Rambus Signs Patent License Agreement With Winbond
January 16 2017 - 4:30PM
Business Wire
Broad agreement addresses device and cloud
demands for high bandwidth, low latency, efficient memory
solutions
Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad
five-year patent license agreement with Winbond Electronics
Corporation, a worldwide leading supplier of specialty memory. This
agreement covers the use of Rambus patented memory solutions,
including server DIMM chipsets, for Winbond products through
2021.
“In today’s data intensive applications, computing memory
solutions must be more efficient, deliver higher levels of
bandwidth and lower latency to solutions to meet the demands of the
market,” said Luc Seraphin, general manager of the Interface
Division at Rambus. “This collaborative partnership with Winbond
provides critical memory and interface technologies that address
the needs and requirements to run effective data centers.”
Rambus develops high-performance, low-power memory and SerDes
interface chips and IP cores to meet the needs of increasingly
diverse enterprise and mobile applications. Rambus also drives
innovations in silicon-to-cloud security, making digital products
safer and better.
For additional information on Rambus products and solutions,
please visit rambus.com.
Follow Rambus:
Company
website: rambus.comRambus blog: rambusblog.comTwitter: @rambusincLinkedIn: www.linkedin.com/company/rambusFacebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus creates innovative hardware and software technologies,
driving advancements from the data center to the mobile edge. Our
chips, customizable IP cores, architecture licenses, tools,
software, services, training and innovations improve the
competitive advantage of our customers. We collaborate with the
industry, partnering with leading ASIC and SoC designers,
foundries, IP developers, EDA companies and validation labs. Our
products are integrated into tens of billions of devices and
systems, powering and securing diverse applications, including Big
Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more
information, visit rambus.com.
About Winbond Electronics Corp.
Winbond Electronics Corporation is a leading global supplier of
semiconductor memory solutions, headquartered in Taichung, Taiwan.
Winbond’s major products include Specialty DRAM, Mobile DRAM, and
Code Storage Flash Memory with Winbond’s memory business revenues
in 2015 close to US$1 billion. Winbond has approximately 2,700
employees worldwide, with offices in Taiwan, Hong Kong, China,
Japan, Israel, and the USA. For more information, please
visit winbond.com.
View source
version on businesswire.com: http://www.businesswire.com/news/home/20170116005017/en/
RambusAgnes Toan, 408-462-8905Senior Manager, Corporate
Communicationsatoan@rambus.com
Rambus (NASDAQ:RMBS)
Historical Stock Chart
From Mar 2024 to Apr 2024
Rambus (NASDAQ:RMBS)
Historical Stock Chart
From Apr 2023 to Apr 2024