ams invests over €25m to create dedicated in-house production capacity for analog 3D ICs
September 03 2013 - 3:46AM
Business Wire
ams AG (SIX:AMS), a leading provider of high performance analog
ICs and sensor solutions, today announced that it has invested over
€25m to create dedicated 3D IC production capacity at its wafer
fabrication plant near Graz, Austria.
The investment provides for the installation of new 3D IC
equipment in clean room space available at the plant, situated at
the company’s headquarters.
The additional production capacity comes in response to a surge
in demand outlook for ICs fabricated with 3D IC integration
technology developed exclusively by ams. The patented technology
enables the design and production of radically improved IC packages
that are smaller and offer better device performance than existing
packages.
For instance, the TSV (Through-Silicon Via) interconnects in 3D
ICs from ams can replace the bond wires in conventional single-die
devices. For optical semiconductors, clear packaging requirements
are eliminated to enable production of chipscale packages that are
smaller, cheaper, and less vulnerable to EMI (electro-magnetic
interference).
The ams 3D IC process also enables the production of stacked-die
devices. Two die produced in different processes (such as a
photodiode die and a silicon signal-processing die) are bonded
back-to-back to produce a monolithic stacked-die device. This can
replace two separate packages, has a far smaller footprint, and
features much shorter interconnects, resulting in improved
performance and reduced electrical noise.
The new equipment line, which will be fully operational by the
end of 2013, will be available for production of 3D ICs for any ams
product or full-service foundry customer. Initially the line will
produce devices for customers in the medical imaging and mobile
phone markets.
Kirk Laney, CEO of ams, commented: “The new 3D IC production
line is a substantial investment for a company the size of ams, and
it demonstrates once again our commitment to the development and
deployment of advanced analog semiconductor fabrication technology.
Our customers highly value our ability to implement innovative
fabrication techniques, and to offer production capacity with the
ultra-high quality that they require.”
Download Press Picture or Block Diagram of this IC at
http://www.ams.com/eng/Press/Press-Releases/RFID-Sensor-Tags
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