SAN JOSE, Calif. and HSINCHU,
Taiwan, April 7, 2015 /PRNewswire/ -- Altera
Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today
announced the two companies have produced an innovative, UBM-free
(under-bump metallization-free) WLCSP (wafer-level chip scale
package) technology that provides enhanced quality, reliability and
integration for Altera's MAX® 10 FPGA products.
This approach results in an extremely thin package height of
less than 0.5mm (including solder ball) that is ideal for
applications where space is at a premium, such as sensor
applications, small form-factor industrial equipment, and portable
electronics. Other benefits include a better than 200 percent
improvement in board-level reliability compared to standard WLCSP,
while enabling a large die size envelope and high package I/O
count, targeting applications such as wireless LAN (WLAN) and power
management ICs (PMIC). Copper routing capability and inductor
performance are also enhanced as a result of this breakthrough.
"Altera's work with TSMC has produced a very advanced and
integrated packaging solution for MAX 10 devices," said
Bill Mazotti, vice president of
worldwide operations and engineering at Altera. "Leveraging this
innovative technology to improve integration, quality and
reliability makes MAX 10 FPGA products more versatile and useful
for our customers."
Altera's MAX 10 FPGA products revolutionize non-volatile
integration by delivering advanced processing capabilities in a
single-chip, small-form-factor programmable logic device. Building
upon the single-chip heritage of previous MAX device families,
densities range from 2K – 50K logic elements (LEs), using either
single or dual-core voltage supplies. MAX 10 FPGA devices are built
on TSMC's 55nm embedded NOR flash technology that enables
instant-on functionality.
Altera is currently sampling MAX 10 FPGA products with the new
WLCSP packaging. There are 81-pin and 36-pin WLCSP packages
available. An overview of both V81 and V36 can be found at
www.altera.com/max10-product-table. Additional V81 technical
details may be accessed at www.altera.com/max10-package.
"Our decades-long technology collaboration with Altera continues
to produce dramatic results such as this UBM-free packaging
innovation," said David Keller,
executive vice president, TSMC North America. "Continuous
improvement in all areas from design, to manufacturing, to
packaging is our shared goal and commitment, and we look forward to
many more years of working closely with Altera."
About Altera
Altera® programmable solutions enable designers of electronic
systems to rapidly and cost effectively innovate, differentiate and
win in their markets. Altera offers FPGA, SoC, CPLD
products, and complementary technologies, such as power
solutions, to provide high-value solutions to customers
worldwide. www.altera.com.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry,
providing the industry's leading process technology and the foundry
segment's largest portfolio of process-proven libraries, IPs,
design tools and reference flows. The Company's owned capacity in
2014 was 8.2 million 12-inch equivalent wafers, including capacity
from three advanced 12-inch GIGAFAB™ facilities (Fab 12, Fab 14,
and Fab 15), four eight-inch fabs (Fab 3, Fab 5, Fab 6 and Fab 8),
one six-inch fab (Fab 2), as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China. TSMC is the first foundry
to provide 20nm and 16nm production capabilities. TSMC's corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please
visit http://www.tsmc.com.
ALTERA, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS
and STRATIX words and logos are trademarks of Altera Corporation
and registered in the U.S. Patent and Trademark Office and in other
countries. All other words and logos identified as trademarks or
service marks are the property of their respective holders as
described at www.altera.com/legal.
TSMC
Spokesperson:
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TSMC Acting
Spokesperson:
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Altera Media
Contact:
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Lora Ho
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Elizabeth
Sun
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Sue
Martenson
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TSMC Senior VP &
CFO
|
Director
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Sr.
Manager
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Tel:
886-3-505-4602
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Communication
Division
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Altera
Corporation
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Tel:
886-3-568-2085
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Tel: (408)
544-8158
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Mobile:
886-988-937999
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E-Mail:
newsroom@altera.com
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E-Mail:
elizabeth_sun@tsmc.com
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SOURCE Altera Corporation; TSMC