Advanced Semiconductors Stock Price - ASX

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Last Trade
Last: $ 5.32 ◊ 0.00 (0.00%)
Company Name Stock Ticker Symbol Market Type ISIN
Advanced Semiconductor Engineering, Inc. ASX NYSE Ordinary Share US00756M4042
  Price Change Change Percent Stock Price High Price Low Price Open Price Close Price Last Traded DELAYED
  -0.06 -1.12% 5.32 5.36 5.32 5.35 5.38 15:59:57
Stock Trades Traded Volume VWAP Dollar Volume Average Volume 52 Week Range
2,300.00 486,888.00 $ 5.34 $ 2.6M 519.38k 4.40 - 6.23
Last Trade Time Type Quantity Stock Price Currency
16:35:44 formt 500.00 $5.32 USD

Advanced Semiconductor Engineering, Inc. Financials

Market Cap Shares in Issue Profit/Loss Earnings Per Share (EPS) PE Ratio Float
$ 8.16B 1.53B $ 20.01B 13.10 - -
Short Interest Dividends Per Share Dividend Yield Ex-Div Date Insider B/S Insider % Owned
1.51M $ 0.25 4.70% 08/15/2016 - 7.50%

more financials information »

Advanced Semiconductor Engineering, Inc. News

Date Time Source News Article
12/08/201607:19Edgar (US Regulatory)Report of Foreign Issuer (6-k)
12/08/201607:16Edgar (US Regulatory)Report of Foreign Issuer (6-k)
12/07/201606:03Edgar (US Regulatory)Report of Foreign Issuer (6-k)
12/07/201602:00PR Newswire (US)Advanced Semiconductor Engineering, Inc. Announces Monthly..
11/22/201607:04Edgar (US Regulatory)Securities Registration (ads, Delayed) (f-6)
11/22/201606:49Edgar (US Regulatory)Securities Registration (foreign Private Issuer) (f-4)
11/22/201606:35Edgar (US Regulatory)Report of Foreign Issuer (6-k)

Historical ASX Price Data

Period † Open High Low VWAP Min Vol Max Vol Avg. Daily Vol [m] Change %
1 Week5.295.445.265.3671314k785k522k0.030.57%
1 Month5.385.485.115.3365281k792k486k-0.06-1.12%
3 Months5.776.135.115.7431177k1M510k-0.45-7.80%
6 Months5.616.235.115.7285177k2M620k-0.29-5.17%
1 Year5.346.234.3955.505906M877k-0.02-0.37%
3 Years4.718.124.3955.918706M997k0.6112.95%
5 Years3.7105268.120.00015.279806M924k1.6143.38%

Advanced Semiconductor Engineering, Inc. Description

Advanced Semiconductor Engineering, Inc. is an provider of semiconductor packaging and testing services. Its services include semiconductor packaging, production of interconnect materials, front-end engineering testing & wafer probing.
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