BEVERLY, Mass., March 10, 2015 /PRNewswire/ -- Axcelis
Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling
ion implantation solutions for the semiconductor industry,
announced that it has received an order for multiple 200mm Purion
XE™ single wafer, high energy implanters. The systems will support
capacity expansions at logic fabs in Europe and the Asia Pacific Region, and will
be used in high volume production of Bipolar-CMOS-DMOS (BCD)
devices for the automotive market. The systems are scheduled
to ship in the third quarter.
John Aldeborgh, executive vice
president, customer operations, said, "We're pleased to support
this chipmaker as it makes the transition from multi wafer to
single wafer technology to increase capacity to support the growing
demand for BCD devices. The Purion was chosen because of its
ability to provide dramatically higher productivity and reliability
in high volume production. It will be a strong complement to this
customer's manufacturing process, providing the most flexible and
efficient high energy implant capability available." He continued,
"The BCD market is a great example of the relentless innovation
that is the hallmark of the semiconductor industry. It integrates
three distinct technologies on a single die, including analog,
digital and power, to significantly reduce costs and optimize
capital efficiency."
The Purion Platform
The Purion platform redefines the ion implanter application
space, delivering unmatched purity, precision and productivity to
enhance customers' device performance and yield. On
this platform, we've built the industry's first complete implant
product solution designed specifically for advanced planar and 3D
devices while providing the most flexible and productive
manufacturing capability for your fab. The systems' common
cross-product platform architecture is designed to drive
manufacturing flexibility and lower the total cost of fab
operations. All Purion implanters incorporate Axcelis' industry
leading Purion Contamination Shield™ Defense System, for
unsurpassed implant quality, so even the most sensitive devices can
realize optimized device performance. The platform's
proprietary Purion Vector™ dose and angle control system, and
constant focal length scanning deliver the most precise and
repeatable dopant placement available today. The
platform's superior beam current performance combined with the
Purion™ 500wph end station provides the industry's highest
productivity. The Purion platform includes the Purion M™ medium
current implanter, the Purion H™ high current implanter, and the
Purion XE™ high energy implanter.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative,
high-productivity solutions for the semiconductor industry for over
35 years. Axcelis is dedicated to developing enabling process
applications through the design, manufacture and complete life
cycle support of ion implantation systems, one of the most critical
and enabling steps in the IC manufacturing process. Learn more
about Axcelis at www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media)
978.787.4266
Doug Lawson (investor relations)
978.787.9552
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SOURCE Axcelis Technologies, Inc.