
We periodically record a provision for doubtful accounts based on our evaluation of the collectability of our accounts receivable.
We first assess whether objective evidence of impairment exists individually in each customer for account receivable, then includes
in a group basis with historical collective experience and similar credit risk characteristics and collectively assess them for
impairment. As of December 31, 2013, 2014 and 2015, the allowance we set aside for doubtful accounts was NT$68.1 million, NT$84.1
million and NT$82.9 million (US$2.5 million), respectively. Additional allowances may be required in the future if the financial
condition of our customers or general economic conditions further deteriorate, and this additional allowance would reduce our net
income.
Inventories
. Inventories
are recorded at cost when acquired and stated at the lower of cost or net realizable values. Inventories are written down to net
realizable value item by item, except for those that may be appropriate to group items of similar or related inventories. Materials
received from customers for processing, mainly of semiconductor wafers, are excluded from inventories, as title and risk of loss
remains with the customers. Net realizable value is the estimated selling prices of inventories less all estimated costs of completion
and estimated costs necessary to make the sale. An allowance for loss on decline in market value and obsolescence is provided based
on the difference between the cost of inventory and the estimated market value based upon assumptions about future demand and market
conditions. Due to rapid technology advancements, we estimate the net realizable value of inventory for obsolete and unmarketable
items at balance sheet date and then write down the cost of inventories to net realizable value. There may be significant changes
in the net realizable value of inventories due to assumptions of future demand within a specific time period.
Realization of Deferred Tax Assets
.
Tax benefits arising from deductible temporary differences, unused tax credits and unused loss carry-forwards are recognized as
deferred tax assets to the extent that it is probable that taxable profits will be available against which those deductible temporary
differences can be utilized. We have considered future taxable income and ongoing prudent and feasible tax planning strategies
in assessing the deferred tax assets. The carrying amounts of deferred tax assets are reviewed at each balance sheet date and reduced
to the extent that it is no longer probable that sufficient taxable profits will be available to allow all or part of deferred
tax assets to be utilized. A previously unrecognized deferred tax asset is also reviewed at each balance sheet date and recognized
to the extent that it has become probable that future taxable profit will allow the deferred tax asset to be utilized. The realizability
of deferred tax assets mainly depends on whether sufficient future profits or taxable temporary differences will be available.
In cases where the actual future profits generated are less than expected, a material reversal of deferred tax assets may arise,
which would be recognized in profit or loss for the period in which such a reversal takes place.
Impairment of Tangible and Intangible
Assets Other than Goodwill
. At each balance sheet date, we review the carrying amounts of the tangible and intangible assets,
excluding goodwill, to determine whether there is any indication that those assets have suffered an impairment loss. If any such
indication exists, the recoverable amount of the asset is estimated in order to determine the extent of the impairment loss. Recoverable
amount is the higher of fair value less costs to sell and value in use. If the recoverable amount of an asset or cash-generating
unit is estimated to be less than its carrying amount, the carrying amount of the asset or cash-generating unit is reduced to its
recoverable amount. The process of evaluating the potential impairment of tangible and intangible assets other than goodwill requires
significant judgment. We are required to make subjective judgments in determining the independent cash flows, useful lives, expected
future revenue and expenses related to the specific asset groups with the consideration of its usage patterns and the nature of
the semiconductor industry. Any changes in these estimates based on changed economic conditions or business strategies could result
in significant impairment charges in future periods.
In 2013, 2014 and 2015, we recognized impairment
losses of NT$495.5 million, NT$297.8 million and NT$258.1 million (US$7.9 million), respectively, on property, plant and equipment.
See notes 13 and 22 to our consolidated financial statements included in this annual report.
Business Combinations
. When
we acquire businesses, goodwill is measured as the excess of the sum of the consideration transferred, the amount of any non-controlling
interests in the acquiree, and the fair value of the acquirer’s previously held equity interest in the acquiree (if any)
over the net of the acquisition-date amounts of the identifiable assets acquired and the liabilities assumed. The allocation of
the purchase price requires management to make significant estimates in determining the fair values of assets acquired and liabilities
assumed, especially with respect to intangible assets. These estimates are based on historical experience, information obtained
from the management of the acquired companies and independent external service providers’ reports. These estimates can include,
but are not limited to, the cash flows that an asset is expected to generate in the future, the appropriate weighted-average cost
of capital, and the synergistic benefits expected to be derived from the acquired business. These estimates are inherently uncertain
and unpredictable. In addition, unanticipated events and circumstances may occur, which may affect the accuracy or validity of
such estimates.
For example, we acquired Universal Scientific
through tender offers in February and August 2010 and EEMS Test Singapore in August 2010; acquired tangible assets and liabilities
as well as identified intangible assets were valued at estimates of their current fair values. The valuation of acquired intangible
assets was determined based on management’s estimates. In addition, the amortization method of these intangible assets is
based on the pattern in which the economic benefits are consumed. In addition, we also recognized goodwill, which represents the
excess of the purchase price over the estimated fair value of the net assets acquired. See our consolidated statements of cash
flow as well as notes 13 to 15 and 26 to our consolidated financial statements included in this annual report.
Goodwill
. Goodwill is tested
for impairment annually and we test for impairment more frequently if an event occurs or circumstances change that would indicate
that the cash-generating unit may be impaired. Goodwill is tested for impairment by comparing the carrying amount of the cash-generating
unit to which the goodwill has been allocated to its recoverable amount. Recoverable amount is defined as the higher of a cash-generating
unit’s fair value less costs to sell or its value in use, which is defined as the present value of the expected future cash
flows generated by the cash-generating unit. In conducting the future cash flow valuation, we make assumptions about future operating
cash flows, the discount rate used to determine present value of future cash flows, and capital expenditures. Future operating
cash flows assumptions include sales growth assumptions, which are based on our historical trends and industry trends, and gross
margin and operating expense growth assumptions, which are based on the historical relationship of those measures compared to sales
and certain cost cutting initiatives. An impairment charge is incurred to the extent the carrying amount exceeds the recoverable
amount. As of December 31, 2015, we had goodwill of NT$10,506.5 million (US$320.4 million). We did not recognize any impairment
loss in 2013, 2014 and 2015. Our conclusion could, however, change in the future if actual results differ from our estimates and
judgments under different assumptions and conditions.
Valuation of
Investments
. We hold investments in the shareholdings of public and non-public entities. We evaluate these
investments periodically for impairment based on market prices, if available, the financial condition of the investees and
economic conditions in the industry. These assessments usually require a significant amount of judgment, as a significant
decline in the market price may be a short-term drop and may not be the best indicator of impairment. Whenever triggering
events or changes in circumstances indicate that an investment may be impaired and carrying amount may not be recoverable, we
measure the impairment based on the market prices, if available, or using market approach based on the financial
result of the investments. Several of the investments held by us are recognized as the equity method investments, debt investments
with no active market or available-for-sale financial assets. Any significant decline in the estimated future cash flows of the
investments or financial assets could affect the value of the investment and indicate that an impairment charge may occur. In 2013
and 2014, we recognized impairment losses of NT$196.3 million and NT$10.4 million, respectively, on our investments. We did not
recognize any impairment loss in 2015. See note 22 to our consolidated financial statements included in this annual report.
Stock-based Compensation
.
Equity-settled share-based payments to employees are measured at the fair value of the equity instruments at the grant date. The
fair value determined at the grant date of the equity-settled share-based payments is expensed on a straight-line basis over the
vesting period, based on our best estimate of equity instruments that will eventually vest, with a corresponding increase in capital
surplus-employee share options. The fair value is measured using the Hull & White Model (2004) incorporated with Ritchken’s
Trinomial Tree Model (1995) or the Black-Scholes Option Pricing Model, depending on the terms and conditions of the plans. The
inputs to the models are share price at the grant date, exercise price, expected volatility, life of the share option and dividend
yield, and risk free interest rates.
Defined Benefit Plans.
Accrued
pension liabilities and the resulting pension expenses under defined benefit pension plans are calculated using the projected unit
credit method. Actuarial assumptions comprise discount rates and expected rates of salary increase. Due to changing market and
economic conditions, the underlying key assumptions may differ from actual developments and may lead to significant changes in
our defined benefit plans. We immediately recognize all actuarial gains and losses arising from defined benefit plans in retained
earnings.
Fair value of Derivatives and Other
Financial Instruments.
We use our judgments applying appropriate valuation techniques commonly applied by market practitioners.
The assumptions applied are based on observable quoted market prices, foreign exchange rates and interest rates to the extent it
is available. The fair value of unquoted equity instruments is estimated based on the assumptions supported by unobservable market
prices and interest rates which are disclosed in note 31 to our consolidated financial statements included in this annual report.
We believe that the valuation techniques and the assumptions applied are appropriate in determining the fair value of financial
instruments.
Results of Operations
The following table sets forth, for the
periods indicated, financial data from our consolidated statements of comprehensive income, expressed as a percentage of operating
revenues.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
|
|
|
Operating revenues
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
Packaging
|
|
|
51.2
|
|
|
|
47.3
|
|
|
|
41.2
|
|
Testing
|
|
|
11.3
|
|
|
|
10.1
|
|
|
|
8.9
|
|
Electronic manufacturing services
|
|
|
35.7
|
|
|
|
41.2
|
|
|
|
48.8
|
|
Others
|
|
|
1.8
|
|
|
|
1.4
|
|
|
|
1.1
|
|
Operating costs
|
|
|
(80.5
|
)
|
|
|
(79.1
|
)
|
|
|
(82.3
|
)
|
Gross profit
|
|
|
19.5
|
|
|
|
20.9
|
|
|
|
17.7
|
|
Operating expenses
|
|
|
(9.5
|
)
|
|
|
(9.3
|
)
|
|
|
(8.9
|
)
|
Other operating income and expenses, net
|
|
|
(0.6
|
)
|
|
|
0.0
|
|
|
|
(0.1
|
)
|
Profit from operations
|
|
|
9.4
|
|
|
|
11.6
|
|
|
|
8.7
|
|
Non-operating expense, net
|
|
|
(0.6
|
)
|
|
|
(0.5
|
)
|
|
|
0.2
|
|
Profit before income tax
|
|
|
8.8
|
|
|
|
11.1
|
|
|
|
8.9
|
|
Income tax expense
|
|
|
(1.6
|
)
|
|
|
(2.2
|
)
|
|
|
(1.5
|
)
|
Profit for the year
|
|
|
7.2
|
%
|
|
|
8.9
|
%
|
|
|
7.4
|
%
|
Attributable to
|
|
|
|
|
|
|
|
|
|
|
|
|
Owners of the Company
|
|
|
7.0
|
%
|
|
|
8.7
|
%
|
|
|
7.1
|
%
|
Non-controlling interests
|
|
|
0.2
|
|
|
|
0.2
|
|
|
|
0.3
|
|
|
|
|
7.2
|
%
|
|
|
8.9
|
%
|
|
|
7.4
|
%
|
Other comprehensive income, net of income tax
|
|
|
1.5
|
|
|
|
2.2
|
|
|
|
0.0
|
|
Total comprehensive income for the year
|
|
|
8.7
|
%
|
|
|
11.1
|
%
|
|
|
7.4
|
%
|
Attributable to
|
|
|
|
|
|
|
|
|
|
|
|
|
Owners of the Company
|
|
|
8.4
|
%
|
|
|
10.7
|
%
|
|
|
7.1
|
%
|
Non-controlling interests
|
|
|
0.3
|
|
|
|
0.4
|
|
|
|
0.3
|
|
|
|
|
8.7
|
%
|
|
|
11.1
|
%
|
|
|
7.4
|
%
|
The following table sets forth, for the
periods indicated, the gross margins for our packaging, testing services and electronic manufacturing services and our total gross
margin. Gross margin is calculated by dividing gross profits by operating revenues.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
|
|
(percentage of operating revenues)
|
Gross profit
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
21.0
|
%
|
|
|
27.2
|
%
|
|
|
26.0
|
%
|
Testing
|
|
|
36.7
|
|
|
|
37.2
|
|
|
|
35.8
|
|
Electronic manufacturing services
|
|
|
10.3
|
|
|
|
8.6
|
|
|
|
6.8
|
|
Overall
|
|
|
19.5
|
%
|
|
|
20.9
|
%
|
|
|
17.7
|
%
|
The following table sets forth, for the
periods indicated, a breakdown of our total operating costs and operating expenses, expressed as a percentage of operating revenues.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
|
|
(percentage of operating revenues)
|
Operating costs
|
|
|
|
|
|
|
|
|
|
|
|
|
Raw materials
|
|
|
45.6
|
%
|
|
|
45.6
|
%
|
|
|
50.0
|
%
|
Labor
|
|
|
12.8
|
|
|
|
13.0
|
|
|
|
12.3
|
|
Depreciation, amortization and rental expense
|
|
|
11.1
|
|
|
|
9.9
|
|
|
|
10.0
|
|
Others
|
|
|
11.0
|
|
|
|
10.6
|
|
|
|
10.0
|
|
Total operating costs
|
|
|
80.5
|
%
|
|
|
79.1
|
%
|
|
|
82.3
|
%
|
Operating expenses
|
|
|
|
|
|
|
|
|
|
|
|
|
Selling
|
|
|
1.4
|
%
|
|
|
1.3
|
%
|
|
|
1.3
|
%
|
General and administrative
|
|
|
4.0
|
|
|
|
4.0
|
|
|
|
3.8
|
|
Research and development
|
|
|
4.1
|
|
|
|
4.0
|
|
|
|
3.8
|
|
Total operating expenses
|
|
|
9.5
|
%
|
|
|
9.3
|
%
|
|
|
8.9
|
%
|
Year ended December 31, 2015 Compared
to Year Ended December 31, 2014
Operating Revenues
. Operating
revenues increased 10.4% to NT$283,302.5 million (US$8,639.9 million) in 2015 from NT$256,591.4 million in 2014, primarily due
to an increase in revenues from our electronic manufacturing services business.
Packaging revenues decreased 3.9%
to NT$116,607.3 million (US$3,556.2 million) in 2015 from NT$121,336.5 million in 2014. Testing revenues decreased 2.6% to
NT$25,191.9 million (US$768.3 million) in 2015 from NT$25,874.7 million in 2014. Revenues from our electronic manufacturing services
business increased 30.7% to NT$138,242.1 million (US$4,216.0 million) in 2015 from NT$105,784.4 million in 2014. The decrease in
packaging and testing revenues was primarily due to slightly soft demand in the end-application market. The increase in the revenues
from our electronic manufacturing services business was primarily due to an increase in the outsourced orders for communications
and consumer products.
Gross Profit
. Gross profit
decreased 6.4% to NT$50,135.2 million (US$1,529.0 million) in 2015 from NT$53,588.5 million in 2014. Our gross profit as a percentage
of operating revenues, or gross margin, was 17.7% in 2015 compared to 20.9% in 2014. The decrease was primarily due
to the growth in our electronic manufacturing services business with a lower gross margin. Raw material costs in 2015 were NT$141,778.8
million (US$4,323.8 million) compared to NT$116,998.6 million in 2014. As a percentage of operating revenues, raw material costs
increased to 50.0% in 2015 from 45.6% in 2014 primarily due to an increase in orders in our electronic manufacturing services business,
which required relatively higher raw material costs compared to our other businesses. Depreciation, amortization and rental expenses
were NT$28,191.8 million (US$859.8 million) in 2015 compared to NT$25,386.7 million in 2014. As a percentage of operating revenues,
depreciation, amortization and rental expenses increased to 10.0% in 2015 from 9.9% in 2014 due to a decrease in our packaging
and testing revenues. Labor cost in 2015 was NT$34,720.4 million (US$1,058.9 million) compared to NT$33,243.2 million in 2014.
As a percentage of operating revenues, labor cost decreased to 12.3% in 2015 from 13.0% in 2014 primarily due to the growth
of our operating revenues. Our gross margin for our packaging business decreased to 26.0% in 2015 from 27.2% in 2014 due to an
increase in labor costs and depreciation expenses as a percentage of packaging revenue, partially offset by a decrease in raw material
costs as a percentage of packaging revenues. Our gross margin for our testing business decreased to 35.8% in 2015 from 37.2% in
2014 primarily due to an increase in depreciation expenses as a percentage of testing revenues. Our gross margin for our electronic
manufacturing services business decreased to 6.8% in 2015 from 8.6% in 2014 primarily due to an increase in the sale of products
with lower gross margins.
Profit from operations
. Profit
from operations decreased 17.5% to NT$24,633.1 million (US$751.3 million) in 2015 compared to NT$29,874.5 million in 2014. Our
profit from operations as a percentage of operating revenues, or operating margin, decreased to 8.7% in 2015 from 11.6% in 2014
primarily due to a decrease in gross margin. Operating expenses increased 5.5% to NT$25,250.6 million (US$770.1 million) in 2015
compared to NT$23,942.7 million in 2014. The increase in operating expenses was primarily due to an increase in general and administrative
expense, as well as research and development expense. General and administrative expense increased 5.0% to NT$10,724.6 million
(US$327.1 million) in 2015 from NT$10,214.8 million in 2014, primarily due to the professional service fees incurred from our strategic
investments in 2015, including that incurred for the Initial SPIL Tender Offer and Second SPIL Tender Offer. General and administrative
expense as a percentage of our operating revenues was 3.8% in 2015, compared to 4.0% in 2014. Research and development expense
increased 6.3% to NT$10,937.5 million (US$333.6 million), accounting for 3.8% of operating revenues in 2015, compared to NT$10,289.7
million, accounting for 4.0% of operating revenues in 2014. This increase in the research and development expense was primarily
due to an increase in salary expenses from increased headcounts. Selling expense increased 4.4% to NT$3,588.5 million (US$109.4
million) in 2015 from NT$3,438.2million in 2014. This increase was primarily due to an increase in salary and bonus expenses primarily
due to salary raises.
Selling expense as a percentage of operating revenues was 1.3% in both 2015 and 2014. We had
a net other operating expense of NT$251.5 million (US$7.6 million) in 2015 compared to a net other operating income of NT$228.7
million in 2014. The increase in net other operating expense was primarily due to (i) the reversal of the settlement with Tessera
in relation to patent infringement claims in the amount of US$3.0 million in the fourth quarter of 2014 due to the reduction of
the final settlement amount from US$30.0 million to US$27.0 million and (ii) the receipt of direct reimbursement from Citibank,
N.A., the depositary bank for our ADR programs, in the amount of US$4.1 million (net of U.S. withholding tax) in 2014.
Non-Operating Expense, Net
.
We had a net non-operating income of NT$660.1 million (US$20.1 million) in 2015 compared to a net non-operating expense
of NT$1,339.4 million in 2014. This increase was primarily due to (i) an increase in non-operating income due to the change in
the net gain/loss on valuation of financial assets and liabilities and net foreign exchange gain/loss which resulted in an increase
in net gain from NT$616.9 million in 2014 to NT$1,759.6 million (US$53.7 million) in 2015, (ii) an increase in non-operating income
due to the increase in the income earned from equity method investments from the loss of NT$121.9 million in 2014 to the profit
of NT$407.6 million (US$12.4 million) in 2015 and (iii) an increase in non-operating income due to an increase in dividends income
from NT$101.3 million in 2014 to NT$397.0 million (US$12.1 million) in 2015.
Net Profit
.
Net
profit, excluding non-controlling interests, decreased 10.0% to NT$20,013.5 million (US$610.4 million) in 2015 compared to NT$22,228.6
million in 2014. Our diluted earnings per ADS decreased to NT$12.55 (US$0.38) in 2015 compared to diluted earnings per ADS of NT$13.93
in 2014. Our income tax expense decreased 23.9% to NT$4,311.1 million (US$131.5 million) in 2015 compared to NT$5,666.0 million
in 2014, primarily due to a decrease in the income tax on undistributed earnings.
Year ended December 31, 2014 Compared
to Year Ended December 31, 2013
Operating Revenues
. Operating
revenues increased 16.7% to NT$256,591.4 million in 2014 from NT$219,862.4 million in 2013, primarily due to an increase in revenues
from our electronic manufacturing services business. Packaging revenues increased 7.8% to NT$121,336.5 million in 2014 from NT$112,603.9 million
in 2013. Testing revenues increased 4.6% to NT$25,874.7 million in 2014 from NT$24,732.2 million in 2013. Revenues from our electronic
manufacturing services business increased 34.7% to NT$105,784.4 million in 2014 from NT$78,530.6 million in 2013. The increase
in packaging revenues was primarily due to an increase in the demand for our services and an increase in the revenues generated
from our copper wire bonding solutions. The increase in testing revenues was primarily due to an increase in sales volume for our
testing business. The increase in the revenues from our electronic manufacturing services business was primarily due to an increase
in the outsourced orders for communications products.
Gross Profit
. Gross profit
increased 25.1% to NT$53,588.5 million in 2014 from NT$42,822.0 million in 2013. Our gross profit as a percentage of operating
revenues, or gross margin, was 20.9% in 2014 compared to 19.5% in 2013. The increase was primarily due to a decrease in depreciation
expenses as a percentage of our operating revenues. Raw material costs in 2014 were NT$116,998.6 million compared to NT$100,314.5
million in 2013 primarily due to an increase in revenue contribution by our electronic manufacturing services business with higher
raw material costs, partially offset by a decrease in the price of gold. As a percentage of operating revenues, raw material costs
were 45.6% in both 2014 and 2013. Depreciation, amortization and rental expenses were NT$25,386.7 million in 2014 compared to NT$24,447.0 million
in 2013. As a percentage of operating revenues, depreciation, amortization and rental expenses decreased to 9.9% in 2014 from 11.1%
in 2013 due to increase in revenue. Labor cost in 2014 was NT$33,243.2 million compared to NT$28,053.5 million in 2013.
As
a percentage of operating revenues, labor cost increased to 13.0% in 2014 from 12.8% in 2013 primarily due to an increase in salary
and bonus payments as a result of increase in headcount. Our gross margin for our packaging business increased to 27.2% in 2014
from 21.0% in 2013 due to a decrease in raw material costs as a percentage of packaging revenues. Our gross margin for our testing
business increased to 37.2% in 2014 from 36.7% in 2013 primarily due to a decrease in depreciation as a percentage of testing revenues
but partially offset by an increase in labor costs as a percentage of testing revenues. Our gross margin for our electronic manufacturing
services business decreased to 8.6% in 2014 from 10.3% in 2013 primarily due to a change in product mix.
Profit from operations
. Profit
from operations increased 44.2% to NT$29,874.5 million in 2014 compared to NT$20,713.4 million in 2013. Our profit from operations
as a percentage of operating revenues, or operating margin, increased to 11.6% in 2014 from 9.4% in 2013 primarily due to an increase
in gross margin. Operating expenses increased 15.3% to NT$23,942.7 million in 2014 compared to NT$20,760.4 million in 2013.
The increase in operating expenses was primarily due to an increase in general and administrative expense, as well as research
and development expense. General and administrative expense increased 17.2% to NT$10,214.8 million in 2014 from NT$8,712.9 million
in 2013, primarily due to an increase in salary and bonus payments due to an increase in headcount. General and administrative
expense as a percentage of our operating revenues was 4.0% in both 2014 and 2013. Research and development expense increased 13.5%
to NT$10,289.7 million, accounting for 4.0% of operating revenues in 2014, compared to NT$9,064.7 million, accounting for 4.1%
of operating revenues in 2013. This increase in the research and development expense was primarily due to an increase in salary
and bonus payments due to increase in headcount. Selling expense increased 15.3% to NT$3,438.2 million in 2014 from NT$2,982.8 million
in 2013. This increase was primarily due to an increase in salary and bonus payments due to increase in headcount and an increase
in sampling costs.
Selling expense as a percentage of operating revenues was 1.3% in 2014, compared to 1.4% in 2013.
We had a net other operating income of NT$228.6 million in 2014 compared to a net other operating expense of NT$1,348.2 million
in 2013. The increase in net other operating income was primarily due to the settlement with Tessera in relation to patent infringement
claims in 2013. We recognized the settlement in the amount of US$30.0 million in the fourth quarter of 2013, and reversed US$3.0
million in the fourth quarter of 2014 due to the reduction of the final settlement amount from US$30.0 million to US$27.0 million.
Non-Operating Expense, Net
.
We had a net non-operating expense of NT$1,339.4 million in 2014 compared to a net non-operating expense of NT$1,343.6
million in 2013. This decrease was primarily due to (i) a decrease in non-operating expenses as a result of decrease in impairment
loss on financial assets from NT$196.3 million in 2013 to NT$10.4 million in 2014 and (ii) an increase in non-operating income
due to the change in the net gain/loss on valuation of financial assets and liabilities and net foreign exchange gain/loss which
resulted in an increase in net gain from NT$519.2 million in 2013 to NT$616.9 million in 2014, but partially offset by (i) an increase
in non-operating expenses due to an increase in finance costs (consisting mainly of interest expenses) from NT$2,307.5 million
in 2013 to NT$2,354.1 million in 2014, (ii) a decrease in non-operating income due to the decrease in the income earned from equity
investments from the profit of NT$22.0 million in 2013 compared to the loss of NT$121.9 million in 2014, and (iii) a decrease in
non-operating income due to the decrease in the net gain on disposal of financial assets from NT$96.2 million in 2013 to NT$0.8
million in 2014.
Net Profit
.
Net
profit, excluding non-controlling interests, increased 44.3% to NT$22,228.6 million in 2014 compared to NT$15,404.5 million in
2013. Our diluted earnings per ADS increased to NT$13.93 in 2014 compared to diluted earnings per ADS of NT$9.96 in 2013. Our income
tax expense increased 61.9% to NT$5,666.0 million in 2014 compared to NT$3,499.6 million in 2013, primarily due to an increase
in the profit before income tax and income tax on undistributed earnings, partially offset by an increase in the tax credit.
Quarterly Operating Revenues, Gross Profit and Gross Margin
The following table sets forth our unaudited
consolidated operating revenues, gross profit and gross margin for the quarterly periods indicated. The unaudited quarterly results
reflect all adjustments, consisting of normal recurring adjustments, that, in the opinion of management, are necessary for a fair
presentation of the amounts, on a basis consistent with the audited consolidated financial statements included elsewhere in this
annual report. You should read the following table in conjunction with the audited consolidated financial statements and related
notes included elsewhere in this annual report. Our operating revenues, gross profit and gross margin for any quarter are not necessarily
indicative of the results for any future period. Our quarterly operating revenues, gross profit and gross margin may fluctuate
significantly.
|
|
Quarter Ended
|
|
|
Mar. 31,
2014
|
|
Jun. 30,
2014
|
|
Sept. 30,
2014
|
|
Dec. 31,
2014
|
|
Mar. 31,
2015
|
|
Jun. 30,
2015
|
|
Sept. 30,
2015
|
|
Dec. 31,
2015
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
|
(in millions)
|
Consolidated Operating Revenues
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
26,721.8
|
|
|
|
30,641.2
|
|
|
|
32,031.1
|
|
|
|
31,942.4
|
|
|
|
29,320.9
|
|
|
|
28,617.8
|
|
|
|
29,575.1
|
|
|
|
29,093.5
|
|
Testing
|
|
|
5,784.6
|
|
|
|
6,599.8
|
|
|
|
6,827.5
|
|
|
|
6,662.8
|
|
|
|
6,179.5
|
|
|
|
6,230.8
|
|
|
|
6,425.7
|
|
|
|
6,355.9
|
|
Electronic manufacturing services
|
|
|
21,365.4
|
|
|
|
20,500.6
|
|
|
|
26,740.5
|
|
|
|
37,177.9
|
|
|
|
28,300.1
|
|
|
|
34,534.0
|
|
|
|
36,107.2
|
|
|
|
39,300.8
|
|
Others
|
|
|
827.8
|
|
|
|
873.6
|
|
|
|
1,032.8
|
|
|
|
861.6
|
|
|
|
861.6
|
|
|
|
839.2
|
|
|
|
762.4
|
|
|
|
798.0
|
|
Total
|
|
|
54,699.6
|
|
|
|
58,615.2
|
|
|
|
66,631.9
|
|
|
|
76,644.7
|
|
|
|
64,662.1
|
|
|
|
70,221.8
|
|
|
|
72,870.4
|
|
|
|
75,548.2
|
|
Consolidated Gross Profit
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
6,101.4
|
|
|
|
7,694.3
|
|
|
|
8,728.9
|
|
|
|
10,515.6
|
|
|
|
7,543.2
|
|
|
|
7,226.2
|
|
|
|
7,809.7
|
|
|
|
7,769.4
|
|
Testing
|
|
|
1,867.3
|
|
|
|
2,458.2
|
|
|
|
2,716.8
|
|
|
|
2,589.7
|
|
|
|
2,121.7
|
|
|
|
2,190.7
|
|
|
|
2,321.6
|
|
|
|
2,391.7
|
|
Electronic manufacturing services
|
|
|
2,006.6
|
|
|
|
2,007.1
|
|
|
|
2,239.4
|
|
|
|
2,865.8
|
|
|
|
2,238.3
|
|
|
|
1,779.7
|
|
|
|
2,567.5
|
|
|
|
2,847.9
|
|
Others
|
|
|
383.9
|
|
|
|
450.8
|
|
|
|
522.9
|
|
|
|
439.8
|
|
|
|
410.2
|
|
|
|
368.7
|
|
|
|
288.8
|
|
|
|
259.9
|
|
Total
|
|
|
10,359.2
|
|
|
|
12,610.4
|
|
|
|
14,208.0
|
|
|
|
16,410.9
|
|
|
|
12,313.4
|
|
|
|
11,565.3
|
|
|
|
12,987.6
|
|
|
|
13,268.9
|
|
Consolidated Gross Profit (%)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Packaging
|
|
|
22.8
|
%
|
|
|
25.1
|
%
|
|
|
27.3
|
%
|
|
|
32.9
|
%
|
|
|
25.7
|
%
|
|
|
25.3
|
%
|
|
|
26.4
|
%
|
|
|
26.7
|
%
|
Testing
|
|
|
32.3
|
|
|
|
37.2
|
|
|
|
39.8
|
|
|
|
38.9
|
|
|
|
34.3
|
|
|
|
35.2
|
|
|
|
36.1
|
|
|
|
37.6
|
|
Electronic manufacturing services
|
|
|
9.4
|
|
|
|
9.8
|
|
|
|
8.4
|
|
|
|
7.7
|
|
|
|
7.9
|
|
|
|
5.2
|
|
|
|
7.1
|
|
|
|
7.2
|
|
Overall
|
|
|
18.9
|
%
|
|
|
21.5
|
%
|
|
|
21.3
|
%
|
|
|
21.4
|
%
|
|
|
19.0
|
%
|
|
|
16.5
|
%
|
|
|
17.8
|
%
|
|
|
17.6
|
%
|
Our results of operations are affected
by seasonality. In general, our first quarter operating revenues have historically decreased over the preceding fourth quarter,
primarily due to the combined effects of holidays in the United States, Taiwan and elsewhere in Asia. Moreover, the increase or
decrease in operating revenues of a particular quarter as compared with the immediately preceding quarter varies significantly.
See “Item 3. Key Information—Risk Factors—Risks Relating to Our Business—Our operating results are subject
to significant fluctuations, which could adversely affect the market value of your investment.”
Exchange Rate Fluctuations
For quantitative and qualitative disclosure
of our exposure to foreign currency exchange rate risk, see “Item 11. Quantitative and Qualitative Disclosures about Market
Risk—Market Risk—Foreign Currency Exchange Rate Risk.”
Taxation
The corporate income tax rate in the ROC
decreased from 25% to 17%, effective since January 1, 2010. The ROC Statute for Upgrading Industries, which provided various tax
incentives including investment tax credits, tax exemptions and tax holidays for companies, expired on December 31, 2009.
Under this statute, we had been granted tax holidays covering the portion of our income attributable to eligible machinery and
equipment that were procured with cash infusions from our shareholders or after the capitalization of retained earnings through
the issuance of stock dividends, and tax credits of 7% for the purchase of qualifying manufacturing equipment. We can continue
to enjoy the tax holidays that have been granted to us by the ROC tax authority. On April 16, 2010, the Legislative Yuan of ROC
passed the Industrial Innovation Act, effective from January 1, 2010 to December 31, 2019. Under the prevailing Industrial Innovation
Act, a profit-seeking enterprise may deduct up to (i) 15% of its research and development expenditures from its income tax payable
for the fiscal year in which these expenditures are incurred; or (ii) 10% of its research and development expenditures from its
income tax payable for the fiscal year in which these expenditures are incurred or the following two years. However, the deduction
may not exceed 30% of the income tax payable for that fiscal year. Under the Alternative Minimum Tax Act (the “AMT Act”)
which took effect on January 2006 and was amended in August 2012, when the amount of the regular income tax calculated pursuant
to the AMT Act is below the amount of the alternative minimum tax, or the AMT, a taxpayer is required to pay the difference between
the AMT and the said regular income tax, which becomes the AMT payable. Taxable income for calculating the AMT includes most sources
of income that are exempted from income tax under various legislations such as tax holidays. However, there are grandfathered treatments
for the tax holidays approved by the tax authority before the AMT Act took effect. Under the amended AMT Act, the standard deduction
for taxable income that applies to business entities decreased from NT$2.0 million to NT$0.5 million and the tax rate that applies
to business entities increased from 10% to 12%. The amendment to the AMT Act became effective on January 1, 2013.
As of February 29, 2016, we had several
five-year tax holidays on income derived from a portion of our operations in Kaohsiung, Taiwan, which will expire through December
31, 2016 to December 31, 2020. In addition, some of our subsidiaries, such as ASE Test Taiwan and ASE Electronics, are entitled
to certain tax exemptions on income derived from a portion of their respective operations.
The aggregate tax benefits
of such exemptions for the years ended December 31, 2013, 2014 and 2015 were NT$373.1 million, NT$623.7 million and NT$538.0 million
(US$16.4 million), respectively.
In addition, since we have facilities located
in special export zones such as the Nantze Export Processing Zone in Taiwan, we enjoy exemptions from various import duties, commodity
taxes and business taxes on imported machinery, equipment, raw materials and components which are directly used for manufacturing
finished goods. We also enjoy exemptions from commodity and business taxes on finished goods exported or sold to others within
the zones.
Under the ROC Income Tax Act, after January
1998, all earnings generated in a year which are not distributed to shareholders as dividends in the following year will be assessed
a 10% undistributed earnings tax. As a result, if we do not distribute all of our annual earnings as either cash or stock dividends
in the following year, these undistributed earnings will be subject to the 10% undistributed earnings tax. However, when we declare
a dividend out of those undistributed earnings on which the 10% undistributed earnings tax had been paid, up to 5% of such undistributed
earnings tax may be credited against the withholding tax imposed on the dividends.
In 2014, our effective income tax rate
(including the corporate income tax rate and the 10% undistributed earnings tax) increased to 20% from 18% in 2013 primarily due
to an increase in undistributed earnings tax. In 2015, our effective income tax rate decreased to 17% from 20% in 2014 primarily
due to a decrease in undistributed earnings tax. We believe that our future estimated taxable income will be sufficient to utilize
our deferred tax assets recorded as of December 31, 2015.
Inflation
We do not believe that inflation in Taiwan
or elsewhere has had a material impact on our results of operations.
LIQUIDITY AND CAPITAL RESOURCES
We have historically been able to satisfy
our working capital needs from our cash flow from operations. We have historically funded our capacity expansion from internally
generated cash and, to the extent necessary, the issuance of equity securities and borrowings. If adequate funds are not available
on satisfactory terms, we may be forced to curtail our expansion plans. Moreover, our ability to meet our working capital needs
from cash flow from operations will be affected by the demand for our packaging, testing services and electronic manufacturing
services, which in turn may be affected by several factors. Many of these factors are outside of our control, such as economic
downturns and declines in the prices of our services or products caused by a downturn in the industry. See “Item 3. Key Information—Risk
Factors—Risks Relating to Our Business—Our operating results are subject to significant fluctuations, which could adversely
affect the market value of your investment.” To the extent we do not generate sufficient cash flow from our operations to
meet our cash requirements, we will have to rely on external financing.
Net cash provided by operating activities
amounted to NT$57,548.3 million (US$1,755.1 million) in 2015 primarily as a result of (i) our operation performance with profit
before income tax of NT$25,293.2 million (US$771.4 million) and (ii) our non-cash depreciation and amortization in the amount of
NT$29,518.7 million (US$900.2 million). Net cash provided by operating activities amounted to NT$45,863.5 million in 2014, primarily
as a result of (i) our operation performance with profit before income tax of NT$28,535.1 million and (ii) our non-cash depreciation
and amortization in the amount of NT$26,350.8 million. Net cash provided by operating activities amounted to NT$41,296.0 million
in 2013, primarily as a result of
(i) our operation performance with profit before income tax of NT$19,369.8 million
and (ii) our non-cash depreciation and amortization in the amount of NT$25,470.9 million. The increase in net cash provided by
operating activities in 2015 compared to 2014 was primarily due to cash inflows from a decrease in trade receivables, partially
offset by cash outflows from a decrease in trade payables. The increase in net cash provided by operating activities in 2014 compared
to 2013 was primarily due to an increase in profit before income tax and cash inflows from an increase in trade payables and other
payables, partially offset by cash outflows from an increase in trade receivables and inventories.
Net cash used in investing activities amounted
to NT$63,351.4 million (US$1,932.0 million) in 2015 primarily due to our acquisition of associates and joint ventures of NT$35,673.1
million (US$1,087.9 million) and our acquisition of property, plant and equipment of NT$30,280.1
million (US$923.5 million).
Net cash used in investing activities amounted to NT$38,817.9 million in 2014, primarily due to our acquisition of property, plant
and equipment of NT$39,599.0 million. Net cash used in investing activities amounted to NT$29,925.8 million in 2013, primarily
due to our acquisition of property, plant and equipment of NT$29,142.7 million.
Net cash provided by financing
activities amounted to NT$8,636.3 million (US$263.4 million) in 2015. This amount reflected primarily (i) our net proceeds
from short-term bank loans and bills payable and long-term bank loans and bills payable in the amount of NT$12,776.2 million
(US$389.6 million); (ii) the net proceeds from the 2018 NTD-linked Convertible Bonds of NT$6,136.4 million (US$187.1 million)
and (iii) our proceeds from partial disposal of interests in subsidiaries of NT$8,910.3 million (US$271.7 million), which was
partially offset by (i)
our distributed cash dividends to owners of the Company in the amount of NT$15,297.5
million
(US$466.5 million) and (ii) our payments for repurchases of treasury shares of NT$5,333.4 million
(US$162.7
million). Net cash used in financing activities amounted to NT$2,797.0 million in 2014. This amount reflected primarily (i)
our net repayment of short-term borrowings and long-term bank loans in the amount of NT$12,389.7 million; and (ii) our
distributed cash dividends to owners of the Company in the amount of NT$9,967.2 million, partially offset by (i) our net
proceeds from issue of bonds of NT$8,158.8 million; and (ii) change in non-controlling interests of NT$9,905.7 million due to
Universal Scientific Shanghai’s capital increase. Net cash provided by financing activities amounted to NT$12,794.9
million in 2013. This amount reflected primarily (i) our net proceeds from short-term borrowings and long-term bank loans in
the amount of NT$4,385.2 million; (ii) net proceeds from issue of convertible bonds in the amount of NT$11,900.1 million; and
(iii) proceeds from Capital Increase in the amount of NT$3,393.0 million, partially offset by our distributed cash dividends
to owners of the Company in the amount of NT$7,834.9 million.
As of December 31, 2015, our primary source
of liquidity was NT$55,251.2 million (US$1,685.0 million) of cash and cash equivalents and NT$3,864.0 million (US$117.8 million)
of financial assets—current. Our financial assets—current primarily consisted of structured time deposits and swap
contracts. As of December 31, 2015, we had total unused credit lines of NT$159,252.9 million (US$4,856.8 million). As of December
31, 2015, we had working capital of NT$34,094.4 million (US$1,039.8 million).
As of December 31, 2015, we had total borrowings
of NT$120,361.8 million (US$3,670.7 million), of which NT$36,983.4 million (US$1,127.9 million) were short-term debts and NT$83,378.4
million (US$2,542.8 million) were long-term debts. Our short-term debts consist of bank loans and bills payable. In 2015, the maximum
amount of our short-term debts was NT$53,558.1 million (US$1,633.4 million) and the average amount of our short-term debts was
NT$41,931.6 million (US$1,278.8 million). The fluctuation was primarily because our working capital balance fluctuated during
2015 from time to time. The annual interest rate for borrowings under our short-term bank loans and bills payable ranged from 0.57%
to 5.78% as of December 31, 2015. Our short-term bank loans are primarily revolving facilities with a term of one year, each of
which may be extended on an annual basis with lender consent. Our long-term debts consist of bank loans, bills payable, bonds payable
and capital lease obligations.
As of December 31, 2015, we had outstanding long-term debts, less current portion,
of NT$66,535.1 million (US$2,029.1 million). As of December 31, 2015, the current portion of our long-term debts was NT$16,843.3
million (US$513.7 million). Our long-term bank loans and bills payable typically carried variable annual interest rates which ranged
between 0.90% to 5.39% as of December 31, 2015. For the maturity information and interest rates by currencies, see “Item
11—Quantitative and Qualitative Disclosures about Market Risk—Market Risk—Interest Rate Risk.”
We have pledged a portion of our assets,
with a carrying value of NT$16,542.1 million (US$504.5 million) as of December 31, 2015, to secure our obligations under our short-term
and long-term facilities.
In September 2011, Anstock Limited, our
wholly owned subsidiary incorporated in the Cayman Islands with limited liability, issued RMB150.0 million 3.125% Guaranteed Bonds
due September 22, 2014 and RMB500.0 million 4.250% Guaranteed Bonds due September 20, 2016. The 2014 and 2016 Bonds were offered
to certain non-U.S. persons in compliance with Regulation S under the Securities Act. The 2014 and 2016 Bonds are irrevocably and
unconditionally guaranteed on an unsecured and unsubordinated basis by us. The 2014 Bonds matured and were repaid on September
22, 2014. The 2016 Bonds bear interest from and including September 20, 2011 at the rate of 4.250% per annum. Interest on the 2016
Bonds is payable semi-annually in arrear on September 20 and March 20 of each year beginning on March 20, 2012. The 2016 Bonds
will mature on September 20, 2016 unless previously redeemed or repurchased and cancelled. The net proceeds from the 2014 and 2016
Bonds were advanced by Anstock Limited to ASESH AT in the form of an intercompany RMB loan for working capital and capital expenditure
with maturity in September 2016.
In July 2014, Anstock II Limited offered
US$300.0 million aggregate principal amount of guaranteed bonds due 2017. The Green Bonds are unconditionally and irrevocably guaranteed
by us. The Green Bonds were offered to persons outside of the United States in compliance with Regulation S under the Securities
Act. The Green Bonds bear interest from and including July 24, 2014 at the rate of 2.125% per annum. Interest on the Green Bonds
is payable semi-annually in arrear on January 24 and July 24 of each year beginning on January 24, 2015. The Green Bonds will mature
on July 24, 2017 unless previously redeemed or repurchased and cancelled. The net proceeds from the Green Bonds offering were
used to fund projects that promote our transition to low-carbon and climate-resilient growth.
In August 2011, we issued NT$8.0 billion
1.45% secured corporate bonds with five year term, guaranteed by the Bank of Taiwan, Mega International Commercial Bank, Taiwan
Cooperative Bank, First Bank and Hua Nan Bank. The Corporate Bonds bear an annual simple interest and payment by coupon rate from
the issue date. The net proceeds from the Corporate Bonds were used to repay our previous debts.
In September 2013, we issued US$400.0
million aggregate principal amount of zero coupon convertible bonds due 2018. The 2018 Convertible Bonds were offered to
persons outside of the United States in compliance with Regulation S under the Securities Act. The initial conversion price
was NT$33.085 per common share, subject to certain adjustments, determined on the basis of a fixed exchange rate of NT$29.956
= US$1.00 (which represents an approximately 31.3% conversion premium over the closing trading price of our common shares on
August 28, 2013 of NT$25.20 per common share). The conversion price is subject to adjustment upon the occurrence of certain
events, such as the Capital Increase and cash dividend distribution. As of the date of this annual report, the conversion
price is NT$30.28 per common share. The bonds will mature on September 5, 2018, unless previously repurchased or converted in
accordance with their terms prior to such date. We used the net proceeds to fund procurement of raw materials from overseas.
Please refer to note 18 of our consolidated financial statements included in this annual report for more information. As of
December 31, 2015, the balance of the outstanding convertible bonds was US$400.0 million.
In July 2015, we issued US$200.0 million
aggregate principal amount of NTD-linked zero coupon convertible bonds due 2018. The 2018 NTD-linked Convertible Bonds were offered
to persons outside of the United States in compliance with Regulation S under the Securities Act. The initial conversion price
was NT$54.5465 per common share, subject to certain adjustments, determined on the basis of a fixed exchange rate of NT$30.928
= US$1.00 (which represents an approximately 27.0% conversion premium over the closing trading price of our common shares on June
25, 2015 of NT$42.95 per common share). The conversion price is subject to adjustment upon the occurrence of certain events, such
as the cash dividend distribution. As of the date of this annual report, the conversion price is NT$51.73 per common share. The
bonds will mature on March 27, 2018, unless previously repurchased or converted in accordance with their terms prior to such date.
We used the net proceeds to fund procurement of equipment from overseas. Please refer to note 18 of our consolidated financial
statements included in this annual report for more information. As of December 31, 2015, the balance of the outstanding convertible
bonds was US$200.0 million.
In January 2016, we issued NT$7,000.0 million
(US$213.5 million) 1.30% unsecured corporate bonds with five year term and NT$2,000.0 million (US$61.0 million) 1.50% unsecured
corporate bonds with seven year term. The bonds bear an annual simple interest and payment by coupon rate from the issue date.
The net proceeds from the bonds were used to repay our previous debts.
We currently have one syndicated loan agreement
outstanding. In July 2013, we entered into a US$400.0 million five-year syndicated credit facility, for which the Bank of
Taiwan acted as the agent bank, for the purpose of funding the purchase of machinery and equipment at our facility and funding
general operations. As of December 31, 2015, NT$11,160.5 million (US$340.4 million) was outstanding under this credit facility.
This syndicated loan agreement contains undertakings and restrictive covenants relating to the maintenance of certain financial
ratios including: (i) current ratio (current assets to current liabilities) of not less than 100.0%; (ii) leverage ratio (total
liabilities to tangible net worth) of not higher than 160.0%; (iii) interest coverage ratio (EBITDA to interest expense) of not
less than 280.0%; and (iv) tangible net worth not less than NT$75,000.0 million.
We have in the past failed to comply with
certain financial covenants in some of our loan agreements. Such non-compliance may also have, through broadly worded cross-default
provisions, resulted in default under some of the agreements governing our other existing debt. As of December 31, 2015, we were
not in breach of any of the financial covenants under our existing loan agreements. If we are unable to timely remedy any of our
non-compliance under such loan agreements or obtain applicable waivers or amendments, we would breach our financial covenants and
our financial condition would be adversely affected. See “Item 3. Key Information—Risk Factors—Risks Relating
to Our Business—Restrictive covenants and broad default provisions in our existing debt agreements may materially restrict
our operations as well as adversely affect our liquidity, financial condition and results of operations.”
Our contingent obligations consist of
guarantees provided by us to our subsidiaries. As of December 31, 2015, we endorsed and guaranteed the bonds issued by our
subsidiaries, Anstock Limited, in the amount of RMB500.0 million (US$77.2 million) and Anstock II Limited, in the amount of
US$300.0 million, respectively. Other than such guarantees, we have no other contingent obligations.
We have made, and expect to continue to
make, substantial capital expenditures in connection with the expansion of our production capacity. The table below sets forth
our principal capital expenditures incurred for the periods indicated.
|
|
Year Ended December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
US$
|
|
|
(in millions)
|
Machinery and equipment
|
|
|
19,851.7
|
|
|
|
31,735.5
|
|
|
|
18,318.4
|
|
|
|
558.7
|
|
Building and improvements
|
|
|
7,192.4
|
|
|
|
11,713.1
|
|
|
|
9,962.4
|
|
|
|
303.8
|
|
Total
|
|
|
27,044.1
|
|
|
|
43,448.6
|
|
|
|
28,280.8
|
|
|
|
862.5
|
|
We had commitments for capital expenditures
of approximately US$246.7 million, of which US$53.6 million had been paid as of December 31, 2015, primarily in connection with
the expansion of our packaging and testing services operations. We estimate that our environmental capital expenditures for 2016
will be approximately US$35.0 million.
We may adjust our capital expenditures based on market conditions,
the progress of our expansion plans and cash flow from operations. In addition, due to the rapid changes in technology in the semiconductor
industry, we frequently need to invest in new machinery and equipment, which may require us to raise additional capital. We cannot
assure you that we will be able to raise additional capital should it become necessary on terms acceptable to us or at all. See
“Item 3. Key Information—Risk Factors—Risks Relating to Our Business—The packaging and testing businesses
are capital intensive. If we cannot obtain additional capital when we need it, our growth prospects and future profitability may
be adversely affected.”
We believe that our existing cash, marketable
securities, expected cash flow from operations and existing credit lines under our loan facilities will be sufficient to meet our
capital expenditures, working capital, cash obligations under our existing debt and lease arrangements, and other requirements
for at least the next 12 months. We currently hold cash primarily in U.S. dollars, RMB, New Taiwan dollars, Korean Won and Japanese
yen.
As of December 31, 2015, we had contractual obligations of NT$86,260.8 million (US$2,630.7 million) due in the
next three years. We currently expect to meet our payment obligations through the expected cash flow from operations, long-term
borrowings and the issuance of additional equity or equity-linked securities. We will continue to evaluate our capital structure
and may decide from time to time to increase or decrease our financial leverage through equity offerings or borrowings. The issuance
of additional equity or equity-linked securities may result in additional dilution to our shareholders.
From time to time, we evaluate possible
investments, acquisitions or divestments and may, if a suitable opportunity arises, make an investment, acquisition or divestment.
Our treasury team, under the supervision
of our chief financial officer, is responsible for setting our funding and treasury policies and objectives. Our exposure to financial
market risks relates primarily to changes in interest rates and foreign currency exchange rates. To mitigate these risks, we utilize
derivative financial instruments, the application of which is
primarily to manage these exposures, and not for speculative
purposes.
We have, from time to time, entered into
interest rate swap transactions to hedge our interest rate exposure. In addition, we have, from time to time, entered into forward
exchange contracts, swap contracts, cross currency swap contracts and European foreign currency options contracts to hedge our
existing assets and liabilities denominated in foreign currencies. See “Item 11. Quantitative and Qualitative Disclosures
about Market Risk” and notes 7 and 31 to our consolidated financial statements included in this annual report.
RESEARCH AND DEVELOPMENT
For 2013, 2014 and 2015, our research and
development expenditures totaled approximately NT$9,064.7 million, NT$10,289.7 million and NT$10,937.5 million (US$333.6 million),
respectively. These expenditures represented approximately 4.1%, 4.0% and 3.8% of operating revenues in 2013, 2014 and 2015, respectively.
We have historically expensed all research and development costs as incurred and none is currently capitalized. As of February
29, 2016, we employed 7,202 employees in research and development.
Packaging
We centralize our research and
development efforts in packaging technology in our Kaohsiung, Taiwan facilities. After initial phases of development, we
conduct pilot runs in one of our facilities before new technologies or processes are implemented commercially at other sites.
Facilities with special product expertise, such as ASE Korea, also conduct research and development of these specialized
products and technologies at their sites. One of the areas of emphasis for our research and development efforts is improving
the efficiency and technology of our packaging processes and these efforts are expected to continue. We are also putting
significant research and development efforts into the development and adoption of innovative technology. We work closely with
manufacturers of our packaging equipment and materials in designing and developing the equipment and materials used in our
production process. We also collaborate with our significant customers to co-develop new product and process
technologies.
In addition to investing in the development
of more advanced packaging technology and improving production efficiency, a significant portion of our research and development
efforts is focused on the development of IC substrate production technology for BGA packaging. Substrate is the principal raw material
for BGA packages. Development and production of IC substrates involve complex technology. We are currently working closely with
certain first-tier substrate suppliers in Asia, primarily including those located in Japan, Taiwan and Korea. We believe that our
successful cooperation with substrate suppliers to enhance the overall substrate production capability and to meet future package
requirements has enabled us to capture an increasingly important value-added component of the packaging process, helped ensure
a stable and cost-effective supply of substrates for our BGA packaging operations and shortened time to market.
Testing
Our research and development efforts in
the area of testing have focused primarily on developing testing software and solutions, including logic/mixed-signal/RF/(2.5D/3D)
module and SiP /discrete semiconductors, characterization of semiconductors, layout design, electrical simulation for high frequency
test board and developing software of parametric test data analysis. We work closely with our customers on the leading edge test
technologies, such as 3D IC test and advanced probe test technology such as very fine pitch probe card. Our research and development
operations also include an equipment development group, which currently designs testing hardware and software for specific semiconductors
to offer our customers cost effective test solutions.
Electronic manufacturing services
To further enhance the quality of our services
and products, we focus on developing diversified and innovative products to improve our competitiveness. By leveraging our proprietary
research and development expertise, we are able to optimize our product design, engineering and manufacturing capabilities to provide
our customers with high performance and cost-effective products and services. During the process of designing, as well as developing
the technology for, our software and hardware, our research and development team also dedicates itself to discovering new know-how,
and then applying such know-how to create new, advanced and improved products, processes, methodology and services. We are currently
investing in the development of products used in electronic manufacturing services in relation to computers and peripherals, communications,
industrial, automotive, and storage and server applications.
TREND INFORMATION
Other than as disclosed elsewhere in this
annual report, we are not aware of any trends, uncertainties, demands, commitments or events for the period from January 1, 2015
to December 31, 2015 that are reasonably likely to have a material effect on our operating revenues, income, profitability, liquidity
or capital resources, or that caused the disclosed financial information to be not necessarily indicative of future operating results
or financial conditions.
OFF-BALANCE SHEET ARRANGEMENTS
There are no off-balance sheet arrangements
that have or are reasonably likely to have a current or future effect on our financial condition, changes in financial condition,
revenues or expenses, results of operations, liquidity, capital expenditures or capital resources that are material to investors.
TABULAR DISCLOSURE OF CONTRACTUAL
OBLIGATIONS
The following table sets forth the maturity
of our contractual obligations as of December 31, 2015.
|
|
Payments Due by Period
|
|
|
Total
|
|
Under
1 Year
|
|
1 to 3 Years
|
|
3 to 5 Years
|
|
After
5 Years
|
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
NT$
|
|
|
(in millions)
|
Contractual Obligations:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Long-term debt
(1)
|
|
|
86,687.3
|
|
|
|
28,932.1
|
|
|
|
53,981.6
|
|
|
|
2,998.3
|
|
|
|
775.3
|
|
Capital lease obligations
(2)
|
|
|
401.8
|
|
|
|
100.3
|
|
|
|
5.9
|
|
|
|
295.6
|
|
|
|
-
|
|
Operating leases
(3)
|
|
|
1,027.4
|
|
|
|
211.2
|
|
|
|
241.6
|
|
|
|
111.9
|
|
|
|
462.7
|
|
Purchase obligations
(4)
|
|
|
2,788.1
|
|
|
|
2,788.1
|
|
|
|
-
|
|
|
|
-
|
|
|
|
-
|
|
Total
(5)(6)(7)(8)
|
|
|
90,904.6
|
|
|
|
32,031.7
|
|
|
|
54,229.1
|
|
|
|
3,405.8
|
|
|
|
1,238.0
|
|
____________
_________________
|
(1)
|
Includes long-term borrowings and
bonds payable (before the deduction of unamortized arrangement fees, unamortized issuance
cost and discounts on bonds payable) and interest payments.
|
|
(2)
|
Represents
our commitments under property leases and imputed interest. These obligations are recorded
on our consolidated balance sheets under the line item of other non-current liabilities.
|
|
(3)
|
Represents
our commitments under leases for land, machinery and equipment such as testers, and office
buildings and equipment. See note 34 to our consolidated financial statements included
in this annual report.
|
|
(4)
|
Represents
unpaid commitments for construction. These commitments were not recorded on our consolidated
balance sheets as of December 31, 2015. See note 34 to our consolidated financial statements
included in this annual report. Total commitments for construction of buildings were
approximately NT$4,338.5 million (US$132.3 million), of which NT$1,550.4 million (US$47.3
million) had been paid as of December 31, 2015.
|
|
(5)
|
Excludes
non-binding commitments to purchase machinery and equipment of approximately NT$3,750.7 million
(US$114.4 million), of which NT$206.6 million (US$6.3 million) had been paid as of December
31, 2015. See note 34 to our consolidated financial statements included in this annual
report.
|
|
(6)
|
Excludes
unpaid amounts that we were contracted for the construction related to our real estate
business of approximately NT$2,745.4 million (US$83.7 million) as of December 31, 2015,
since the schedule of payments is difficult to determine. See note 34 to our consolidated
financial statements included in this annual report.
|
|
(7)
|
Excludes
our unfunded defined benefit obligation since the schedule of payments is difficult to
determine. Under defined benefit pension plans, we made pension contributions of approximately
NT$611.6 million (US$18.7 million) in 2015, and we estimate that we will contribute approximately
NT$705.4 million (US$21.5 million) in 2016. See note 20 to our consolidated financial
statements included in this annual report.
|
|
(8)
|
Excludes
uncertain tax liabilities. We recognized additional taxes payable of NT$89.8 million
(US$2.7 million) and accrued interest and penalties of NT$15.0 million (US$0.5 million)
related to uncertain tax positions as of or for the year ended December 31, 2015. Because
we were unable to make a reasonable estimate of the timing of the tax audits, such balances
were not included in the table.
|
SAFE HARBOR
Please see the section entitled
“Special Note Regarding Forward-Looking State
ments.”
Item 6. Directors, Senior Management and Employees
DIRECTORS AND SENIOR MANAGEMENT
Directors
Our board of directors is elected by our
shareholders in a general meeting at which a quorum, consisting of a majority of all issued and outstanding common shares, is present.
The chairman is elected by the board from among the directors. Our eleven-member board of directors, including three independent
directors, is responsible for the management of our business.
We currently have eleven directors, serving
a three-year term. The current board of directors began serving on June 24, 2015. Directors may serve any number of consecutive
terms and may be removed from office at any time by a resolution adopted at a meeting of shareholders. Normally, all board members
are elected at the same meeting of shareholders, except where the posts of one-third or more of the directors are vacant, at which
time an extraordinary shareholders’ meeting
shall be convened to elect directors to fill the vacancies. We and our subsidiaries do not have service contracts with our directors
that provide for benefits upon termination of employment.
Our audit committee currently consists
of our independent directors, Shen-Fu Yu, Ta-Lin Hsu and Mei-Yueh Ho, who are independent under Rule 10A-3 and the ROC Securities
and Exchange Act and are financially literate with accounting or related financial management expertise. The audit committee has
responsibility for, among other things, overseeing the qualifications, independence and performance of our independent auditors
and the integrity of our financial statements.
Our compensation committee currently consists
of Shen-Fu Yu and Ta-Lin Hsu, our independent directors, and Hsiao-Ying Ku. Our board of directors established a compensation committee
to satisfy the requirements under the ROC Securities Exchange Act. Under ROC securities regulations, a compensation committee should
have at least one independent director who is considered independent under ROC securities regulations. We do not assess the independence
of our compensation committee member under the independence requirements of the NYSE listing standards but adopt the independence
standard as promulgated under the ROC Regulations Governing the Appointment and Exercise of Powers by the Remuneration Committee
of a Company Whose Stock is Listed on the Stock Exchange or Traded Over the Counter. See “Item 16G. Corporate Governance”
for more information. Our compensation committee meets at least twice a year. Our board of directors has adopted an compensation
committee charter for our compensation committee. The compensation committee has responsibility for, among other things, setting
forth and reviewing policies, systems, standards and structures regarding performance evaluation and compensation of the directors,
managerial personnel, and evaluating compensation of the directors and managerial personnel.
The following table sets forth information
regarding all of our directors as of March 31, 2016. In accordance with ROC law, each of our directors is elected either in his
or her capacity as an individual or as an individual representative of a corporation or government. Persons designated to represent
corporate or government shareholders as directors are typically nominated by such shareholders at the annual general meeting and
may be replaced as representatives by such shareholders at will. Of the current directors, six represent ASE Enterprises Limited.
The remaining directors serve in their capacity as individuals.
Name
|
Position
|
Director
Since
|
Age
|
Other
Significant
Positions Held Outside of the ASE Group
|
Jason C.S. Chang
(1)(2)
|
Director, Chairman and Chief Executive Officer
|
1984
|
71
|
None
|
Richard H.P. Chang
(1)
|
Director, Vice Chairman and President
|
1984
|
69
|
Chairman, Sino Horizon Holdings Ltd.
|
Rutherford Chang
(3)
|
Director and General Manager of China Region
|
2009
|
36
|
None
|
Tien Wu
(2)
|
Director and Chief Operating Officer
|
2003
|
58
|
None
|
Joseph Tung
(2)
|
Director and Chief Financial Officer
|
1997
|
57
|
Independent director, Ta Chong Bank Ltd.
|
Raymond Lo
(2)
|
Director and General Manager, Kaohsiung packaging facility
|
2006
|
62
|
None
|
Tien-Szu Chen
(2)
|
Director and General Manager, ASE Inc. Chung-Li branch
|
2015
|
54
|
None
|
Jeffrey Chen
(2)
|
Director and General Manager of Corporate Affairs and Strategy of China Region
|
2003
|
52
|
None
|
Shen-Fu Yu
|
Independent Director and Member, Audit Committee and Compensation Committee
|
2009
|
71
|
Independent director, Yulon Motor Co., Ltd.; director, Arima Lasers Corporation; supervisor, Dynapak International Technology Corporation, San Fu Chemical Co., Ltd., and Arima Communications
|
Ta-Lin Hsu
|
Independent Director and Member, Audit Committee and Compensation Committee
|
2009
|
72
|
Chairman and founder, H&Q Asia Pacific; Chairman, H&Q Taiwan Co. Ltd.
|
Mei-Yueh Ho
|
Independent Director and Member, Audit Committee
|
2015
|
65
|
Independent Director, Bank of Kaohsiung, Ltd., KINPO Electronics Inc., AU Optronics Corp. and Ausnutria Dairy Corporation Ltd.
|
__
__________________
|
(1)
|
Jason C.S. Chang and Richard H.P.
Chang are brothers.
|
|
(2)
|
Representative
of ASE Enterprises Limited, a company organized under the laws of Hong Kong, which held
16.76% of our total outstanding shares as of March 31, 2016. All of the outstanding shares
of ASE Enterprises Limited are held through intermediary holding companies and under
a revocable trust established under the laws of the Bailiwick of Guernsey for the benefit
of our Chairman and Chief Executive Officer, Jason C.S. Chang, and his family.
|
|
(3)
|
Rutherford Chang is the son of Jason
C.S. Chang.
|
Audit Committee
For a discussion of our audit committee,
see “—Directors and Senior Management—Directors.”
Executive Officers
The following table sets forth information
regarding all of our executive officers as of March 31, 2016.
Name
|
Position
|
Years
with the Company
|
Age
|
Jason C.S. Chang
|
Chairman and Chief Executive Officer
|
32
|
71
|
Richard H.P. Chang
|
Vice Chairman and President; Chairman, Universal Scientific Shanghai
|
32
|
69
|
Rutherford Chang
|
General Manager, China Region
|
11
|
36
|
Tien Wu
|
Chief Operating Officer
|
16
|
58
|
Joseph Tung
|
Chief Financial Officer
|
21
|
57
|
Raymond Lo
|
General Manager, ASE Test Taiwan; General Manager, Kaohsiung packaging facility
|
29
|
62
|
Tien-Szu Chen
|
General Manager, ASE Inc. Chung-Li branch
|
27
|
54
|
Chun-Che Lee
|
General Manager, ASE Electronics
|
31
|
56
|
Ung Bae
|
General Manager, ASE Korea
|
16
|
59
|
Chih-Hsiao Chung
|
General Manager, ASE Japan and Wuxi Tongzhi
|
16
|
51
|
Chiu-Ming Cheng
|
General Manager, ASESH AT
|
25
|
55
|
Chih-An Hsu
|
General Manager, ASEKS
|
19
|
53
|
Yen-Chieh Tsao
|
General Manager, ASEWH
|
4
|
58
|
Shih-Kang Hsu
|
Chief Executive Officer, ASEN
|
15
|
50
|
Meng-Hui Lin
|
General Manager, ASE Shanghai
|
22
|
49
|
Kwai Mun Lee
|
President, ASE South-East Asia operations
|
17
|
53
|
Lid Jian Chiou
|
General Manager, ASE Singapore Pte. Ltd.
|
12
|
59
|
Kenneth Hsiang
|
General Manager, ISE Labs
|
16
|
46
|
Chen-Yen Wei
|
Chairman, Universal Scientific; Chairman, USI Inc.; President, Universal Scientific Shanghai
|
36
|
61
|
Feng-Ta Chen
|
General Manager, UGJQ
|
18
|
53
|
Jack Hou
|
General Manager, UGTW
|
22
|
59
|
Ta-I Lin
|
General Manager, UGKS
|
28
|
52
|
Yueh-Ming Lin
|
General Manager, USISZ
|
20
|
50
|
Omar Anaya Galván
|
General Manager, USI Mexico
|
13
|
46
|
Biographies of Directors and Executive Officers
Jason
C.S. Chang
has served as Chairman of
ASE Inc.
since its founding in March 1984 and as its Chief Executive Officer since May 2003. Mr. Chang holds a bachelor’s degree in
electrical engineering from National Taiwan University in Taiwan and a master’s degree from the Illinois Institute of Technology.
He is the brother of Richard H.P. Chang,
our
Vice Chairman and President.
Richard
H.P. Chang
has served as Vice Chairman of
ASE Inc.
since November 1999 after having served as President of
ASE Inc.
since its founding in March 1984, and served as Chief Executive Officer of
ASE Inc.
from July 2000 to April 2003. In February 2003, he was again appointed President of
ASE Inc.
upon the retirement of Mr. Leonard Y. Liu. Mr. Chang has also served as the Chairman of Universal Scientific Industrial (Shanghai) Co., Ltd.
since June 2008. Mr. Chang holds a bachelor’s degree in industrial engineering from Chung Yuan Christian University
in Taiwan. He is the brother of Jason C.S. Chang, our Chairman and Chief Executive Officer.
Rutherford
Chang
has served as a director of
ASE Inc.
since June 2009 and General Manager of China Region of
ASE Group.
since June 2010. He joined
ASE Group
in
March 2005. Mr. Chang holds a bachelor’s degree in psychology from Wesleyan University in Connecticut. He is the son
of Jason C.S. Chang, our Chairman and Chief Executive Officer.
Tien
Wu
has served as a director of
ASE Inc.
since June 2003 and Chief Operating Officer since April 2006, prior to which he served as the President of Worldwide Marketing
and Strategy of the ASE Group. Prior to joining ASE Inc. in March 2000, Mr. Wu held various managerial positions with IBM.
Mr. Wu holds a bachelor’s degree in civil engineering from National Taiwan University in Taiwan, a master’s degree
and a doctorate degree in mechanical engineering and applied mechanics from the University of Pennsylvania.
Joseph
Tung
has served as a director of
ASE Inc.
since April 1997 and Chief Financial Officer since December 1994. He is also an independent director of Ta Chong Bank Ltd. since
October 2007. Before joining ASE Inc., Mr. Tung was a Vice President at Citibank, N.A. Mr. Tung holds a bachelor’s
degree in economics from the National Chengchi University in Taiwan and a master’s degree in business administration from
the University of Southern California.
Raymond
Lo
has served as a director of
ASE Inc.
since May 2006 and General Manager of our packaging facility in Kaohsiung, Taiwan since April 2006. Mr. Lo also served as a supervisor
of
ASE Inc.
between July 2000 and May
2006. Before joining ASE Group, Mr. Lo was the Director of Quality Assurance at Zeny Electronics Co. Mr. Lo holds a bachelor’s
degree in electronic physics from the National Chiao Tung University in Taiwan.
Tien-Szu
Chen
has served as a director of ASE Inc. since June 2015 and General Manager of ASE Inc. Chung-Li branch since August 2015.
Prior to his current position, Mr. Chen served as our supervisor from June 2006 to June 2015 and as President of Power ASE
Technology Inc. from June 2006 to May 2012. He also held several key management positions within the ASE Group from June 1988
to June 2006, including President of ASE Inc. Chung-Li branch and Senior Vice President of ASE Inc. Prior to joining ASE Group
in June 1988, Mr. Chen worked at TSMC and Philips Semiconductor Kaohsiung. Mr. Chen received his bachelor’s degree
in industrial engineering from Chung Yuan Christian University in Taiwan.
Jeffrey
Chen
has served as a director of ASE Inc. since June 2003 and General Manager of Corporate Affairs and Strategy of China Region.
Prior to joining ASE Inc., he worked in the corporate banking department of Citibank, N.A. in Taipei and as a Vice President of
corporate finance at Bankers Trust in Taipei. Mr. Chen holds a bachelor’s degree in finance and economics from Simon
Fraser University in Canada and a master’s degree in business administration from the University of British Columbia in Canada.
Shen-Fu
Yu
has served as an independent director of ASE Inc. since June 2009 and as an independent director of Yulon Motor Co., Ltd.
He is also a director of Arima Lasers Corporation and a supervisor of Dynapack International Technology Corporation, San Fu Chemical
Co., Ltd., and Arima Communications. Mr. Yu is also a member of the audit committee and compensation committee of ASE Inc.. Mr.
Yu also serves on the compensation committee of Yulon Motor Co., Ltd., Taiwan Acceptance Corporation and Elite Material Co., Ltd.
He worked at Deloitte & Touche Accounting Firm as a consultant from June 2003 to November 2006. Mr. Yu holds a bachelor’s
degree in accounting from National Taiwan University in Taiwan and a master’s degree in accounting from National Chengchi
University in Taiwan.
Ta-Lin
Hsu
has served as an independent director of ASE Inc. since June 2009. He is also a member of the audit committee and compensation
committee of ASE Inc.. He is currently the chairman and founder of H&Q Asia Pacific and chairman of H&Q Taiwan Co. Ltd.
Mr. Hsu holds a bachelor’s degree in physics from National Taiwan University, a master’s degree in electrophysics
from the Polytechnic Institute of Brooklyn and a doctorate degree in electrical engineering from the University of California,
Berkeley.
Mei-Yueh
Ho
has served as an independent director and a member of the audit committee of ASE Inc. since June 2015. Ms. Ho is also an
independent director of the Bank of Kaohsiung, Ltd., KINPO Electronics Inc., AU Optronics Corp. and Ausnutria Diary Corporation
Ltd. She is also a member of the audit committee of the Bank of Kaohsiung, Ltd. and AU Optronics Corp., and a member of the compensation
committee of the Bank of Kaohsiung, Ltd., KINPO Electronics Inc. and AU Optronics Corp. Ms. Ho served as Minister of Ministry
of Economic Affairs, ROC from May 2004 to January 2006. She was also Chairperson of the Council for Economic Planning and Development,
ROC from May 2007 to May 2008. Ms. Ho holds a bachelor’s degree in agricultural chemistry from National Taiwan University
in Taiwan.
Chun-Che
Lee
has served as a General Manager of ASE Electronics Inc. since August 2011, prior to which he was a vice president, director
and manager of research and development at ASE Inc. since 1984. Mr. Lee holds a bachelor’s degree in aeronautics from Tamkung
University in Taiwan.
Ung
Bae
has served as General Manager of ASE (Korea) Inc. since July 2008, after serving as Senior Vice President of ASE (Korea) Inc.
since July 1999. Mr. Bae was Vice President of Motorola Korea, Limited before joining ASE (Korea) Inc. when we acquired
Motorola Korea, Limited. He holds a degree in electronic engineering from In-Ha University in Korea.
Chih-Hsiao
Chung
has served as General Manager of ASE Japan Co. Ltd. since March 2011, General Manager of Wuxi Tongzhi Microelectronics Co., Ltd.
since June 2013, and Chairman and CEO of ASEEE since September 2015. Mr. Chung has also managed the sales and marketing of
ASE Japan Co. Ltd. region since April 2007. Before joining ASE Group, Mr. Chung was the Senior Manager of Sale and
Marketing at Kimberly Clark Co., Taiwan. He holds a master’s degree in business administration from the University of
Wisconsin-Madison.
Chiu-Ming
Cheng
has served as General Manager of ASE Assembly & Test (Shanghai) Limited since September 2012, after serving as Vice
President of ASE’s Kaohsiung packaging facility since October 2004. He joined ASE Group in April, 1990. Mr. Cheng holds
a master’s degree in public policy from National Sun Yat-Sen University in Taiwan.
Chih-An
Hsu
has served as General Manager of ASE (KunShan) Inc. since July 2012, after serving as Vice President of ASE's Chung-Li
since July 2006. He joined ASE Group in February 1997. Mr. Hsu holds a bachelor’s degree in industrial engineering from
National Tsing Hua University in Taiwan.
Yen-Chieh
Tsao
has served as General Manager of ASE (Weihai), Inc. since October 2013 after serving as Vice President of ASE’s
Chung-Li since October 2011. Mr. Tsao was the Vice President of Motorola Electronics
Taiwan Ltd. prior
to joining ASE Group. He holds a bachelor’s degree in physics from the Chinese Culture University in Taiwan.
Shih-Kang
Hsu
has served as Chief Executive Officer of Suzhou ASEN Semiconductors Co., Ltd. since August 2010, after serving
as Senior Vice President of ASE (U.S.) Inc. since June 2006. He joined ASE Group in June 2000. Mr. Hsu holds a master’s
degree in mechanical engineering from Case Western Reserve University.
Meng-Hui
Lin
has served as General Manager of ASE (Shanghai) Inc. since Oct 2014. He joined ASE Group in 1994, and has worked in
various fields with ASE Group, e.g., IE, quality engineering, process engineering, research & development and manufacturing
management. He holds a master’s degree in industrial engineering from Texas A&M University.
Kwai
Mun Lee
has served as President of our Southeast Asia operations, with responsibility for the operations of our Penang, Malaysia
and Singapore manufacturing facilities, since March 2006. Before joining the ASE Group, Mr. Lee held senior management positions
at Chartered Semiconductor and STATS ChipPAC. He started his career as an engineer at Intel. He holds a degree in engineering from
the Swinburne Institute of Technology in Australia.
Lid
Jian Chiou
has served as General Manager of ASE Singapore Pte. Ltd. since September 2010 after serving as Senior Director
of Operations since November 2003. Prior to that, he worked several years with Texas Instruments and Chartered Semiconductor. Mr. Chiou
holds a master’s degree in business administration from the State University of New York and a bachelor’s degree in
engineering from the University of Strathclyde
in the United Kingdom
.
Kenneth
Hsiang
has served as General Manager of ISE Labs, Inc. since June 2004. Prior to joining ASE Group in November 1999, Mr. Hsiang
worked in management positions within finance and strategic analysis in the healthcare and biotech industries in the San Francisco
Bay area in California. He also worked for Price Waterhouse LLP as a Certified Public Accountant. Mr. Hsiang received
a bachelor’s degree in economics & rhetoric from the University of California, Berkeley.
Chen-Yen
Wei
has served as Chairman of Universal Scientific Industrial Co., Ltd. since July 2014, Chairman of USI Inc.
since April 2015, and President of Universal Scientific Industrial (Shanghai) Co., Ltd. since April 2008. He joined Universal
Scientific Industrial Co., Ltd. as an engineer in August 1979. He holds a bachelor’s degree in communication engineering
from National Chiao Tung University in Taiwan.
Feng-Ta
Chen
has served as General Manager of Universal Global Technology (Shanghai) Co., Ltd. since September 2013. He joined
Universal Scientific Industrial Co., Ltd. as a Wireless Product PLM Department head in July 1997. He holds a bachelor’s degree
in literature from the Chinese Culture University in Taiwan.
Jack
Hou
has served as General Manager of Universal Global Scientific Industrial Co., Ltd. since January 2010 and Vice
President of Automotive & Visual Product Devices and Module Turnkey Management Business Unit of Universal Scientific Industrial Co., Ltd.
since April 2012. He joined Universal Scientific Industrial Co., Ltd. as a section manager in February 1994. He holds
a master’s degree in biomedical engineering from Ohio State University and a master’s degree in computer science from
the University of Dayton in Ohio.
Ta-I
Lin
has served as General Manager of Universal Global Technology (Kunshan) Co. Ltd. since August 2011. He joined
Universal Scientific Industrial Co., Ltd. as an engineer in August 1987. He holds a bachelor’s degree in electrical
engineering from National Cheng Kung University in Taiwan and an executive master of business administration from Peking University
in China.
Yueh-Ming
Lin
has served as General Manager of USI Electronics (Shenzhen) Co. Ltd. since January 2015 and Senior Director of
Global Operation Management (Shenzhen) Division of USI Electronics (Shenzhen) Co. Ltd. since March 2014. He joined Universal
Scientific Industrial Co., Ltd. as a section manager in October 1995. He holds a bachelor’s degree in electrical
engineering from Feng Chia University in Taiwan.
Omar
Anaya Galván
has served as General Manager of Universal Scientific Industrial De Mexico S.A. DE C.V. since March
2015. He has worked in the electronics industry for over 24 years and has experience in various technical, quality and
manufacturing management roles. He has been working at Universal Scientific Industrial
(Shanghai)
Co., Ltd. and its directly and indirectly held subsidiaries since March 2003. He holds a bachelor’s degree in
electronic systems engineering from the Monterrey Institute of Technology and Higher Education in Mexico.
The business address of our directors and
executive officers is our registered office.
COMPENSATION
In 2015, we recorded expenses of approximately
NT$833.9 million (US$25.4 million) as remuneration to our directors and executive officers. We did not pay any remuneration in
kind to our directors or executive officers in 2015. In 2015, we accrued pension costs of NT$2.3 million (US$0.1 million) for retirement
benefits for our management. In April 2016, our board of directors passed a resolution and increased the remuneration of our independent
directors from NT$2.0 million (US$0.06 million) to NT$3.0 million (US$0.09 million) per person per year. This proposal is subject
to the approval of our annual general shareholders’ meeting in June 2016. In addition, according to our Articles of Incorporation,
not more than 1% of our annual net earnings (after recovering any losses incurred in prior years and deducting the legal reserve,
special reserve provisions and other items as required under ROC law, if any) may be distributed as bonuses to our directors. 7%
to 11% of our annual net earnings (after recovering any losses incurred in prior years and deducting the legal reserve, special
reserve provisions and other items as required under ROC law, if any) may be distributed as a bonus to employees, including executive
officers. In January 2016, our board of directors proposed to amend our Articles of Incorporation to distribute employees’
compensation, including executive officers, and remuneration to directors at the rates in 5.25%-8.25% and no higher than 0.75%,
respectively, of net profit before income tax, employees’ compensation and remuneration to directors. This proposal is subject
to the approval of our annual general shareholders’ meeting in June 2016.
We have not provided any loans to or guarantees
for the benefit of any of our directors or executive officers. For information regarding our pension and other retirement plans
and those of our subsidiaries, see note 20 to our consolidated financial statements included in this annual report.
ASE Inc. Employee Bonus and Stock Option
Plans
We award bonuses to employees of ASE Inc.
and its subsidiaries who are located in Taiwan based on overall income and individual performance targets. Prior to 2009, these
employees were eligible to receive bonuses in the form of our common shares valued at par. Beginning in 2009, employees are eligible
to receive bonuses in the form of our common shares valued at the closing price (after adjustment with consideration of the effects
on the share price, if any, brought by cash and stock dividends resolved at shareholders’ meetings) of our common shares
on the day prior to our shareholders’ meeting. Actual amounts of bonuses to individual employees are determined based upon
the employee meeting specified individual performance objectives. We granted aggregate values of NT$1,147.2 million, NT$1,587.3
million and NT$2,335.6 million (US$71.2 million) as cash bonus to our employees in 2013, 2014 and 2015, respectively.
We currently maintain three option plans,
adopted in 2007, 2010 and 2015. The option plan adopted in 2004 expired in May 2015. Pursuant to these plans, our full-time employees,
including domestic and foreign subsidiaries, are eligible to receive stock option grants. Each option entitles the holder to purchase
one ASE Inc. common share at a price equal to (for the 2007 plan), or not less than (for the 2010 and 2015 plans), the closing
market price on the date of the option issuance, such exercise price being subject to retroactive adjustment in the event of certain
capital transactions in subsequent periods. Each option is valid for ten years from the date of the grant. 40.0% of the options
originally granted vest upon the second anniversary of the grant date, and an additional 10.0% of the options originally granted
vest every six months thereafter. Each option expires at the end of the tenth year following its grant date. The options are generally
not transferable. As of December 31, 2015, a total of 185,806,000 options had been granted under the 2007 plan. The original exercise
price under the 2007 plan was NT$30.65 per share (currently adjusted to NT$21.1 per share). As of December 31, 2015, a total of
199,999,500 options had been granted under the 2010 plan, 187,719,500 of which had an original exercise price of NT$28.6 per share
(currently adjusted to NT$20.4 per share) and 12,280,000 of which had an original exercise price of NT$28.75 per share (currently
adjusted to NT$22.6 per share). As of December 31, 2015, a total of 94,270,000 options had been granted under the 2015 plan. The
exercise price under the 2015 plan was NT$36.50 per share.
ASE Mauritius Inc. Share Option Plan
As of December 31, 2015, ASE Mauritius
Inc. maintained one option plan adopted in 2007. Under this plan, certain employees of ASE Mauritius Inc. and the ASE Group are
granted options to purchase ordinary shares of ASE Mauritius Inc. at an exercise price of US$1.7, which exercise price was determined
by taking into account a fairness opinion rendered by an independent appraiser and was reviewed by our accountants. Each option
is valid for ten years from the date of the grant. As of December 31, 2015, a total of 30,000,000 options had been granted under
this plan with an exercise price of US$1.7.
USI Enterprise Limited Share Option Plans
USI Enterprise Limited maintains three
option plans adopted in 2007, 2010 and 2011, under which certain employees of Universal Scientific and our employees were granted
options to purchase common shares of USI Enterprise Limited. Each option under these three plans is valid for ten to thirteen years
from the date of the grant. As of December 31, 2015, we had 14,028,000 options outstanding with an exercise price of US$1.53 per
share, 7,651,420 options outstanding with an exercise price of US$2.42 per share and 8,015,200 options outstanding with an exercise
price of US$2.94 per share under these three plans respectively.
Universal Scientific Shanghai Option
Plans
As
of December 31, 2015, Universal Scientific Shanghai maintains one option plan adopted in 2015. Under this plan, certain employees
of Universal Scientific Shanghai are granted options to purchase ordinary shares of Universal Scientific Shanghai at an exercise
price of RMB15.5. Each option is valid for ten years from the date of the grant. As of December 31, 2015, a total of 26,639,500
options had been granted under this plan with an exercise price of RMB15.5.
BOARD PRACTICES
General
For a discussion of the term of office
of the board of directors, see “—Directors and Senior Management.” No benefits are payable to members of the
board or the executive officers upon termination of their relationship with us.
Compensation Committee
For a discussion of our compensation committee,
see “—Directors and Senior Management—Directors.”
EMPLOYEES
The following table sets forth certain
information concerning our employees as of the dates indicated.
|
|
As of December 31,
|
|
|
2013
|
|
2014
|
|
2015
|
Total
|
|
|
60,199
|
|
|
|
68,100
|
|
|
|
65,789
|
|
Function
|
|
|
|
|
|
|
|
|
|
|
|
|
Direct labor
|
|
|
33,794
|
|
|
|
38,588
|
|
|
|
35,770
|
|
Indirect labor (manufacturing)
|
|
|
14,518
|
|
|
|
16,620
|
|
|
|
16,910
|
|
Indirect labor (administration)
|
|
|
5,580
|
|
|
|
5,941
|
|
|
|
5,929
|
|
Research and development
|
|
|
6,307
|
|
|
|
6,951
|
|
|
|
7,180
|
|
Location
|
|
|
|
|
|
|
|
|
|
|
|
|
Taiwan
|
|
|
30,552
|
|
|
|
35,382
|
|
|
|
34,877
|
|
PRC
|
|
|
21,360
|
|
|
|
24,223
|
|
|
|
22,475
|
|
Korea
|
|
|
2,964
|
|
|
|
2,900
|
|
|
|
2,701
|
|
Malaysia
|
|
|
2,672
|
|
|
|
2,752
|
|
|
|
2,982
|
|
Japan
|
|
|
693
|
|
|
|
588
|
|
|
|
502
|
|
Singapore
|
|
|
1,068
|
|
|
|
1,059
|
|
|
|
986
|
|
United States
|
|
|
376
|
|
|
|
383
|
|
|
|
379
|
|
Others
|
|
|
514
|
|
|
|
813
|
|
|
|
887
|
|
Eligible employees may participate in our
employee share bonus plan and stock option plans and our subsidiaries’ share option plans, such as the option plans adopted
by ASE Mauritius, USI Enterprise Limited, and Universal Scientific Shanghai. See “—Compensation.”
We have never experienced a work stoppage
caused by our employees. We believe that our relationship with our employees is good.
SHARE OWNERSHIP
The following table sets forth certain
information with respect to our common shares and options of ASE Inc. exercisable for our common shares held by our directors and
executive officers as of March 31, 2016. Percentage of beneficial ownership is based on 7,918,272,896 common shares outstanding
as of March 31, 2016.
Director or Executive Officer
|
|
Number of ASE Inc. Common Shares Beneficially Held
(1)
|
|
Percentage of ASE Inc. Total Common Shares Issued and Outstanding
|
|
Number of Options Exercisable
(2)
|
|
Exercise Price of Options (NT$)
|
|
Expiration Date of Options
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Jason C.S. Chang
|
|
|
1,743,979,181
|
(3)
|
|
|
22.02
|
%
|
|
|
16,300,000
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Richard H. P. Chang
|
|
|
226,144,287
|
|
|
|
2.86
|
%
|
|
|
9,050,000
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Rutherford Chang
|
|
|
1,779,708
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Tien Wu
|
|
|
4,953,386
|
|
|
|
*
|
|
|
|
*
|
|
|
20.4
|
|
5/6/2020
|
Joseph Tung
|
|
|
4,226,823
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Raymond Lo
|
|
|
2,566,825
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Tien-Szu Chen
|
|
|
592,054
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Jeffrey Chen
|
|
|
1,044,802
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Shen-Fu Yu
|
|
|
4,632
|
|
|
|
*
|
|
|
|
0
|
|
|
-
|
|
-
|
Ta-Lin Hsu
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
-
|
|
-
|
Mei-Yueh Ho
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
-
|
|
-
|
Chun-Che Lee
|
|
|
2,944,502
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Ung Bae
|
|
|
0
|
|
|
|
0
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Chih-Hsiao Chung
|
|
|
10,647
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Chiu-Ming Cheng
|
|
|
387,698
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Chih-An Hsu
|
|
|
0
|
|
|
|
0
|
|
|
|
*
|
|
|
20.4
|
|
5/6/2020
|
Yen-Chieh Tsao
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
36.5
|
|
9/10/2025
|
Shih-Kang Hsu
|
|
|
214,688
|
|
|
|
*
|
|
|
|
*
|
|
|
20.4
|
|
2020/5/6
|
Meng-Hui Lin
|
|
|
271,523
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Kwai Mun Lee
|
|
|
0
|
|
|
|
0
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Lid Jian Chiou
|
|
|
0
|
|
|
|
0
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Kenneth Hsiang
|
|
|
155,000
|
|
|
|
*
|
|
|
|
*
|
|
|
20.40-21.10
|
|
2017/12/19 - 2020/5/6
|
Chen-Yen Wei
|
|
|
710,053
|
|
|
|
*
|
|
|
|
0
|
|
|
-
|
|
-
|
Feng-Ta Chen
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
-
|
|
-
|
Jack Hou
|
|
|
107,558
|
|
|
|
*
|
|
|
|
0
|
|
|
-
|
|
-
|
Ta-I Lin
|
|
|
30,000
|
|
|
|
*
|
|
|
|
0
|
|
|
-
|
|
-
|
Yueh-Ming Lin
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
-
|
|
-
|
Omar Anaya Galvan
|
|
|
0
|
|
|
|
0
|
|
|
|
0
|
|
|
-
|
|
-
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
________
___________
|
(1)
|
Including shares directly held and
shares beneficially owned through spouse and minor children.
|
|
(2)
|
Each option may be converted into
one of our common shares. The figures referred herein include options convertible into
our common shares scheduled to vest within 60 days as of the date hereof.
|
|
(3)
|
Including 1,327,202,773 common shares
Jason C.S. Chang beneficially owned through ASE Enterprises Limited, Aintree Limited
and JC Holdings Limited and 321,454,196 common shares beneficially owned through Value
Tower Limited, respectively, and 95,322,212 common shares Jason C.S. Chang directly owned.
See “Item 7. Major Shareholders and Related Party Transactions—Major
Shareholders.”
|
|
*
|
The sum of the number of common shares
held and the number of common shares issuable upon exercise of all options held is less
than 1.0% of our total outstanding shares.
|
Item 7. Major Shareholders and Related Party Transactions
MAJOR SHAREHOLDERS
The following table sets forth information
known to us with respect to the beneficial ownership of our common shares, as of March 31, 2016, by each shareholder known by us
to beneficially own more than 5.0% of our total outstanding shares.
Beneficial ownership is determined in accordance
with the rules and regulations of the SEC. Percentage of beneficial ownership is based on 7,918,272,896 common shares outstanding
as of March 31, 2016. In addition, in computing the number of shares beneficially owned by a person and the percentage ownership
of that person, we have included shares that the person has the right to acquire within 60 days, including through the exercise
of any option, warrant or other right or the conversion of any other security. These shares, however, are not included in the computation
of the percentage ownership of any other person.
|
|
Common Shares Beneficially Owned
|
Name of Shareholder or Group
|
|
Number
|
|
Percentage
|
Jason C.S. Chang
(1)
|
|
|
1,760,279,181
|
|
|
|
22.18
|
%
|
___________
_____
|
(1)
|
Jason C.S. Chang is our Chairman
and Chief Executive Officer. Jason C. S. Chang beneficially owned 1,327,202,773 common
shares through ASE Enterprises Limited, Aintree Limited and JC Holdings Limited and 321,454,196
common shares through Value Tower Limited, respectively, and directly owned 95,322,212
common shares and vested options convertible into 16,300,000 common shares. As a result,
Jason C.S. Chang beneficially owned 1,760,279,181 common shares, representing 22.18%
of our total outstanding shares on an adjusted basis (based on 7,934,572,896 common shares
which were adjusted to reflect 7,918,272,896 shares outstanding as of March 31, 2016,
plus 16,300,000 common shares Jason C.S. Chang may receive upon exercise of options granted
to him which are vested). ASE Enterprises Limited is a company organized under the laws
of Hong Kong. All of the outstanding shares of ASE Enterprises Limited are held by Aintree
Limited. Aintree Limited is a company organized under the laws of the British Virgin
Islands. All of the shares of Aintree Limited are held by JC Holdings Limited. The shares
of JC Holdings Limited are held through intermediary holding companies and under a revocable
trust established under the laws of the Bailiwick of Guernsey for the benefit of our
Chairman and Chief Executive Officer, Jason C.S. Chang, and his family. Value Tower Limited
is a company organized under the laws of the British Virgin Islands. Jason C.S. Chang
is the sole shareholder and director of Value Tower Limited. There were no significant
changes in the percentage of ownership beneficially owned by Jason C.S. Chang in 2013,
2014 and 2015.
|
The following table sets forth information
relating to our common shares held directly by our consolidated subsidiaries and our equity method investee as of March 31, 2016.
|
|
Common Shares Beneficially Owned
|
Name of Shareholder
|
|
Number
|
|
Percentage
|
ASE Test
(1)
|
|
|
88,200,472
|
|
|
|
1.11
|
%
|
ASE Test Taiwan
(2)
|
|
|
10,978,776
|
|
|
|
0.14
|
%
|
J&R Holding Limited
(3)
|
|
|
46,703,763
|
|
|
|
0.59
|
%
|
Hung Ching
(4)
|
|
|
85,588,293
|
|
|
|
1.08
|
%
|
|
(1)
|
ASE Test is our wholly owned subsidiary.
ASE Test’s ownership of our common shares is the result of the merger of ASE Chung
Li with and into us in August 2004, and subsequent dividends upon shares received in
connection with this merger. In order to comply with Singapore Companies Act, a trust
was established to hold and dispose our common shares issued to ASE Test, a Singaporean
Company, upon completion of the merger. The trustee appointed under such trust arrangement
is currently our registered shareholder for our common shares issued to ASE Test. See
“—Related Party Transactions.”
|
|
(2)
|
ASE Test Taiwan is our wholly owned
subsidiary. ASE Test Taiwan’s ownership of our common shares is mainly the result
of the merger of ASE Material with and into us in August 2004, and subsequent dividends
upon shares received in connection with this merger. In order to comply with Singapore
Companies Act, a trust had been established to hold and dispose our common shares issued
to ASE Test Taiwan, which had been a subsidiary of ASE Test, upon completion of the merger.
In December 2014, the trust established to hold the common shares issued to ASE Test
Taiwan had been terminated because ASE Test Taiwan was no longer a subsidiary owned by
ASE Test and therefore no longer subject to Singapore Companies Act requirements. As
a result, ASE Test Taiwan directly owned 10,978,776 of our common shares as of March
31, 2016. See “—Related Party Transactions.”
|
|
(3)
|
J&R Holding Limited is our wholly
owned subsidiary. J&R Holding Limited’s ownership of our common shares is the
result of the merger of ASE Chung Li with and into us in August 2004, and subsequent
dividends upon shares received in connection with this merger.
|
|
(4)
|
Hung Ching is our equity method investee.
As of March 31, 2016, we held 26.22% of the outstanding shares of Hung Ching. Hung Ching
acquired our common shares in open market transactions and subsequent dividends upon
the acquired shares.
|
As of March 31, 2016, none of our major
shareholders had voting rights different from those of our other shareholders. We are not aware of any arrangement that may at
a subsequent date result in a change of control of us. Furthermore, other than disclosed above, we are not aware of any significant
changes in the percentage of ownership held by our major shareholders in 2013, 2014 and 2015.
As of March 31, 2016, a total of 7,918,272,896
common shares were outstanding. With certain limited exceptions, holders of common shares that are not ROC persons are required
to hold their common shares through a brokerage account in the ROC. As of March 31, 2016, 628,336,485 common shares were registered
in the name of a nominee of Citibank, N.A., the depositary under our ADS deposit agreement. Citibank, N.A., has advised us that,
as of March 31, 2016, 125,667,006 ADSs, representing 628,335,030 common shares, were held of record by Cede & Co., and 290
ADSs, representing 1,450 common shares, were held by 9 other U.S. persons. The remaining 5 common shares held by Citibank, N.A.
for the Company are a result of fractional shares distributed during stock distributions on our common shares underlying the ADSs.
RELATED PARTY TRANSACTIONS
In recent years, we have awarded cash bonuses
to the employees of our subsidiaries as part of their compensation, based in part on our consolidated net income and the subsidiaries’
contribution to our consolidated income. We expect to continue this practice in the future.
In order to comply with Singapore law and
other applicable laws and regulations, trusts organized under ROC law were established to hold and dispose of our common shares
issued to ASE Test and ASE Test Taiwan in connection with the merger of ASE Chung Li and ASE Material into our company in August
2004. Under Section 76(1)(b)(ii) of Singapore’s Companies Act, Chapter 50, ASE Test, a Singapore company, may not purport
to acquire, directly or indirectly, shares or units of shares in our company, ASE Test’s parent company. Pursuant to the
applicable trust agreements, the trustee under each trust is (1) the registered owner of our common shares, (2) authorized to exercise
all of the rights as a shareholder of our common shares, (3) authorized to sell our common shares, subject to market conditions,
when such common shares become available for resale under ROC law and in accordance with volume limitations under ROC law, at its
sole discretion; provided such common shares are sold (i) in compliance with ROC laws and regulations, (ii) in an orderly manner
in order to minimize the impact on the trading price of our common shares, and (iii) in a manner consistent with its fiduciary
duties owed to ASE Test and (4) able to transfer and deliver to ASE Test or ASE Test Taiwan the proceeds from the sale of our common
shares and any cash dividends distributed, as the case may be. In February 2010, to complete the tender offer to acquire Universal
Scientific, ASE Test transferred 141,808,499 shares to the shareholders of Universal Scientific. Neither ASE Test nor ASE Test
Taiwan have any rights with respect to our common shares held in trust pursuant to the applicable trust agreements other than the
right to receive the proceeds from the sale of such common shares and cash dividends declared while the shares remain in trust.
In December 2014, the trust established to hold the common shares issued to ASE Test Taiwan had been terminated because ASE Test
Taiwan was no longer a subsidiary owned by ASE Test and therefore
no longer subject to Singapore Companies Act requirements. As a result, ASE Test Taiwan directly owned 10,978,776 of our common
shares as of March 31, 2016 and the trust established to hold the common shares issued to ASE Test held 88,200,472 of our common
shares.
We have historically provided promissory
notes as guarantees to some of our subsidiaries. As of December 31, 2015, we endorsed and guaranteed the bonds issued by our
subsidiaries, Anstock Limited, in the amount of RMB521.1 million (US$80.4 million) and Anstock II Limited, in the amount of US$312.8
million, respectively. Other than such guarantee, we have no other contingent obligations.
In December 2013, we acquired the K21 factory-administration
building in Nantze Export Processing Zone, Taiwan, from Hung Ching for a consideration of NT$1,473.9 million.
In July 2014, we acquired factory-administration
building in Chung Li, Taiwan, from Hung Ching for a consideration of NT$4,540.1 million.
In 2014, a series of construction projects
for which we contracted with Fu Hwa Construction Co., Ltd. for the construction of buildings with green design concept and other
projects in Nantze Export Processing Zone, Taiwan, have been completed with a total consideration of NT$350.0 million.
In August 2014, we made the donation of
NT$15.0 million to Social Affairs Bureau of Kaohsiung City Government through ASE Cultural and Educational Foundation. In addition,
in order to demonstrate our commitment to environmental protection, in December 2013, our board of directors approved contributions
to environmental protection efforts in Taiwan in a total amount of not less than NT$3,000.0 million, to be made in the next 30
years. For the years ended December 31, 2014 and 2015, we have made contributions in the amount of NT$100.0 million (US$3.0
million) each, respectively, through ASE Cultural and Educational Foundation to fund various environmental projects and our board
of directors have resolved in a resolution in January 2016 to contribute NT$100.0 million (US$3.0 million) through ASE Cultural
and Educational Foundation in environmental projects in 2016.
In June 2015, we acquired the K22 and K23
factory-administration building in Nantze Export Processing Zone, Taiwan, from Hung Ching for a consideration of NT$2,466.0 million
(US$75.2 million).
In 2015, we have capitalized NT$504.6 million
(US$15.4 million) for the construction of foreign worker dormitory for which we contracted with Fu Hwa Construction Co., Ltd. in
Kaohsiung, Taiwan.
INTERESTS OF EXPERTS AND COUNSEL
Not applicable.
Item 8. Financial Information
CONSOLIDATED STATEMENTS AND
OTHER FINANCIAL INFORMATION
Consolidated financial statements are set
forth under “Item 18. Financial Statements.”
Export Sales
We categorize our revenues geographically
based on the country in which the customer is headquartered. Revenues from our export sales were NT$188,585.3 million, NT$219,843.7
and NT$250,671.4 million (US$7,644.8 million) in 2013, 2014 and 2015, respectively, which contributed 85.8%, 85.7% and 88.5% of
our total sales volume for those periods, respectively. See “Item 4. Information on the Company—Business Overview—Sales
and Marketing” for information on our export sales.
Legal Proceedings
K7 Plant Wastewater Discharge
In December 2013, the Kaohsiung City Environmental
Protection Bureau ordered us to suspend the operations at our K7 Plant’s wafer-level process where nickel was used for alleged
wastewater discharge violations and imposed a NT$110.1 million fine against us. The NT$110.1 million fine was later reduced to
NT$109.4 million as ordered by the Kaohsiung City Environmental
Protection Bureau. In December 2014, the Kaohsiung City Environmental Protection Bureau lifted the suspension order and approved
the full resumption of operations of our K7 Plant after ordering a series of examinations, hearings and trial runs. In September
2015, the fine was reduced to NT$102.0 million (US$3.1 million) by the Kaohsiung City Environmental Protection Bureau and we received
a refund of NT$7.3 million (US$0.2 million) in October 2015.
With respect to the NT$102.0 million (US$3.1
million) administrative penalty imposed on us by the Kaohsiung City Environmental Protection Bureau, we appealed to the Kaohsiung
High Administrative Court in August 2014 seeking to (i) revoke Kaohsiung City Government’s decision, (ii) lift the administrative
penalty imposed on us and (iii) demand a refund of the administrative penalty. On March 22, 2016, the Kaohsiung High Administrative
Court revoked Kaohsiung City Government’s decision and lifted the administrative penalty. Our demand for a refund of the
fine was dismissed. We appealed to the Supreme Administrative Court on April 14, 2016 against the Kaohsiung High Administrative
Court’s unfavorable ruling in dismissing a refund. The outcome of the proceeding cannot be predicted with certainty.
In connection with the same alleged violations
at our K7 plant, in October 2014, the Kaohsiung District Court ruled that we were in violation of the ROC Waste Disposal Act and
imposed on us a criminal penalty of NT$3.0 million. We appealed the case to the Taiwan High Court Kaohsiung District Branch in
November 2014. In September 2015, the Taiwan High Court Kaohsiung District Branch overturned the decision made by Kaohsiung District
Court and found the Company not guilty and repealed the criminal penalty imposed on the Company. The verdict was final and not
appealable.
Any penalties, fines, damages or settlements
made in connection with these criminal, civil, and/or administrative investigations and/or lawsuits may have a material adverse
effect on our business, results of operations and future prospects. See “Item 3. Key Information—Risk Factors—Risks
Relating to Our Business—Any environmental claims or failure to comply with any present or future environmental regulations,
as well as any fire or other industrial accident, may require us to spend additional funds and may materially and adversely affect
our financial condition and results of operations,” “Item 4. Information on the Company—Business Overview—Environmental
Matters” and “Item 4. Information on the Company—Property, Plants and Equipment.”
SPIL Litigation Against ASE
On October 15, 2015, in connection with
the Initial SPIL Tender Offer, SPIL filed a lawsuit in the Kaohsiung District Court against ASE requesting that the court invalidate
the Initial SPIL Tender Offer and confirm that ASE does not have the right to be registered as a shareholder of SPIL. The lawsuit
alleged that the Initial SPIL Tender Offer violate certain provisions of the ROC Securities and Exchange Act and certain provisions
of the ROC Fair Trade Act and because of these violations the Initial SPIL Tender Offer should be voided. Following a series of
pleadings and arguments on the amount of verdict fee that SPIL has to post before the case could be heard, the Kaohsiung District
Court ordered SPIL to post a verdict fee in the amount of NT$219.2 million (US$6.7 million) and scheduled a hearing on April 29,
2016. SPIL appealed the Kaohsiung District Court’s decision on the verdict fee to the Kaohsiung High Court, and, following
the Kaohsiung High Court’s decision to sustain the Kaohsiung District Court’s decision on the amount of the verdict
fee, SPIL appealed to the Supreme Court of Taiwan on January 18, 2016. As of the date of this annual report, the Supreme Court
has not ruled on whether to uphold or dismiss the Kaohsiung High Court’s decision on the verdict fee.
The outcome of these proceedings is uncertain.
If a dismissal is not granted or a settlement is not reached, such a lawsuit could result in substantial costs to ASE and divert
management’s attention and resources which may cause a material adverse effect on our results of operations, financial condition
and business. We are also unable to quantify the harm to our reputation should any adverse findings be made against us. If our
interest in SPIL from the Initial Tender Offer is voided by ROC courts, we may not realize the anticipated synergies, cost savings
and growth opportunities and the anticipated synergies and cost-saving benefits that would otherwise have resulted from our acquisition
of 779,000,000 common shares of SPIL.
Dividends and Dividend
Policy
We have historically paid dividends on
our common shares with respect to the results of the preceding year following approval by our shareholders at the annual general
meeting of shareholders. We have paid annual dividends on our common shares since 1989,
except in 2002 and 2006 when we did not pay any dividend due to the losses we incurred in the 2001 and 2005 fiscal years, respectively.
On April 1, 2016, our board of directors adopted resolutions to pay cash dividends of NT$1.6 per share based on 7,797,986,896 shares,
which equal to the number of issued shares shown in the shareholders’ roster as of March 23, 2016 minus the number of shares
repurchased by us as treasury stocks. This proposal is subject to shareholders’ approval at the annual general shareholders
meeting in June 2016 and the actual cash dividends per share will be adjusted by any fluctuations in the number of our shares due
to, for example, the exercise of share options.
The following table sets forth the stock
dividends paid during each of the years indicated and related information.
|
|
Cash Dividends Per Common Share
|
|
Stock Dividends Per Common Share
(1)
|
|
Total Common Shares Issued as Stock Dividends
|
|
Outstanding Common
Shares on
Record Date
(2)
|
|
Percentage of Outstanding Common Shares Represented by Stock Dividends
|
|
|
NT$
|
|
NT$
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2008
|
|
|
1.71
|
|
|
|
0.29
|
|
|
|
158,766,146
|
|
|
|
5,484,848,118
|
|
|
|
2.9
|
%
|
2009
|
|
|
0.50
|
|
|
|
–
|
|
|
|
–
|
|
|
|
5,474,320,814
|
|
|
|
–
|
|
2010
|
|
|
0.36
|
|
|
|
1.00
|
|
|
|
549,497,078
|
|
|
|
5,500,216,994
|
|
|
|
10.0
|
%
|
2011
|
|
|
0.65
|
|
|
|
1.15
|
|
|
|
695,735,660
|
|
|
|
6,055,261,112
|
|
|
|
11.5
|
%
|
2012
|
|
|
0.65
|
|
|
|
1.40
|
|
|
|
931,599,554
|
|
|
|
6,659,893,672
|
|
|
|
14.0
|
%
|
2013
|
|
|
1.05
|
|
|
|
–
|
|
|
|
–
|
|
|
|
7,611,579,786
|
|
|
|
–
|
|
2014
|
|
|
1.29
|
(3)
|
|
|
–
|
|
|
|
–
|
|
|
|
7,847,817,646
|
|
|
|
–
|
|
2015
|
|
|
2.00
|
|
|
|
–
|
|
|
|
–
|
|
|
|
7,900,130,996
|
|
|
|
–
|
|
_____
________________
|
(1)
|
Stock dividends were paid out from
retained earnings and capital surplus. Holders of common shares receive as a stock dividend
the number of common shares equal to the NT dollar value per common share of the dividend
declared multiplied by the number of common shares owned and divided by the par value
of NT$10 per share. Fractional shares are not issued but are paid in cash.
|
|
(2)
|
Aggregate number of common shares
outstanding on the record date applicable to the dividend payment. Includes common shares
issued in the previous year under our employee bonus plan.
|
|
(3)
|
On June 26, 2014, our shareholders
approved a cash dividend of NT$1.30 per share for 2013 earnings. On July 29, 2014, our
board of directors resolved to adjust the cash dividend ratio to NT$1.29411842 because
the number of outstanding common shares had changed as a result of the exercise of share
options.
|
In order to meet the needs of our present
and future capital expenditures, we anticipate paying both stock and cash dividends in the future. The form, frequency and amount
of future cash or stock dividends on our common shares will depend upon our net income, cash flow, financial condition, shareholders’
requirement for cash inflow and other factors. According to our Articles of Incorporation, we have a general policy that cash dividend
distribution should not be lower than 30% of the total dividend amount and the remainder be distributed as stock dividends. See
“Item 10. Additional information––Articles of Incorporation––Dividends and Distributions.”
In general, we are not permitted to distribute
dividends or make other distributions to shareholders for any year where we did not record net income or retained earnings (excluding
reserves). The ROC Company Law also requires that 10% of annual net income (less outstanding taxes and prior years’ losses,
if any) be set aside as a legal reserve until the accumulated legal reserve equals our paid-in capital. In addition, our Articles
of Incorporation require that before a dividend is paid pro rata out of our annual net income:
|
·
|
up to 1% of our annual net income (less prior years’ losses and legal and special reserves and the additions or deductions
of the portion of retained earnings that belong to equity investment gains or losses that have been realized through other comprehensive
income or losses measured at fair value, if any) should be paid to our directors as compensation; and
|
|
·
|
between 7% and 11% of the annual net income (less prior years’ losses and legal and special reserves and the additions
or deductions of the portion of retained earnings that belong to equity investment gains or losses that have been realized through
other comprehensive income or losses measured at fair value, if any) should be paid to our employees as bonuses; the 7% portion
is to be distributed to all employees in accordance with our employee bonus distribution rules, while any portion exceeding 7%
is to be distributed in accordance with rules established
by our board of directors to individual employees who have been recognized as having made special contributions to our company.
Such employees include those of our subsidiaries.
|
In January 2016, our board of directors
proposed to amend our Articles of Incorporation to distribute employees’ compensation and remuneration to directors at the
rates in 5.25%-8.25% and no higher than 0.75%, respectively, of net profit before income tax, employees’ compensation, and
remuneration to directors. The 5.25% portion is to be distributed to all employees in accordance with our employee compensation
distribution rules, while any portion exceeding 5.25% is to be distributed in accordance with rules established by our board of
directors to individual employees who have been recognized as having made special contributions to our company. Such employees
include those of our subsidiaries. This proposal is awaiting shareholders’ approval in their annual general meeting in June
2016.
Holders of ADSs will be entitled to receive
dividends, subject to the terms of the deposit agreement, to the same extent as the holders of our common shares. Cash dividends
will be paid to the depositary in NT dollars and, except as otherwise provided in the deposit agreement, will be converted by the
depositary into U.S. dollars and paid to holders of ADSs according to the terms of the deposit agreement. Stock dividends will
be distributed to the depositary and, except as otherwise provided in the deposit agreement, will be distributed by the depositary,
in the form of additional ADSs, to holders of ADSs according to the terms of the deposit agreement.
Holders of outstanding common shares on
a dividend record date will be entitled to the full dividend declared without regard to any prior or subsequent transfer of common
shares. Holders of outstanding ADSs are entitled to receive dividends, subject to the terms of the deposit agreement, to the same
extent as the holders of outstanding common shares.
For information relating to ROC withholding
taxes payable on dividends, see “Item 10. Additional Information—Taxation—ROC Taxation—Dividends.”
SIGNIFICANT CHANGES
Other than as disclosed elsewhere in this
annual report, we have not experienced any significant changes since the date of the annual financial statements.
Item 9. The Offer and Listing
OFFER AND LISTING DETAILS
Our common shares were first issued in
March 1984 and have been listed on the Taiwan Stock Exchange since July 1989. The Taiwan Stock Exchange is an auction market where
the securities traded are priced according to supply and demand through announced bid and ask prices. As of March 31, 2016, there
were an aggregate of 7,918,272,896 of our common shares outstanding. The following table sets forth, for the periods indicated,
the high and low closing prices and the average daily volume of trading activity on the Taiwan Stock Exchange for our common shares
and the high and low of the daily closing values of the Taiwan Stock Exchange Index. The closing price for our common shares on
the Taiwan Stock Exchange on April 28, 2016 was NT$32.20 per share.
|
|
Closing Price per Share
|
|
Adjusted Closing
Price per Share
(1)
|
|
Average Daily Trading Volume
|
|
Taiwan Stock
Exchange Index
|
|
|
High
|
|
Low
|
|
High
|
|
Low
|
|
(in thousands of shares)
|
|
High
|
|
Low
|
|
|
|
NT$
|
|
|
|
NT$
|
|
|
|
NT$
|
|
|
|
NT$
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2011
|
|
|
37.60
|
|
|
|
24.00
|
|
|
|
24.16
|
|
|
|
16.14
|
|
|
|
32,247
|
|
|
|
9,145.4
|
|
|
|
6,633.3
|
|
2012
|
|
|
31.10
|
|
|
|
20.15
|
|
|
|
22.37
|
|
|
|
14.39
|
|
|
|
24,667
|
|
|
|
8,144.0
|
|
|
|
6,894.7
|
|
2013
|
|
|
30.65
|
|
|
|
23.60
|
|
|
|
27.36
|
|
|
|
19.26
|
|
|
|
24,598
|
|
|
|
8,623.4
|
|
|
|
7,616.6
|
|
2014
|
|
|
41.00
|
|
|
|
26.80
|
|
|
|
37.71
|
|
|
|
23.51
|
|
|
|
25,609
|
|
|
|
9,569.2
|
|
|
|
8,264.5
|
|
First Quarter
|
|
|
33.80
|
|
|
|
26.80
|
|
|
|
30.51
|
|
|
|
23.51
|
|
|
|
28,492
|
|
|
|
8,849.3
|
|
|
|
8,264.5
|
|
Second Quarter
|
|
|
39.00
|
|
|
|
32.90
|
|
|
|
35.71
|
|
|
|
29.61
|
|
|
|
22,238
|
|
|
|
9,393.1
|
|
|
|
8,774.1
|
|
Third Quarter
|
|
|
41.00
|
|
|
|
35.40
|
|
|
|
37.71
|
|
|
|
32.16
|
|
|
|
25,959
|
|
|
|
9,569.2
|
|
|
|
8,960.8
|
|
Fourth Quarter
|
|
|
39.10
|
|
|
|
34.40
|
|
|
|
37.10
|
|
|
|
32.40
|
|
|
|
25,991
|
|
|
|
9,307.3
|
|
|
|
8,512.9
|
|
2015
|
|
|
47.75
|
|
|
|
30.00
|
|
|
|
45.75
|
|
|
|
30.00
|
|
|
|
28,467
|
|
|
|
9,973.1
|
|
|
|
7,410.3
|
|
First Quarter
|
|
|
47.75
|
|
|
|
36.65
|
|
|
|
45.75
|
|
|
|
34.65
|
|
|
|
31,837
|
|
|
|
9,758.1
|
|
|
|
9,048.3
|
|
Second Quarter
|
|
|
46.65
|
|
|
|
39.70
|
|
|
|
44.65
|
|
|
|
37.70
|
|
|
|
29,672
|
|
|
|
9,973.1
|
|
|
|
9,189.8
|
|
Third Quarter
|
|
|
42.10
|
|
|
|
30.00
|
|
|
|
40.10
|
|
|
|
30.00
|
|
|
|
33,371
|
|
|
|
9,379.2
|
|
|
|
7,410.3
|
|
Fourth Quarter
|
|
|
39.00
|
|
|
|
33.40
|
|
|
|
39.00
|
|
|
|
33.40
|
|
|
|
19,731
|
|
|
|
8,857.0
|
|
|
|
8,040.2
|
|
October
|
|
|
39.00
|
|
|
|
34.50
|
|
|
|
39.00
|
|
|
|
34.50
|
|
|
|
23,239
|
|
|
|
8,745.4
|
|
|
|
8,295.9
|
|
November
|
|
|
38.40
|
|
|
|
34.35
|
|
|
|
38.40
|
|
|
|
34.35
|
|
|
|
16,591
|
|
|
|
8,857.0
|
|
|
|
8,295.4
|
|
December
|
|
|
38.50
|
|
|
|
33.40
|
|
|
|
38.50
|
|
|
|
33.40
|
|
|
|
19,394
|
|
|
|
8,463.3
|
|
|
|
8,040.2
|
|
2016
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
First Quarter
|
|
|
38.30
|
|
|
|
33.75
|
|
|
|
38.30
|
|
|
|
33.75
|
|
|
|
17,321
|
|
|
|
8,812.7
|
|
|
|
7,664.0
|
|
January
|
|
|
36.60
|
|
|
|
33.75
|
|
|
|
36.60
|
|
|
|
33.75
|
|
|
|
16,734
|
|
|
|
8,145.2
|
|
|
|
7,664.0
|
|
February
|
|
|
37.95
|
|
|
|
34.20
|
|
|
|
37.95
|
|
|
|
34.20
|
|
|
|
20,129
|
|
|
|
8,411.2
|
|
|
|
8,063.0
|
|
March
|
|
|
38.30
|
|
|
|
35.85
|
|
|
|
38.30
|
|
|
|
35.85
|
|
|
|
16,271
|
|
|
|
8,812.7
|
|
|
|
8,485.7
|
|
Second Quarter
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
April (through April 28, 2016)
|
|
|
36.35
|
|
|
|
32.20
|
|
|
|
36.35
|
|
|
|
32.20
|
|
|
|
21,189
|
|
|
|
8,700.4
|
|
|
|
8,473.9
|
|
_______
____________
|
(1)
|
As adjusted retroactively by the
Taiwan Stock Exchange to give effect to stock dividends and cash dividends paid in the
periods indicated. See “Item 8. Financial Information—Consolidated Statements
and Other Financial Information—Dividends and Dividend Policy.”
|
The performance of the Taiwan Stock Exchange
has in recent years been characterized by extreme price volatility. There are currently limits on the range of daily price movements
on the Taiwan Stock Exchange. In the case of equity securities traded on the Taiwan Stock Exchange, such as our common shares,
fluctuations in the price of a particular security may not exceed a 10.0% change either above or below the previous day’s
closing price of such security.
Our ADSs have been listed on the New York
Stock Exchange under the symbol “ASX” since September 26, 2000. The outstanding ADSs are identified by the CUSIP number
00756M404. As of March 31, 2016, a total of 125,667,296 ADSs were outstanding. The following table sets forth, for the periods
indicated, the high and low closing prices and the average daily volume of trading activity on the New York Stock Exchange for
our ADSs and the highest and lowest of the daily closing values of the New York Stock Exchange Index. The closing price for our
ADSs on the New York Stock Exchange on April 28, 2016 was US$4.96 per ADS.
|
|
Closing
Price per ADS
|
|
Adjusted
Closing
Price per ADS
(1)
|
|
Average
Daily Trading Volume
|
|
New
York Stock
Exchange Index
|
|
|
High
|
|
Low
|
|
High
|
|
Low
|
|
(in
thousands of ADSs)
|
|
High
|
|
Low
|
|
|
US$
|
|
US$
|
|
US$
|
|
US$
|
|
|
|
|
|
|
2011
|
|
|
6.55
|
|
|
|
4.04
|
|
|
|
5.21
|
|
|
|
3.28
|
|
|
|
1,346
|
|
|
|
8,671.4
|
|
|
|
6,571.5
|
|
2012
|
|
|
5.27
|
|
|
|
3.54
|
|
|
|
4.27
|
|
|
|
2.94
|
|
|
|
1,065
|
|
|
|
8,516.4
|
|
|
|
7,285.5
|
|
2013
|
|
|
5.35
|
|
|
|
3.91
|
|
|
|
4.85
|
|
|
|
3.24
|
|
|
|
746
|
|
|
|
10,400.3
|
|
|
|
8,604.4
|
|
2014
|
|
|
6.87
|
|
|
|
4.45
|
|
|
|
6.22
|
|
|
|
4.03
|
|
|
|
752
|
|
|
|
11,104.7
|
|
|
|
9,741.6
|
|
First Quarter
|
|
|
5.55
|
|
|
|
4.45
|
|
|
|
5.03
|
|
|
|
4.03
|
|
|
|
731
|
|
|
|
10,527.8
|
|
|
|
9,741.6
|
|
Second Quarter
|
|
|
6.65
|
|
|
|
5.43
|
|
|
|
6.02
|
|
|
|
4.92
|
|
|
|
709
|
|
|
|
11,018.1
|
|
|
|
10,280.9
|
|
Third Quarter
|
|
|
6.87
|
|
|
|
5.87
|
|
|
|
6.22
|
|
|
|
5.43
|
|
|
|
728
|
|
|
|
11,104.7
|
|
|
|
10,583.8
|
|
Fourth Quarter
|
|
|
6.39
|
|
|
|
5.80
|
|
|
|
6.00
|
|
|
|
5.45
|
|
|
|
839
|
|
|
|
11,047.9
|
|
|
|
10,109.7
|
|
2015
|
|
|
7.89
|
|
|
|
4.69
|
|
|
|
7.41
|
|
|
|
4.69
|
|
|
|
1,405
|
|
|
|
11,239.7
|
|
|
|
9,601.4
|
|
First Quarter
|
|
|
7.89
|
|
|
|
5.96
|
|
|
|
7.41
|
|
|
|
5.60
|
|
|
|
1,485
|
|
|
|
11,122.1
|
|
|
|
10,514.6
|
|
Second Quarter
|
|
|
7.51
|
|
|
|
6.39
|
|
|
|
7.05
|
|
|
|
6.00
|
|
|
|
1,412
|
|
|
|
11,239.7
|
|
|
|
10,790.3
|
|
Third Quarter
|
|
|
6.67
|
|
|
|
4.69
|
|
|
|
6.27
|
|
|
|
4.69
|
|
|
|
1,700
|
|
|
|
11,024.9
|
|
|
|
9,601.4
|
|
Fourth Quarter
|
|
|
6.12
|
|
|
|
5.18
|
|
|
|
6.12
|
|
|
|
5.18
|
|
|
|
1,028
|
|
|
|
10,609.9
|
|
|
|
9,821.0
|
|
October
|
|
|
6.12
|
|
|
|
5.24
|
|
|
|
6.12
|
|
|
|
5.24
|
|
|
|
1,378
|
|
|
|
10,538.2
|
|
|
|
9,821.0
|
|
November
|
|
|
5.90
|
|
|
|
5.39
|
|
|
|
5.90
|
|
|
|
5.39
|
|
|
|
724
|
|
|
|
10,609.9
|
|
|
|
10,155.1
|
|
December
|
|
|
5.83
|
|
|
|
5.18
|
|
|
|
5.83
|
|
|
|
5.18
|
|
|
|
953
|
|
|
|
10,519.6
|
|
|
|
9,967.6
|
|
2016
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
First Quarter
|
|
|
5.87
|
|
|
|
4.95
|
|
|
|
5.87
|
|
|
|
4.95
|
|
|
|
1,015
|
|
|
|
10,237.0
|
|
|
|
9,029.9
|
|
January
|
|
|
5.53
|
|
|
|
5.02
|
|
|
|
5.53
|
|
|
|
5.02
|
|
|
|
902
|
|
|
|
10,028.1
|
|
|
|
9,156.8
|
|
February
|
|
|
5.64
|
|
|
|
4.95
|
|
|
|
5.64
|
|
|
|
4.95
|
|
|
|
915
|
|
|
|
9,625.3
|
|
|
|
9,029.9
|
|
March
|
|
|
5.87
|
|
|
|
5.60
|
|
|
|
5.87
|
|
|
|
5.60
|
|
|
|
1,204
|
|
|
|
10,237.0
|
|
|
|
9,771.0
|
|
Second Quarter
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
April (through April 28, 2016)
|
|
|
5.74
|
|
|
|
4.96
|
|
|
|
5.74
|
|
|
|
4.96
|
|
|
|
1,456
|
|
|
|
10,571.8
|
|
|
|
10,045.2
|
|
_____
_______________
|
(1)
|
As adjusted retroactively to give
effect to stock dividends and cash dividends paid in the periods indicated.
|
PLAN OF DISTRIBUTION
Not applicable.
MARKETS
The principal trading market for our common
shares is the Taiwan Stock Exchange and the principal trading market for ADSs representing our common shares is the New York Stock
Exchange.
SELLING SHAREHOLDERS
Not applicable.
DILUTION
Not applicable.
EXPENSES OF THE ISSUE
Not applicable.
Item 10. Additional Information
SHARE CAPITAL
Not applicable.
ARTICLES OF INCORPORATION
General
We are a company limited by shares organized
under the laws of the ROC. Our organizational document is our Articles of Incorporation. We have no by-laws.
Our Articles of Incorporation provide,
in Article 2, that we may engage in the following types of business:
|
·
|
the manufacture, assembly, processing, testing and export of various types of integrated circuitry;
|
|
·
|
the research, development, design and manufacture, assembly, processing, testing and export of various computers, electronics,
communications, information products and their peripheral products;
|
|
·
|
general import and export trading (excluding businesses that require trading permits);
|
|
·
|
the manufacture of electronic parts and components;
|
|
·
|
the manufacture of mechanical and electronic devices and materials (including integrated circuit leadframes, BGA substrates
and flip-chip substrates);
|
|
·
|
wholesale and retail sales of electronic materials;
|
|
·
|
technical support and consulting service for integrated circuit leadframes, BGA substrates and flip-chip substrates;
|
|
·
|
except any business requiring a special permit, any business not prohibited or restricted by law or regulation.
|
We were incorporated on March 23, 1984
as a company limited by shares under the ROC Company Law. Our authorized share capital registered with the Kaohsiung Export Processing
Zones Administration was NT$95 billion, divided into 9,500 million common shares, 7,918,272,896 of which were outstanding
as of March 31, 2016. Our authorized share capital under our Articles of Incorporation is NT$100 billion, divided into 10 billion
common shares. We do not have any equity in the form of preference shares or otherwise outstanding as of the date of this annual
report.
Subject to limited exceptions, with the
approval of our board of directors and the FSC, we may grant stock options to our employees, provided that NT$8,000 million of
our authorized capital (800 million common shares) is reserved for employee stock options. The total number of shares to be issued
under all option plans, together with all restricted shares issued to employees, shall not exceed 15% of our outstanding common
shares.
Unless otherwise approved by the shareholders’ meeting, the exercise price of an option shall not be
less than the closing price of our common shares on the Taiwan Stock Exchange on the grant date of the option. As of March 31,
2016, we had granted 480,075,500 options pursuant to employee stock option plans established on November 22, 2007, April 20, 2010
and April 17, 2015 to our full-time employees, including our domestic and foreign subsidiaries.
See “Item 6.
Directors, Senior Management and Employees—Compensation—ASE Inc. Employee Bonus and Stock Option Plans.”
Directors
Our Articles of Incorporation provide that,
we are to have 11 to 15 directors with tenures of three years who are elected at a shareholders’ meeting. In addition, three
of our directors will be required to be independent directors. Our audit committee replaced the function of supervisors in accordance
with the ROC Securities and Exchange Act to exercise the powers and duties of supervisors starting from June 2015.
There is no minimum amount of shares necessary
to stand for election to a directorship. Many of our directors are representatives appointed by corporate shareholders which appoint
individual representatives. Re-elections are allowed. The board of directors has certain powers and duties, including devising
operations strategy, proposing to distribute dividends or make up losses, proposing to increase or decrease capital, reviewing
material internal rules and contracts, hiring and discharging the general manager, establishing and dissolving branch offices,
reviewing budgets and financial statements and other duties and powers granted by or in accordance with the ROC Company Law, our
Articles of Incorporation or shareholders resolutions.
The board of directors is constituted by
the directors, who elect a chairman from among the directors to preside over the meeting of the board. Meetings of the board may
be held in the ROC or by videoconference. A director may appoint another director to attend a meeting and vote by proxy, but a
director may accept only one proxy.
Dividends and Distributions
In general, we are not permitted to distribute
dividends or make other distributions to shareholders in any given year in which we did not record net income or retained earnings
(excluding reserves). The ROC Company Law also requires that 10% of annual net income (less prior years’ losses, if any,
and applicable income taxes) be set aside as a legal reserve until the accumulated legal reserve equals our paid-in capital. In
addition, our Articles of Incorporation require that before a dividend is paid out of our annual net income:
|
·
|
up to 1% of our annual net income (less prior years’ losses and legal and special reserves and the additions or deductions
of the portion of retained earnings that belong to equity investment gains or losses that have been realized through other comprehensive
income or losses measured at fair value, if any) should be paid to our directors as compensation; and
|
|
·
|
between 7% and 11% of the annual net income (less prior years’ losses and legal and special reserves and the additions
or deductions of the portion of retained earnings that belong to equity investment gains or losses that have been realized through
other comprehensive income or losses measured at fair value, if any) should be paid to our employees as bonuses. The 7% portion
is to be distributed to all employees in accordance with our employee bonus distribution rules, while any portion exceeding 7%
is to be distributed in accordance with rules established by our board of directors to individual employees who have been recognized
as having made special contributions to our company. Such employees include those of our subsidiaries.
|
In January 2016, our board of directors
proposed to amend our Articles of Incorporation to distribute employees’ compensation and remuneration to directors at the
rates in 5.25%-8.25% and no higher than 0.75%, respectively, of net profit before income tax, employees’ compensation, and
remuneration to directors. The 5.25% portion is to be distributed to all employees in accordance with our employee compensation
distribution rules, while any portion exceeding 5.25% is to be distributed in accordance with rules established by our board of
directors to individual employees who have been recognized as having made special contributions to our company. Such employees
include those of our subsidiaries. This proposal is subject to the shareholders’ approval at the annual general meeting in
June 2016.
At the annual general meeting of shareholders,
our board of directors submits to the shareholders for their approval any proposal for the distribution of dividends or the making
of any other distribution to shareholders from our net income for the preceding fiscal year. All common shares outstanding and
fully paid as of the relevant record date are entitled to share equally in any dividend or other distribution so approved. Dividends
may be distributed in cash, in the form of common shares or a combination of the two, as determined by the shareholders at the
meeting. According to our Articles of Incorporation, we have a general policy that cash dividend distribution should not be lower
than 30% of the total dividend amount and the remainder be distributed as stock dividends. See “Item 8. Financial Information—Consolidated
Statements and Other Financial Information—Dividends and Dividend Policy.”
We are also permitted to make distributions
to our shareholders in cash or in the form of common shares from reserves if we have no accumulated loss. However, the distribution
payable out of our legal reserve can only come from the amount exceeding 25% of the total paid-in capital.
For information on the dividends we paid
in recent years, see “Item 8. Financial Information—Consolidated Statements and Other Financial Information—Dividends
and Dividend Policy.” For information as to ROC taxes on dividends and distributions, see “—Taxation—ROC
Taxation—Dividends.”
Changes in Share Capital
Under ROC Company Law, any change in the
authorized share capital of a company limited by shares requires an amendment to its Articles of Incorporation, which in turn requires
approval at the shareholders’ meeting. In the case of a public company such as ourselves, we must also obtain the approval
of, or submit a report to, the FSC and the Kaohsiung Export Processing Zone Administration. Authorized but unissued common shares
may be issued, subject to applicable ROC law, upon terms as our board of directors may determine. Our authorized share capital
registered with the Kaohsiung Export Processing Zones Administration was NT$95 billion, divided into 9,500 million common shares
with a face value of NT$10.0 per share as of March 31, 2016. Our authorized share capital under our Articles of Incorporation
is NT$100 billion, divided into 10 billion common shares. There were 500 million common shares included in our authorized shares
that are currently not registered with the Kaohsiung Export Processing Zones Administration. We will complete the registration
with the Kaohsiung Export Processing Zones Administration if and when our total issued share capital equals or exceeds NT$95 billion.
Preemptive Rights
Under the ROC Company Law, when an ROC
company issues new shares for cash, existing shareholders who are listed on the shareholders’ register as of the record date
have preemptive rights to subscribe for the new issue in proportion to their existing shareholdings, while a company’s employees,
whether or not they are shareholders of the company, have rights to subscribe for 10% to 15% of the new issue. Any new shares that
remain unsubscribed at the expiration of the subscription period may be freely offered, subject to compliance with applicable ROC
law.
In addition, in accordance with the ROC
Securities and Exchange Act, a public company that intends to offer new shares for cash must offer to the public at least 10% of
the shares to be sold, except under certain circumstances or when exempted by the FSC. This percentage can be increased by a resolution
passed at a shareholders’ meeting, which would diminish the number of new shares subject to the preemptive rights of existing
shareholders.
These preemptive rights provisions do not
apply to offerings of new shares through a private placement approved at a shareholders’ meeting.
Meetings of Shareholders
We are required to hold an annual general
meeting of our shareholders within six months following the end of each fiscal year. These meetings are generally held in Kaohsiung,
Taiwan. Any shareholder who holds 1% or more of our issued and outstanding shares may submit one written proposal for discussion
at our annual general meeting. Extraordinary shareholders’ meetings may be convened by resolution of the board of directors
or by the board of directors upon the written request of any shareholder or shareholders who have held 3% or more of the outstanding
common shares for a period of one year or longer. Shareholders’ meetings may also be convened by member(s) of the audit committee.
Notice in writing of meetings of shareholders, stating the place, time and purpose, must be dispatched to each shareholder at least
30 days, in the case of annual general meetings, and 15 days, in the case of extraordinary meetings, before the date set for each
meeting. A majority of the holders of all issued and outstanding common shares present at a shareholders’ meeting constitutes
a quorum for meetings of shareholders.
Voting Rights
Under the ROC Company Law, except under
limited circumstances, shareholders have one vote for each common share held. Under the ROC Company Law, our directors are elected
at a shareholders’ meeting through cumulative voting.
In general, a resolution can be adopted
by the holders of at least a majority of our common shares represented at a shareholders’ meeting at which the holders of
a majority of all issued and outstanding common shares are present. Under ROC Company Law, the approval by at least a majority
of our common shares represented at a shareholders’ meeting in which a quorum of at least two-thirds of all issued and outstanding
common shares are represented is required for major corporate actions, including:
|
·
|
amendment to the Articles of Incorporation, including increase of authorized share capital and any changes of the rights of
different classes of shares;
|
|
·
|
execution, amendment or termination of any contract through which the company leases its entire business to others, or the
company appoints others to operate its business or the company operates its business with others on a continuous basis;
|
|
·
|
transfer of entire business or assets or a substantial part of its business or assets;
|
|
·
|
acquisition of the entire business or assets of any other company, which would have a significant impact on the company’s
operations;
|
|
·
|
distribution of any stock dividend;
|
|
·
|
dissolution, merger or spin-off of the company;
|
|
·
|
issuance of restricted shares to employees; and
|
|
·
|
removal of the directors.
|
However, in the case of a listed company
such as us, the resolution may be adopted by the holders of at least two-thirds of our issued and outstanding common shares represented
at a shareholders’ meeting at which the holders of at least a majority of all issued and outstanding common shares are present.
A shareholder may be represented at an
annual general or extraordinary meeting by proxy if a valid proxy form is delivered to us five days before the commencement of
the annual general or extraordinary shareholders’ meeting. Shareholders may exercise their voting rights
by way of a written ballot or by way of electronic transmission if the voting decision is delivered to us two days before the commencement
of the annual general or extraordinary shareholders’ meeting.
Holders of ADSs do not have the right to
exercise voting rights with respect to the underlying common shares, except as described in the deposit agreement.
Other Rights of Shareholders
Under the ROC Company Law, dissenting shareholders
are entitled to appraisal rights in certain major corporate actions such as a proposed amalgamation by the company. If agreement
with the company cannot be reached, dissenting shareholders may seek a court order for the company to redeem all of their shares.
Shareholders may exercise their appraisal rights by serving written notice on the company prior to or at the related shareholders’
meeting and/or by raising and registering an objection at the shareholders’ meeting. In addition to appraisal rights, shareholders
have the right to sue for the annulment of any resolution adopted at a shareholders’ meeting where the procedures were legally
defective within 30 days after the date of the shareholders’ meeting. One or more shareholders who have held 3% or more of
the issued and outstanding shares of a company for a period of one year or longer may require an independent director to bring
a derivative action on behalf of the company against a director as a result of the director’s unlawful actions or failure
to act.
Rights of Holders of Deposited Securities
Except as described below, holders of ADSs
generally have no right under the deposit agreement to instruct the depositary to exercise the voting rights for our common shares
represented by the ADSs. Instead, by accepting ADSs or any beneficial interest in ADSs, holders of ADSs are deemed to have authorized
and directed the depositary to appoint our chairman or his designee to represent them at our shareholders’ meetings and to
vote our common shares deposited with the custodian according to the terms of the deposit agreement.
The depositary will mail to holders of
ADSs any notice of shareholders’ meeting received from us together with information explaining how to instruct the depositary
to exercise the voting rights of the securities represented by ADSs.
If we fail to timely provide the depositary
with an English language translation of our notice of meeting or other materials related to any meeting of owners of common shares,
the depositary will endeavor to cause all the deposited securities represented by ADSs to be present at the applicable meeting,
insofar as practicable and permitted under applicable law, but will not cause those securities to be voted.
If the depositary timely receives voting
instructions from owners of at least 51.0% of the outstanding ADSs to vote in the same direction regarding one or more resolutions
to be proposed at the meeting, including election of directors, the depositary will notify our chairman or his designee to attend
the meeting and vote all the securities represented by the holders’ ADSs in accordance with the direction received from owners
of at least 51.0% of the outstanding ADSs.
If we have timely provided the depositary
with the materials described in the deposit agreement and the depositary has not timely received instructions from holders of at
least 51.0% of the outstanding ADSs to vote in the same direction regarding any resolution to be considered at the meeting, then,
holders of ADSs will be deemed to have authorized and directed the depositary bank to give a discretionary proxy to our chairman
or his designee to attend and vote at the meeting our common shares represented by the ADSs in any manner, our chairman or his
designee may wish, which may not be in the interests of holders.
The ability of the depositary to carry
out voting instructions may be limited by practical and legal limitations and the terms of the securities on deposit. We cannot
assure ADS holders that they will receive voting materials in time to enable them to return voting instructions to the depositary
in a timely manner.
While shareholders who own 1% or more of
our outstanding shares are entitled to submit one proposal to be considered at our annual general meetings, only holders representing
at least 51% of our ADSs outstanding at the relevant record date are entitled to submit one proposal to be considered at our annual
general meetings. Hence, only one proposal may be submitted on behalf of all ADS holders.
Register of Shareholders and Record Dates
Our share registrar, President Securities
Corp., maintains our register of shareholders at its offices in Taipei, Taiwan. Under the ROC Company Law and our Articles of Incorporation,
we may, by giving advance public notice, set a record date and close the register of shareholders for a specified period in order
for us to determine the shareholders or pledgees that are entitled to rights pertaining to our common share. The specified period
required is as follows:
|
·
|
annual general meeting—60 days;
|
|
·
|
extraordinary shareholders’ meeting—30 days; and
|
|
·
|
relevant record date for distribution of dividends, bonuses or other interests—5 days.
|
Annual Financial Statements
At least ten days before the annual general
meeting, our annual financial statements, which are prepared in conformity with Taiwan IFRS, must be available at our principal
executive office in Kaohsiung, Taiwan for inspection by the shareholders.
Transfer of Common Shares
The transfer of common shares in registered
form is effected by endorsement and delivery of the related share certificates but, in order to assert shareholders’ rights
against us, the transferee must have his name and address registered on our register of shareholders. Shareholders are required
to file their respective specimen seals, also known as chops, with us. Chops are official stamps widely used in Taiwan by individuals
and other entities to authenticate the execution of official and commercial documents. The settlement of trading in our common
shares is normally carried out on the book-entry system maintained by the Taiwan Depository & Clearing Corporation.
Acquisition of Common Shares by ASE Inc.
Under the ROC Securities and Exchange Act,
we may purchase our own common shares for treasury stock under limited circumstances, including:
|
·
|
to transfer shares to our employees;
|
|
·
|
to deliver shares upon the conversion or exercise of bonds with warrants, preferred shares with warrants, convertible bonds,
convertible preferred shares or warrants issued by us; and
|
|
·
|
to maintain our credit and our shareholders’ equity, provided that the shares so purchased shall be canceled.
|
We may purchase our common shares on the
Taiwan Stock Exchange or by means of a public tender offer. These transactions require the approval of a majority of our board
of directors at a meeting in which at least two-thirds of the directors are in attendance. The total amount of common shares purchased
for treasury stock may not exceed 10.0% of the total issued shares. In addition, the total cost of the purchased shares shall not
exceed the aggregate amount of our retained earnings, any premium from share issuances and the realized portion of our capital
reserve.
We may not pledge or hypothecate any of
our shares purchased by us. In addition, we may not exercise any shareholders’ right attaching to such shares. In the event
that we purchase our shares on the Taiwan Stock Exchange, our affiliates, directors, managers, and their respective spouses and
minor children and/or nominees are prohibited from selling any of our shares during the period in which we are purchasing our shares.
Pursuant to the ROC Company Law, an entity
in which our company directly or indirectly owns more than 50.0% of the voting shares or paid-in capital, which is referred to
as a controlled entity, may not purchase our shares. Also, if our company and a controlled entity jointly own, directly or indirectly,
more than 50.0% of the voting shares or paid-in capital of another entity, which is referred to as a third entity, the third entity
may not purchase shares in either our company or a controlled entity.
Liquidation Rights
In the event of our liquidation, the assets
remaining after payment of all debts, liquidation expenses and taxes will be distributed pro rata to the shareholders in accordance
with the relevant provisions of the ROC Company Law.
Transfer Restrictions
Substantial Shareholders
The ROC Securities and Exchange Act currently
requires:
|
·
|
each director, manager, or substantial shareholder (that is, a shareholder who holds more than 10.0% shares of a company),
and their respective spouses, minor children or nominees, to report any change in that person’s shareholding to the issuer
of the shares and the FSC; and
|
|
·
|
each director, manager, or substantial shareholder, and their respective spouses, minor children or nominees, after acquiring
the status of director, manager, or substantial shareholder for a period of six months, to report his or her intent to transfer
any shares on the Taiwan Stock Exchange to the FSC at least three days before the intended transfer, unless the number of shares
to be transferred does not exceed 10,000 shares.
|
In addition, the number of shares that
can be sold or transferred on the Taiwan Stock Exchange by any person subject to the restrictions described above on any given
day may not exceed:
|
·
|
0.2% of the outstanding shares of the company in the case of a company with no more than 30 million outstanding shares; or
|
|
·
|
0.2% of 30 million shares plus 0.1% of the outstanding shares exceeding 30 million shares in the case of a company with more
than 30 million outstanding shares; or
|
|
·
|
in any case, 5.0% of the average trading volume (number of shares) on the Taiwan Stock Exchange for the ten consecutive trading
days preceding the reporting day on which the director, manager or substantial shareholder reports the intended share transfer
to the FSC.
|
These restrictions do not apply to sales
or transfers of our ADSs.
MATERIAL CONTRACT
Joint Venture Agreement between ASE and
TDK Corporation
On May 8, 2015, we entered into a
joint venture agreement with TDK Corporation, under which both parties would invest in ASEEE, a company limited by shares
incorporated under ROC law. ASEEE will engage in the business of manufacture, marketing, distribution and sale of embedded
substrates, and it plans to leverage TDK Corporation’s expertise, patents and knowledge in the field of SESUB
technology. Pursuant to the joint venture agreement, TDK Corporation would provide ASEEE with certain materials required in
the manufacturing of embedded substrates based on SESUB technology as well as necessary equipment. In August 2015, we
invested NT$618.1 million (US$18.9 million) to subscribe for 651,809,660 shares of ASEEE, representing 51% shareholding in
ASEEE. The investment in ASEEE is accounted for using the equity method.
Under the terms of the joint venture agreement,
we are entitled to designate the chairman of the board of directors of ASEEE, as well as three out of the five directors who constitute
the board of directors. However, according to the joint venture arrangement, certain corporate actions require the affirmative
vote of at least two-thirds of directors. As a result, we and TDK jointly direct the operating activities of ASEEE.
FOREIGN INVESTMENT IN THE ROC
Historically, foreign investment in the
ROC securities market has been restricted. Since 1983, the ROC government has from time to time enacted legislation and adopted
regulations to permit foreign investment in the ROC securities market.
On September 30, 2003, the Executive Yuan
approved an amendment to the Regulations Governing Investment in Securities by Overseas Chinese and Foreign National, or the Regulations,
which took effect on October 2, 2003. Pursuant to the Regulations, the FSC abolished the mechanism of the “qualified foreign
institutional investors” and “general foreign investors” as stipulated in the Regulations before the amendment.
Under the Regulations, foreign investors
(other than PRC persons) are classified as either “onshore foreign investors” or “offshore foreign investors”
according to their respective geographical location. Both onshore and offshore foreign investors are allowed to invest in ROC securities
after they register with the Taiwan Stock Exchange or the Taiwan Futures Exchange. The Regulations further classify foreign investors
into foreign institutional investors and foreign individual investors. “Foreign institutional investors” refer to those
investors incorporated and registered in accordance with foreign laws outside of the ROC (i.e., offshore foreign institutional
investors) or their branches set up and recognized within the ROC (i.e., onshore foreign institutional investors). Offshore overseas
Chinese and foreign individual investors may be subject to a maximum investment ceiling that will be separately determined by the
FSC, after consultation with the Central Bank of the Republic of China (Taiwan). Currently, there is no maximum investment ceiling
for offshore overseas Chinese and foreign individual investors. On the other hand, foreign institutional investors are not subject
to any ceiling for investment in the ROC securities market.
Except for certain specified industries,
such as telecommunications, investments in ROC-listed companies by foreign investors are not subject to individual or aggregate
foreign ownership limits. Custodians for foreign investors are required to submit to the Central Bank of the Republic of China
(Taiwan) and the Taiwan Stock Exchange a monthly report of trading activities and status of assets under custody and other matters.
Capital remitted to the ROC under these guidelines may be remitted out of the ROC at any time after the date the capital is remitted
to the ROC. Capital gains and income on investments may be remitted out of the ROC at any time.
Foreign investors (other than PRC persons)
who wish to make (i) direct investments in the shares of ROC private companies or (ii) investment in 10.0% or more of the equity
interest of a ROC company listed on the Taiwan Stock Exchange or the Taipei Exchange in any single transaction, are required to
submit a foreign investment approval application to the MOEAIC or other applicable government authority. The MOEAIC or such other
government authority reviews each foreign investment approval application and approves or disapproves each application after consultation
with other governmental agencies (such as the Central Bank of the Republic of China (Taiwan) and the FSC).
Under current ROC law, any non-ROC person
possessing a foreign investment approval may remit capital for the approved investment and is entitled to repatriate annual net
profits, interest and cash dividends attributable to the approved investment. Dividends attributable to such investment may be
repatriated upon submitting certain required documents to the remitting bank, and investment capital and capital gains attributable
to such investment may be repatriated after approvals of the MOEAIC or other government authorities have been obtained.
In addition to the general restriction
against direct investment by foreign investors in securities of ROC companies, foreign investors (except in certain limited cases)
are currently prohibited from investing in certain industries in the ROC pursuant to a “negative list,” as amended
by the Executive Yuan. The prohibition on foreign investment in the prohibited industries specified in the negative list is absolute
in the absence of a specific exemption from the application of the negative list. Pursuant to the negative list, certain other
industries are restricted so that foreign investors (except in limited cases) may invest in these industries only up to a specified
level and with the special approval of the relevant competent authority that is responsible for enforcing the relevant legislation
that the negative list is intended to implement.
The FSC announced the PRC Regulations
on April 30, 2009. According to the PRC Regulations, a PRC QDII is allowed to invest in ROC securities (including less than
10.0% shareholding of a ROC company listed on the Taiwan Stock Exchange or the Taipei Exchange) provided that the total
investment amount of any QDII does not exceed US$500 million. The custodians of QDIIs must apply with the Taiwan Stock
Exchange for the remittance amount for each QDII, which cannot exceed US$100 million, and QDII can only invest in ROC
securities at an amount approved by the Taiwan Stock Exchange. In addition, QDIIs are currently prohibited from investing in
certain industries, and their investment in any company of certain other industries is restricted to a certain percentage
pursuant to a list promulgated by the FSC and amended from time to time. PRC investors other than QDII are prohibited from
making investments in a ROC company listed on the Taiwan Stock Exchange or the Taipei Exchange if the investment is less than
10.0% of the equity interest of such ROC company.
In addition to investments permitted under
the PRC Regulations, PRC investors who wish to make (i) direct investment in the shares of ROC private companies or (ii) investments,
individually or in the aggregate, in 10.0% or more of the equity interest of a ROC company listed on the Taiwan Stock Exchange
or the Taipei Exchange, are required to submit an investment approval application to the MOEAIC or other government authority.
The MOEAIC or such other government authority reviews each investment approval application and approves or disapproves each application
after consultation with other governmental agencies.
In addition to the general restriction
against direct investment by PRC investors in securities of ROC companies, PRC investors may only invest in certain industries
on the “positive list” promulgated by the Executive Yuan. Furthermore, a PRC investor who wishes to be elected as a
ROC company’s director or supervisor shall submit an investment approval application to the MOEAIC or other government authority
for approval.
EXCHANGE CONTROLS
ROC Exchange Controls
The ROC Foreign Exchange Control Law and
regulations provide that all foreign exchange transactions must be executed by banks designated by the FSC and by the Central Bank
of the Republic of China (Taiwan) to engage in such transactions. Current regulations favor trade-related or service-related foreign
exchange transactions. Consequently, foreign currency earned from exports of merchandise and services may now be retained and used
freely by exporters, and all foreign currency needed for the importation of merchandise and services may be purchased freely from
the designated foreign exchange banks.
Apart from trade-related or service-related
foreign exchange transactions, ROC companies and individual residents of the ROC reaching the age of 20 years old may, without
foreign exchange approval, remit foreign currency of up to US$50 million (or its equivalent) and US$5 million (or its equivalent)
to and from the ROC, respectively, in each calendar year. The above limits apply to remittances involving either a conversion of
NT dollars into a foreign currency or a conversion of foreign currency into NT dollars. In addition, a requirement is also imposed
on all enterprises to register medium- and long-term foreign debt with the Central Bank of the Republic of China (Taiwan).
In addition, foreign persons may, subject
to specified requirements but without foreign exchange approval of the Central Bank of the Republic of China (Taiwan), remit to
and from the ROC foreign currencies of up to US$100,000 (or its equivalent) per remittance if the required documentation is provided
to the ROC authorities. The above limit applies to remittances involving either a conversion of NT dollars into a foreign currency
or a conversion of foreign currency into NT dollars. The above limit does not, however, apply to the conversion of NT dollars into
other currencies, including U.S. dollars, from the proceeds of a sale of any underlying shares withdrawn from a depositary receipt
facility.
TAXATION
ROC Taxation
The following discussion describes the
material ROC tax consequences of the ownership and disposition of our common shares or ADSs to a non-resident individual or non-resident
entity that owns our common shares or ADSs (referred to here as a “non-ROC holder”). As used in the preceding sentence,
a “non-resident individual” is a non-ROC national who owns our common shares or ADSs and is not physically present
in the ROC for 183 days or more during any calendar year, and a “non-resident entity” is a corporation or a non-corporate
body that owns our common shares or ADSs, is organized under the laws of a jurisdiction other than the ROC and has no fixed place
of business or business agent in the ROC.
Dividends
Dividends (whether in cash or common shares)
declared by us out of retained earnings and distributed to a non-ROC holder are subject to ROC withholding tax, currently at the
rate of 20% (unless a preferable tax rate is provided under a tax treaty between the ROC and the jurisdiction where the non-ROC
holder is a resident) on the amount of the distribution (in the case of cash dividends) or on the par value of the distributed
common shares (in the case of stock dividends). A 10% undistributed earnings tax is imposed on a ROC company for its after-tax
earnings generated after January 1, 1998 which are not distributed in the following year. The undistributed earnings tax so paid
will further reduce the retained earnings available for future distribution. When we declare a dividend out of those retained earnings,
an amount in respect of the undistributed earnings tax, up to a maximum amount of 5% of the dividend to be distributed, will be
credited against the withholding tax imposed on the non-ROC holders.
Distributions of common shares or cash
out of capital reserves will not be subject to withholding tax, except under limited circumstances.
Capital Gains
Starting from January 1, 2016, capital
gains realized upon the sale or other disposition of common shares are exempt from ROC income tax.
Sales of ADSs are not regarded as sales
of ROC securities and thus any gains derived from transfers of ADSs by non-ROC holders are not currently subject to ROC income
tax.
Securities Transaction Tax
Securities transaction tax will be imposed
on the seller at the rate of 0.3% of the transaction price upon a sale of common shares. Transfers of ADSs are not subject to ROC
securities transaction tax.
Subscription Rights
Distributions of statutory subscription
rights for our common shares in compliance with the ROC Company Law are currently not subject to ROC tax. Sales of statutory subscription
rights evidenced by securities are subject to securities transaction tax, currently at the rate of 0.3% of the gross amount received.
Proceeds derived from sales of statutory subscription rights which are not evidenced by securities are not subject to securities
transaction tax but are subject to income tax at a fixed rate of 20% of the income if the seller is a non-ROC holder. Subject to
compliance with ROC law, we, in our sole discretion, may determine whether statutory subscription rights are evidenced by securities.
Estate and Gift Tax
ROC estate tax is payable on any property
within the ROC left by a deceased non-resident individual, and ROC gift tax is payable on any property within the ROC donated by
a non-resident individual. Estate tax and gift tax are currently imposed at the rate of 10%. Under the ROC Estate and Gift Tax
Act, common shares issued by ROC companies are deemed located in the ROC without regard to the location of the owner. It is unclear
whether a holder of ADSs will be considered to own common shares for this purpose.
Tax Treaty
At present, the ROC has income tax treaties
with Indonesia, Singapore, New Zealand, Australia, the United Kingdom, South Africa, Gambia, Swaziland, Malaysia, Macedonia, the
Netherlands, Senegal, Sweden, Belgium, Denmark, Israel, Vietnam, Paraguay, Hungary, France, India, Slovakia, Switzerland, Germany,
Thailand, Kiribati, Luxembourg, Austria and Italy. These tax treaties may limit the rate of ROC withholding tax on dividends paid
with respect to common shares issued by ROC companies. A non-ROC holder of ADSs may or may not be considered as the beneficial
owner of common shares for the purposes of such treaties. Accordingly, holders of ADSs who wish to apply a reduced withholding
tax rate that is provided under a tax treaty should consult their own tax advisers concerning such application. The United States
does not have an income tax treaty with the ROC.
United States Federal Income Taxation
The following discussion describes the
material U.S. federal income tax consequences of the ownership and disposition of our common shares or ADSs to those U.S. Holders
described below who hold such common shares or ADSs as capital assets for U.S. federal income tax purposes. As used herein, a “U.S.
Holder” is a beneficial owner of our common shares or ADSs that is for U.S. federal income tax purposes:
|
·
|
a citizen or individual resident of the United States;
|
|
·
|
a corporation, or other entity taxable as a corporation, created or organized under the laws of the United States or of any
political subdivision of the United States; or
|
|
·
|
an estate or trust the income of which is subject to U.S. federal income taxation regardless of its source.
|
This discussion assumes that we are not
a passive foreign investment company, as discussed below.
This discussion does not address all of
the tax consequences that may be relevant in light of a U.S. Holder’s particular circumstances. In particular, it does not
address all of the tax consequences that may be relevant to holders subject to special rules, including:
|
·
|
persons subject to the alternative minimum tax;
|
|
·
|
persons subject to taxation under the provisions of the Internal Revenue Code of 1986, as amended (the “Code”),
known as the Medicare contribution tax;
|
|
·
|
tax-exempt entities, including “individual retirement accounts” or “Roth IRAs”;
|
|
·
|
dealers or traders in securities who use a mark-to-market method of accounting for U.S. federal income tax purposes;
|
|
·
|
certain financial institutions;
|
|
·
|
partnerships or other entities classified as partnerships for U.S. federal income tax purposes;
|
|
·
|
persons holding common shares or ADSs in connection with a trade or business conducted outside of the U.S.;
|
|
·
|
persons who hold or will hold common shares or ADSs as part of a straddle, hedge, conversion transaction, integrated transaction
or similar transaction;
|
|
·
|
persons whose functional currency for U.S. federal income tax purposes is not the U.S. dollar;
|
|
·
|
persons who own or are deemed to own 10% or more of our voting stock; or
|
|
·
|
persons who acquired our common shares or ADSs pursuant to the exercise of any employee stock option or otherwise as compensation.
|
If an entity that is classified as a partnership
for U.S. federal income tax purposes holds our common shares or ADSs, the U.S. federal income tax treatment of a partner will generally
depend on the status of the partner and the activities of the partnership. Partnerships holding our common shares or ADSs and partners
in such partnerships should consult their tax advisers as to the particular U.S. federal income tax consequences of holding and
disposing of our common shares or ADSs.
This discussion is based on the Code, final,
temporary and proposed Treasury regulations, administrative pronouncements and judicial decisions, all as of the date hereof. These
laws and regulations are subject to change, possibly with retroactive effect. This discussion is also based in part on representations
by the depositary and assumes that each obligation under the deposit
agreement and any related agreement will be performed in accordance with its terms.
In general, for U.S. federal income tax
purposes, a U.S. Holder who owns ADSs should be treated as the owner of the common shares represented by the ADSs. Accordingly,
no gain or loss should be recognized if a U.S. holder exchanges ADSs for the common shares represented by those ADSs.
The U.S. Treasury has expressed concerns
that parties to whom American depositary shares are released before delivery of shares to the depositary (“pre-release”),
or intermediaries in the chain of ownership between holders and the issuer of the security underlying the American depositary shares,
may be taking actions that are inconsistent with the claiming of foreign tax credits by the holders of American depositary shares.
Such actions would also be inconsistent with the claiming of the preferential rates of tax applicable to dividends received by
certain non-corporate U.S. holders. Accordingly, the creditability of ROC taxes and the availability of the preferential tax rates
for dividends received by certain non-corporate U.S. Holders, both described below, could be affected by actions that may be taken
by such parties or intermediaries.
U.S. Holders should consult their tax advisers
with regard to the application of the U.S. federal income tax laws to their common shares or ADSs as well as any tax consequences
arising under the laws of any state, local or non-U.S. taxing jurisdiction.
Dividends
Distributions paid on our common shares
or ADSs (other than certain
pro rata
distributions of our common shares to all shareholders, including holders of ADSs),
including the amount of any ROC taxes withheld thereon, reduced by any credit against the withholding tax on account of the 10%
retained earnings tax imposed on us, generally will constitute foreign-source dividend income to the extent paid out of our current
or accumulated earnings and profits as determined in accordance with U.S. federal income tax principles. Because we do not maintain
calculations of our earnings and profits under U.S. federal income tax principles, we expect that distributions generally will
be reported to U.S. Holders as dividends. The amount a U.S. Holder will be required to include in income for any dividend paid
in NT dollars will be equal to the U.S. dollar value of the NT dollars paid, calculated by reference to the exchange rate in effect
on the date the payment is received by the depositary (in the case of ADSs) or by a U.S. Holder (in the case of common shares),
regardless of whether the payment is in fact converted into U.S. dollars on the date of receipt. If a U.S. Holder does not convert
the NT dollars so received into U.S. dollars on the date of receipt, any gain or loss recognized on a subsequent sale or other
disposition of the NT dollars generally will be U.S.-source ordinary income or loss. The amount of any taxable distribution of
property other than cash will be the fair market value of such property on the date of distribution. Dividends will not be eligible
for the dividends-received deduction generally available to U.S. corporations under the Code.
Subject to applicable limitations and the
discussion above regarding concerns expressed by the U.S. Treasury, under current law, certain dividends paid by qualified foreign
corporations to certain non-corporate U.S. Holders are taxable at the preferential rates applicable to long-term capital gain.
A foreign corporation is treated as a qualified foreign corporation with respect to dividends paid by that corporation on shares
(or ADSs representing such shares) that are readily tradable on a securities market in the United States, such as the New York
Stock Exchange, where our ADSs are traded. U.S. Holders should consult their tax advisers to determine whether these preferential
rates may apply to dividends they receive and whether they are subject to any special rules that limit their ability to be taxed
at these preferential rates.
Subject to applicable limitations and restrictions,
some of which vary depending upon the U.S. Holder’s circumstances, and the discussion above regarding concerns expressed
by the U.S. Treasury, the ROC taxes withheld from dividend distributions, reduced by any credit against the withholding tax which
is paid by us on account of the 10% retained earnings tax, will be eligible for credit against the U.S. Holder’s U.S. federal
income tax liability. The limitation on foreign taxes eligible for credit is calculated separately with respect to specific classes
of income. The rules governing foreign tax credits are complex and, therefore, U.S. Holders should consult their tax advisers regarding
the availability of foreign tax credits in their particular circumstances. Instead of claiming a credit, U.S. Holders may, at their
election, deduct otherwise creditable ROC taxes in computing their taxable income, subject to generally applicable limitations
under U.S. law. An election to deduct foreign taxes instead of claiming foreign tax credits applies to all taxes paid or accrued
in the taxable year to foreign countries and possessions of the United States.
Certain
pro rata
distributions of
common shares by a company to its shareholders, including holders of ADSs, will not be subject to U.S. federal income tax. Accordingly,
these distributions will not give rise to U.S. federal income against which the ROC tax imposed on these distributions may be credited.
U.S. Holders should consult their tax advisers as to whether any ROC tax imposed on such distributions may be creditable against
their U.S. federal income tax on foreign-source income from other sources.
Capital Gains
A U.S. Holder generally will recognize
U.S.-source capital gain or loss for U.S. federal income tax purposes on the sale or exchange of our common shares or ADSs, which
will be long-term capital gain or loss if our common shares or ADSs were held by the U.S. Holder for more than one year. The amount
of gain or loss will be equal to the difference between the U.S. Holder’s tax basis in our common shares or ADSs disposed
of and the amount realized on disposition, in each case as determined in U.S. dollars. A U.S. Holder’s basis in our common
shares or ADSs will generally equal the U.S. Holder’s cost of such common shares or ADSs. If a U.S. Holder receives our common
shares or ADSs in a non-taxable
pro rata
distribution with respect to its ADSs or common shares (the “new securities”),
the basis of such new securities must be determined by allocating the basis of the common shares or ADSs with respect to which
the new securities were issued (the “old securities”) between the old securities and new securities in proportion to
their fair market values on the date of distribution. U.S. Holders should consult their tax advisers about the treatment of capital
gains, which may be taxed at lower rates than ordinary income for non-corporate taxpayers, and capital losses, the deductibility
of which may be limited.
Passive Foreign Investment Company Rules
We believe that we were not a passive foreign
investment company, or PFIC, for U.S. federal income tax purposes for our 2015 taxable year. However, since PFIC status depends
upon the composition of a company’s income and assets and the market value of its assets (including, among others, less than
25 percent owned equity investments) from time to time, there can be no assurance that we will not be considered a PFIC for any
taxable year.
If we were treated as a PFIC for any taxable
year during which a U.S. Holder held a common share or an ADS, certain adverse consequences could apply to that U.S. Holder. If
we are a PFIC for any taxable year during which a U.S. Holder owned a common share or an ADS, such U.S. Holder will generally be
required to file Internal Revenue Service Form 8621 with their annual U.S. federal income tax returns, subject to certain exceptions.
Information Reporting and Backup Withholding
Payments of dividends and sales proceeds
that are made within the United States or through certain U.S.-related financial intermediaries generally are subject to information
reporting, and may be subject to backup withholding, unless (i) the U.S. Holder is an exempt recipient or (ii) in the case of backup
withholding, the U.S. Holder provides a correct taxpayer identification number and certifies that it is not subject to backup withholding.
The amount of any backup withholding from
a payment to a U.S. Holder will be allowed as a credit against the U.S. Holder’s U.S. federal income tax liability and may
entitle it to a refund, provided that the required information is timely furnished to the Internal Revenue Service.
DIVIDENDS AND PAYING AGENTS
Not applicable.
STATEMENT BY EXPERTS
Not applicable.
DOCUMENTS ON DISPLAY
We file annual reports on Form 20-F and
periodic reports on Form 6-K with the SEC. You can read and copy these reports and other information at the SEC’s Public
Reference Room at 450 Fifth Street, N.W., Washington, D.C. 20549. You can also request copies of the documents, upon payment of
a duplicating fee, by writing to the Public Reference Section of the SEC. Please call the SEC at 1-800-SEC-0330 for further information
on the operation of the Public Reference Room. The
reports and other information we file electronically with the SEC are also available to the public from the SEC’s website
at
http://www.sec.gov.
SUBSIDIARY INFORMATION
Not applicable.
Item 11. Quantitative and Qualitative Disclosures about
Market Risk
Market Risk
Our exposure to financial market risks
relates primarily to changes in interest rates and foreign currency exchange rates.
Interest Rate Risk.
Our exposure
to interest rate risks relates primarily to our long-term floating rate loans, which is normally incurred to support our corporate
activities and capital expenditures. See note 31 to our consolidated financial statements included in this annual report for details
on interest rate sensitivity analysis.
We entered into several interest rate swap
contracts to mitigate the interest rate risk on our long-term loans. In April 2013, J&R Holding Limited entered into an interest
rate swap contract in the amount of RMB240.0 million, which matured in April 2014, with interest receipt based on a floating rate
of 1.05% to 2.80% and payment based on a fixed rate of 2.0%. In February 2014, J&R Holding Limited entered into another interest
rate swap contract in the amount of RMB240.0 million, which had the maturity schedule in February 2015 but was early settled in
May 2014, with interest receipt based on a floating rate of 1.20% to 1.40% and payment based on a fixed rate of 1.35%. We recognized
these contracts as hedging derivative liabilities-current with an adjustment to shareholders’ equity.
In October 2015, we entered into an interest
rate swap contract in the amount of NT$1,000.0 million (US$30.5 million), which will mature in October 2016, with interest receipt
based on a floating rate of 0.00% to 5.00% and payment based on a fixed rate of 4.60%. See note 7 to our consolidated financial
statements included in this annual report for details of the contract. The fair value of the contract as of December 31, 2015 was
negative NT$0.1 million (US$0.003 million) and we recognized it as financial liabilities held for trading with an adjustment to
profit or loss.
The tables below set forth information
relating to our significant obligations, including short-term borrowings and long-term borrowings, including bank loans, bills
payable, capital lease obligations and bonds payable, that are sensitive to interest rate fluctuations as of December 31, 2015.
|
|
Expected Maturity Date
|
|
|
2016
|
|
2017
|
|
2018
|
|
2019
|
|
2020
|
|
Thereafter
|
|
Total
|
|
Fair Value
|
|
|
(in millions, except percentages)
|
Short-term borrowings:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Variable rate (NT$)
|
|
|
100.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
100.0
|
|
|
|
100.0
|
|
Average interest rate
|
|
|
0.99%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
0.99%
|
|
|
|
|
|
Fixed rate (NT$)
|
|
|
11,780.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
11,780.0
|
|
|
|
11,780.0
|
|
Average interest rate
|
|
|
0.79%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
0.79%
|
|
|
|
|
|
Variable rate (US$)
|
|
|
125.1
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
125.1
|
|
|
|
125.1
|
|
Average interest rate
|
|
|
1.25%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
1.25%
|
|
|
|
|
|
Fixed rate (US$)
|
|
|
163.4
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
163.4
|
|
|
|
163.4
|
|
Average interest rate
|
|
|
1.10%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
1.10%
|
|
|
|
|
|
Variable rate (RMB)
|
|
|
2,688.3
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
2,688.3
|
|
|
|
2,688.3
|
|
Average interest rate
|
|
|
3.79%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
3.79%
|
|
|
|
|
|
Fixed rate (RMB)
|
|
|
5.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
5.0
|
|
|
|
5.0
|
|
Average interest rate
|
|
|
5.08%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
5.08%
|
|
|
|
|
|
Fixed rate (EUR)
|
|
|
56.3
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
56.3
|
|
|
|
56.3
|
|
Average interest rate
|
|
|
0.71%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
0.71%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Long-term borrowings:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Variable rate (NT$)
|
|
|
683.3
|
|
|
|
11,642.2
|
|
|
|
4,211.1
|
|
|
|
833.4
|
|
|
|
–
|
|
|
|
–
|
|
|
|
17,370.0
|
|
|
|
17,370.0
|
|
Average interest rate
|
|
|
1.13%
|
|
|
|
0.89%
|
|
|
|
1.08%
|
|
|
|
1.16%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
0.96%
|
|
|
|
|
|
Fixed rate (NT$)
|
|
|
8,000.0
|
|
|
|
–
|
|
|
|
1,500.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
9,500.0
|
|
|
|
9,500.0
|
|
Average interest rate
|
|
|
1.45%
|
|
|
|
–
|
|
|
|
1.17%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
1.41%
|
|
|
|
|
|
Variable rate (US$)
|
|
|
104.3
|
|
|
|
369.6
|
|
|
|
210.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
683.9
|
|
|
|
683.9
|
|
Average interest rate
|
|
|
1.96%
|
|
|
|
1.91%
|
|
|
|
2.07%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
1.96%
|
|
|
|
|
|
Fixed rate (US$)
|
|
|
0.0
|
|
|
|
300.1
|
|
|
|
0.1
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
300.2
|
|
|
|
300.2
|
|
Average interest rate
|
|
|
5.72%
|
|
|
|
2.13%
|
|
|
|
5.71%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
2.13%
|
|
|
|
|
|
Variable rate (RMB)
|
|
|
11.3
|
|
|
|
23.7
|
|
|
|
88.0
|
|
|
|
187.0
|
|
|
|
198.0
|
|
|
|
135.2
|
|
|
|
643.2
|
|
|
|
643.2
|
|
Average interest rate
|
|
|
4.64%
|
|
|
|
6.34%
|
|
|
|
9.20%
|
|
|
|
6.52%
|
|
|
|
7.63%
|
|
|
|
7.46%
|
|
|
|
7.39%
|
|
|
|
|
|
Fixed rate (RMB)
|
|
|
500.5
|
|
|
|
0.0
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
500.5
|
|
|
|
500.5
|
|
Average interest rate
|
|
|
4.25%
|
|
|
|
2.29%
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
–
|
|
|
|
4.25%
|
|
|
|
|
|
Foreign Currency Exchange Rate Risk.
Our foreign currency exposure gives rise to market risk associated with exchange rate movements against the NT dollar, our functional
currency. Currently, the majority of our revenues are denominated in U.S. dollars, with a portion denominated in NT dollars and
Japanese yen. Our costs of revenues and operating expenses are incurred in several currencies, primarily in NT dollars, U.S. dollars,
RMB, Japanese yen, Korean won, as well as, to a lesser extent, Singapore dollars and Malaysian ringgit. In addition, a substantial
portion of our capital expenditures, primarily for the purchase of packaging and testing equipment, has been, and is expected to
continue to be, denominated primarily in U.S. dollars with the remainder in Japanese yen. The majority of our borrowings are denominated
in NT dollars, U.S. dollars and RMB. Fluctuations in exchange rates, primarily among the U.S. dollar against the NT dollar, RMB
and the Japanese yen, will affect our costs and operating margins and could result in exchange losses and increased costs in NT
dollar and other local currency terms. See note 31 to our consolidated financial statements included in this annual report for
details on foreign currency exchange rate sensitivity analysis.
Despite hedging and mitigating techniques
implemented by us, fluctuations in exchange rates have affected, and may continue to affect, our financial condition and results
of operations. We recorded net foreign exchange losses of NT$276.2 million, NT$1,222.0 million and NT$713.2 million (US$21.8 million)
in 2013, 2014 and 2015, respectively. In 2013, 2014 and 2015, the average exchange rate of the NT dollar to the U.S. dollar was
29.73, 30.38 and 31.80, respectively, calculated based on the statistical release by the Federal Reserve Board. To protect against
reductions in value and the volatility of future cash flows caused by changes in foreign currency exchange rates, we utilize currency
forward contracts and swap contracts from time to time to reduce the impact of foreign currency fluctuations on our results of
operations. Our policy is to account for these contracts on a mark-to-market rate basis.
The table below sets forth our outstanding
forward exchange contracts and swap contracts, for which the expected maturity dates are in 2016, in aggregate terms by type of
contract as of December 31, 2015.
Forward Exchange Contracts and Swap Contracts
|
|
Forward Exchange Contracts
|
|
Swap Contracts
|
|
|
|
|
|
Buy US$ against NT$
|
|
|
|
|
Notional Amount
|
|
US$10.0 million
|
|
US$1,802.8 million
|
Weighted Average Strike Price
|
|
US$/NT$ 32.540
|
|
US$/NT$ 31.924
|
Fair Value
|
|
US$0.150 million
|
|
US$42.626 million
|
|
|
|
|
|
Sell US$ against NT$
|
|
|
|
|
Notional Amount
|
|
US$155.0 million
|
|
US$91.8 million
|
Weighted Average Strike Price
|
|
US$/NT$ 32.827
|
|
US$/NT$ 32.757
|
Fair Value
|
|
Negative US$0.673 million
|
|
Negative US$0.176 million
|
|
|
|
|
|
Sell US$ against RMB
|
|
|
|
|
Notional Amount
|
|
US$121.0 million
|
|
US$353.9 million
|
Weighted Average Strike Price
|
|
US$/RMB 6.448
|
|
US$/RMB 6.375
|
Fair Value
|
|
Negative US$1.179 million
|
|
Negative US$8.456 million
|
|
|
|
|
|
Sell US$ against JP¥
|
|
|
|
|
Notional Amount
|
|
US$14.0 million
|
|
US$67.1 million
|
Weighted Average Strike Price
|
|
US$/JP¥ 122.385
|
|
US$/JP¥ 122.756
|
Fair Value
|
|
US$0.236 million
|
|
US$1.458 million
|
|
|
|
|
|
Sell US$ against MYR
|
|
|
|
|
Notional Amount
|
|
US$6.0 million
|
|
–
|
Weighted Average Strike Price
|
|
US$/MYR 4.254
|
|
–
|
Fair Value
|
|
Negative US$0.066 million
|
|
–
|
|
|
|
|
|
Sell US$ against SGD
|
|
|
|
|
Notional Amount
|
|
US$11.4 million
|
|
–
|
Weighted Average Strike Price
|
|
US$/SGD 1.410
|
|
–
|
Fair Value
|
|
Negative US$0.035 million
|
|
–
|
|
|
|
|
|
Sell US$ against KRW
|
|
|
|
–
|
Notional Amount
|
|
US$8.0 million
|
|
–
|
Weighted Average Strike Price
|
|
US$/KRW 1,177.544
|
|
–
|
Fair Value
|
|
US$0.033 million
|
|
–
|
Other Market Risk.
Our exposure
to other market risk relates primarily to our investments in publicly-traded stock, private-placement bonds, open-end mutual funds
and limited partnership interests. The value of these investments may fluctuate based on various factors including prevailing market
conditions. Moreover, the fair value of investments in unlisted securities may be significantly different from their carrying value.
As of December 31, 2015, our investments in publicly traded stock, open-end mutual funds and private-placement bonds classified
as financial assets at fair value through profit or loss were NT$710.8 million (US$21.7 million). As of December 31, 2015, our
investments classified as available-for-sale financial assets were NT$954.7 million (US$29.1 million), primarily consisting of
publicly-traded stock, open-end mutual funds and limited partnership interests.
If the fair values of these investments
fluctuate by 1.0%, our profit before income tax will increase or decrease by approximately NT$7.1 million (US$0.2 million) for
the same period, and our other comprehensive before income tax will increase or decrease by approximately NT$10.0 million (US$0.3
million) for the same period. In addition, we are also exposed to our share price risk through conversion option, redemption option
and put option of convertible bonds recognized as financial liabilities held for trading. If our share price increases or decreases
by 7.0%, our profit before income tax for the year ended December 31, 2015 will decrease by NT$605.0 million (US$18.5 million)
or increase by NT$638.0 million (US19.5 million), respectively. Furthermore, fluctuations in gold prices may also affect the price
at which we have been able to purchase gold wire. How this will impact the results of our operations depends on whether such costs
can be transferred onto our customers.
Item 12. Description of Securities Other Than Equity Securities
DEBT SECURITIES
Not applicable.
WARRANTS AND RIGHTS
Not applicable.
OTHER SECURITIES
Not applicable.
AMERICAN DEPOSITARY SHARES
Depositary Fees and Charges
Under the terms of the amended and restated
deposit agreement dated September 29, 2000 among Citibank, N.A., as depositary, holders and beneficial owners of ADSs and us, which
was filed as an exhibit to our registration statement on Form F-6 on September 16, 2003, and its two amendments, which were filed
as an exhibit to our registration statement on post-effective amendment No. 1 to Form F-6 on April 3, 2006 and our registration
statement on post-effective amendment No. 2 to Form F-6 on October 25, 2006, respectively, for our ADSs, an ADS holder may have
to pay the following service fees to the depositary bank:
Service
|
Fees
|
Issuance of ADSs
|
Up to US$5.00 per 100 ADSs (or fraction thereof) issued
|
Delivery of deposited securities against surrender of ADSs
|
Up to US$5.00 per 100 ADSs (or fraction thereof) surrendered
|
Distribution of cash dividends or other cash distributions
|
Up to US$5.00 per 100 ADSs (or fraction thereof) held, unless prohibited by the exchange upon which the ADSs are listed
|
Distribution of ADSs pursuant to (i) stock dividends or other free stock distributions, or (ii) exercises of rights to purchase additional ADSs
|
Up to US$5.00 per 100 ADSs (or fraction thereof) held, unless prohibited by the exchange upon which the ADSs are listed
|
Distribution of securities other than ADSs or rights to purchase additional ADSs
|
Up to US$5.00 per 100 ADSs (or fraction thereof) held
|
Depositary Services
|
Up to US$5.00 per 100 ADSs (or fraction thereof) held, unless prohibited by the exchange upon which the ADSs are listed
|
Transfer of ADRs
|
US$1.50 per certificate presented for transfer
|
An ADS holder will also be responsible
to pay certain fees and expenses incurred by the depositary bank and certain taxes and governmental charges such as:
|
·
|
taxes (including applicable interest and penalties) and other governmental charges;
|
|
·
|
such registration fees as may from time to time be in effect for the registration of shares or other deposited securities on
the share register and applicable to transfers of shares or other deposited securities to or from the name of the custodian, the
depositary or any nominees upon the making of deposits and withdrawals, respectively;
|
|
·
|
such cable, telex and facsimile transmission and delivery expenses as are expressly provided in the Deposit Agreement to be
at the expense of the person depositing or withdrawing shares or holders and beneficial owners of ADSs;
|
|
·
|
the expenses and charges incurred by the depositary in the conversion of foreign currency;
|
|
·
|
such fees and expenses as are incurred by the depositary in connection with compliance with exchange control regulations and
other regulatory requirements applicable to shares, deposited securities, ADSs and ADRs; and
|
|
·
|
the fees and expenses incurred by the depositary, the custodian or any nominee in connection with the servicing or delivery
of deposited securities.
|
Depositary fees payable upon the issuance
and cancellation of ADSs are typically paid to the depositary bank by the brokers (on behalf of their clients) receiving the newly-issued
ADSs from the depositary bank and by the brokers (on behalf of their clients) delivering the ADSs to the depositary bank for cancellation.
The brokers in turn charge these transaction fees to their clients.
Depositary fees payable in connection with
distributions of cash or securities to ADS holders and the depositary services fee are charged by the depositary bank to the holders
of record of ADSs as of the applicable ADS record date. Depositary fees payable for cash distributions are generally deducted from
the cash being distributed. In case of distributions other than cash (
i.e.
, stock dividends, rights offerings), the depositary
bank charges the applicable fee to the ADS record date holders concurrent with the distribution. In the case of ADSs registered
in the name of the investor (whether certificated or un-certificated in direct registration), the depositary bank sends invoices
to the applicable record date ADS holders. In case of ADSs held in brokerage and custodian accounts via the central clearing and
settlement system, The Depository Trust Company (DTC), the depositary bank generally collects its fees through the systems provided
by DTC (whose nominee is the registered holder of the ADSs held in DTC) from the brokers and custodians holding ADSs in their DTC
accounts. The brokers and custodians who hold their clients’ ADSs in DTC accounts in turn charge their clients’ accounts
the amount of the fees paid to the depositary banks.
In the event of refusal to pay depositary
fees, the depositary bank may, under the terms of the Deposit Agreement, refuse the requested service until payment is received
or may set-off the amount of the depositary fees from any distribution to be made to the ADS holder. Note that the fees and charges
you may be required to pay may vary over time and may be changed by us and by the depositary bank. You will receive prior notice
of such changes.
Depositary Payments
In 2015, we received US$103,528.8 from
Citibank, N.A., the depositary bank for our ADR programs. The table below sets forth details of the amount we received from Citibank,
N.A.
Depositary Payments
|
|
|
Reimbursement of proxy process expenses
|
|
US$
|
43,199.1
|
|
Reimbursement of ADR holders identification expenses
|
|
US$
|
745.8
|
|
Reimbursement of legal fees
|
|
US$
|
59,583.9
|
|
Direct reimbursement
|
|
US$
|
0.0
|
|
Net payment received by us
(1)
|
|
US$
|
103,528.8
|
|
_____
_____________
|
(1)
|
Net of U.S. withholding tax.
|