SAN JOSE, Calif., July 25, 2017 /PRNewswire/ -- Cadence Design
Systems, Inc. (NASDAQ: CDNS) today announced the
Cadence® Tensilica® HiFi 3z DSP IP core for
system-on-chip (SoC) designs targeted for the latest mobile and
home entertainment applications, including smartphones, augmented
reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The
new HiFi 3z architecture offers more than 1.3X better voice and
audio processing performance than its predecessor, the HiFi 3 DSP,
which leads the industry in the number of audio DSP cores shipped.
For more information on the Tensilica HiFi 3z DSP, visit
www.cadence.com/go/hifi3z.
Higher voice sample rates require more complex voice
pre-processing. Enhanced Voice Services (EVS), the latest mobile
voice codec supporting voice over LTE (VoLTE), supports up to a
48kHz sample rate, compared to 16kHz for the previous AMR-WB codec.
The new HiFi 3z DSP delivers more than 1.3X better performance for
EVS than the HiFi 3 DSP core. Home entertainment is driving a
similar workload increase as audio codecs like Dolby AC-4 and
MPEG-H transition from channel-based to object-based. In addition,
audio post-processing functions such as Waves Nx 3D/AR audio and
the immersive audio of Dolby Atmos-enabled TVs are driving higher
complexity signal processing. The HiFi 3z DSP provides more than
1.4X better performance on Dolby Atmos-enabled TVs than the HiFi 3
DSP.
"The combination of Waves' constantly evolving technological
portfolio and Cadence's new generation of efficient HiFi 3z DSP
cores allows us to continue on our mission to deliver cutting-edge
audio capabilities to consumers everywhere and at all times," said
Tomer Elbaz, executive vice
president and general manager, Consumer Electronics Division of
Waves Audio. "Waves algorithms running on the HiFi 3z DSP are 20
percent more efficient. When combined with the versatility of our
audio-processing portfolio, this offers a compelling package for
manufacturers looking to provide a great audio experience to their
customers."
The HiFi 3z DSP offers a number of architecture and instruction
set architecture (ISA) improvements over the earlier HiFi 3 DSP,
including:
- Dual load/store
- Advanced FLIX bundling (multiple-base ISA operations per
cycle)
- Double the MACs for 16x16 (octal MAC)
- Enhanced ISA for accelerating FFTs, FIRs and IIRs
- New instruction extensions to improve codec (especially EVS)
performance for mobile
- 4-way, 8-bit load for improved voice trigger performance
- 8-way, 8-bit load for reduced neural network memory usage
"In pursuit of better consumer experiences, new audio and voice
codecs and pre- and post-processing functions have emerged that
significantly increase the signal processing and control code
workloads," stated Larry Przywara,
group director of marketing, audio/voice IP at Cadence. "We've
designed the HiFi 3z DSP to efficiently support these new audio and
voice compute requirements. The HiFi 3z DSP has already been
licensed to a leading customer that has taped out their mobile SoC
with anticipated production in 2018."
Tensilica HiFi DSPs are the most widely licensed
audio/voice/speech processors, with support for over 200 proven
software packages and more than 95 software partners in the
Tensilica Xtensions™ partner program. More than 75 top-tier
semiconductor companies and system OEMs have selected Tensilica
HiFi DSPs for their audio, voice and speech products. For more
information on the Tensilica HiFi DSP family, visit
http://ip.cadence.com/ipportfolio/tensilica-ip/audio.
About Cadence
Cadence enables electronic systems and
semiconductor companies to create the innovative end products that
are transforming the way people live, work and play. Cadence
software, hardware and semiconductor IP are used by customers to
deliver products to market faster. The company's System Design
Enablement strategy helps customers develop differentiated
products—from chips to boards to systems—in mobile, consumer, cloud
datacenter, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine's 100 Best
Companies to Work For. Learn more at cadence.com.
© 2017 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
For more information, please contact:
Cadence Newsroom
408-944-7039
newsroom@cadence.com
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SOURCE Cadence Design Systems, Inc.