Rogers Corporation to Present & Exhibit Advanced Connectivity Solutions at IMS
May 28 2019 - 2:35PM
Rogers Corporation (NYSE:ROG) today announced Technical Marketing
Manager, John Coonrod, will present Critical Material Properties
for 5G PCB Applications from 2:30 – 2:45 p.m. on Tue., June 4 and
The Impact of Glass Weave Effects on mmwave PCBs from 2 – 2:15 p.m.
on Thu., June 6 in the MicroApps Theater at the International
Microwave Symposium (IMS) in Boston.
In addition, Rogers will be showcasing its latest 5G and
autonomous vehicle materials and other new products in Booth #448
during IMS, the world’s largest RF and Microwave show, which takes
place from Sun., June 2 – Fri., June 7. These products include the
recently launched RO4835T laminates, RO4450T bonding
materials, CU4000 and CU4000 LoPro foils, as well as
RO3003G2, the next generation high-frequency laminates for
automotive radar sensor applications.
RO4835T laminates, offered in 2.5 mil, 3 mil and 4 mil core
thicknesses, are 3.3 dielectric constant (Dk), low loss,
spread-glass reinforced, ceramic-filled thermoset materials
designed for inner-layer use in multilayer board designs, and
complement RO4835 laminates when thinner cores are
needed. RO4450T bonding materials are 3.2-3.3 Dk, low loss,
spread-glass reinforced and ceramic-filled, and were designed to
complement the RO4835T and the existing RO4000 laminate
family; they are available in 3 mil, 4 mil and 5 mil thicknesses.
CU4000 and CU4000 LoPro foils are sheeted foil options for
designers looking for foil lamination builds and provide good
outer-layer adhesion when used with RO4000 products.
RO4835T laminates and RO4450T bonding materials exhibit
excellent Dk control for repeatable electrical performance, a low z
axis expansion for plated through-hole reliability and are
compatible with standard epoxy/glass (FR-4) processes. These
materials are an excellent choice for multilayer designs requiring
sequential laminations, as fully-cured RO4000 products are capable
of withstanding multiple lamination cycles. RO4835T laminate and
RO4450T bond-ply have the UL 94 V-0 flame retardant rating and are
compatible with lead-free processes.
RO3003G2 high-frequency laminates build on Rogers’
industry-leading RO3003 platform to provide radar sensor
designers with improved insertion loss and reduced Dk variation.
The combination of Rogers’ optimized resin and filler content along
with the introduction of very low-profile ED copper translates to
Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz
(microstrip differential phase length method). RO3003G2
laminates also show very low insertion loss of 1.3dB/inch for 5 mil
laminates as measured by the microstrip differential phase length
method. RO3003G2 laminates are an extension of RO3003 laminates
that incorporate Rogers’ decades-long experience working with
automotive radar customers and understanding the increasing product
performance requirements. To learn more, show attendees should
visit Booth #448. For more information,
visit www.rogerscorp.com.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered
materials to power, protect, and connect our world. With more than
180 years of materials science experience, Rogers delivers
high-performance solutions that enable clean energy, internet
connectivity, and safety and protection applications, as well as
other technologies where reliability is critical. Rogers delivers
Power Electronics Solutions for energy-efficient motor drives,
vehicle electrification and alternative energy; Elastomeric
Material Solutions for sealing, vibration management and impact
protection in mobile devices, transportation interiors, industrial
equipment and performance apparel; and Advanced Connectivity
Solutions for wireless infrastructure, automotive safety and radar
systems. Headquartered in Arizona (USA), Rogers operates
manufacturing facilities in the United States, China, Germany,
Belgium, Hungary, and South Korea, with joint ventures and sales
offices worldwide. For more information, visit
www.rogerscorp.com.
Contact Information Jason Farrell Elevation
Marketing jfarrell@elevationb2b.com (480) 539-2706
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