SAN JOSE, Calif., June 1, 2015 /PRNewswire/ -- Cavium, Inc.,
(NASDAQ: CAVM), a leading provider of semiconductor products that
enable intelligent processing for enterprise, data center, cloud,
wired and wireless networking, today announced a series of
industry-standard COM Express and Qseven modules based on the
OCTEON III CN70XX/71XX high performance multi-core processors.
Three form factors are being offered including COM Express Compact
(95mm x 95mm), COM Express Mini (84mm x 55mm), and Qseven (70mm x
70mm) in order to suit a wide range of system configurations. All
modules are offered in both commercial temperature and industrial
temperature range supporting operations in demanding environments,
and are compatible with a stand-alone development board along with
the support of Cavium OCTEON SDK and Monta Vista carrier-grade
Linux.
The Cavium OCTEON III based COM Express and Qseven modules
expand OCTEON's target markets to general-purpose embedded
computing systems in industrial, military and aerospace markets as
well as control-plane applications in networking, telecom/datacom
and wireless infrastructure. Powered by the OCTEON III CN7130 with
four powerful 64-bit MIPS CPU cores, hardware accelerated packet
processing, security, and deep packet inspection engines, the
OCTEON III based COM Express and Qseven modules deliver
multiple-fold increase in networking intelligence and security
performance, meeting the growing need for high packet processing
throughput and robust security capabilities in a very compact and
low-power footprint.
The COM Express Compact module is designed to support Type 5 and
Type 6 pin outs, and comes with up to 8 GB of DDR3 memory as well
as eMMC onboard storage. The Type 5 interface supports a total of
eight USB 2.0 ports, while Type 6 supports four USB 2.0 ports along
with an additional four USB 3.0 ports. Two PCI Express 2.0 lanes
and two SATA interfaces operating at up to 6 Gb/s enable fast and
flexible system extensions to other system interfaces and storage.
Additionally, low speed control interface such as SPI, CANbus, I2C
and LPC are supported.
The COM Express Mini Type 10 and Qseven modules deliver a
solution for extremely compact form-factors with a reduced set of
I/O's. Both modules come with up to 4 GB of DDR3 memory, eMMC
onboard storage and 1 GbE port. The COM Express Mini module
features a total of six USB 2.0 ports and two USB 3.0 ports, while
the Qseven supports four USB 2.0 ports. Two PCI Express 2.0 lanes
and two SATA interfaces are supported, along with low speed control
interface such as SPI, CANbus, I2C and LPC.
The OCTEON III CN70XX/CN71XX families of multi-core cnMIPS64
processors integrate single to quad cnMIPS64 v3 cores with
virtualization capabilities and hypervisor support. These
highly-integrated SoCs include a rich set of I/O's and Cavium's
advanced hardware acceleration for packet processing, security,
deep packet inspection (DPI), offering a power, performance, and
price-optimized solution for next-generation platforms.
Availability:
Cavium COM Express and Qseven modules will be available in Q3,
2015. Production-ready reference design files will be offered to
ODM and OEM partners to enable broad support and fastest time to
production for these modules.
About Cavium, Inc.
Cavium (NASDAQ: CAVM) is a leading
provider of highly integrated semiconductor products that enable
intelligent processing in enterprise, data center, cloud and wired
and wireless service provider applications. Cavium offers a broad
portfolio of integrated, software-compatible processors ranging in
performance from 100 Mbps to 100 Gbps that enable secure,
intelligent functionality in enterprise, data-center,
broadband/consumer and access and service provider equipment.
Cavium's processors are supported by ecosystem partners that
provide operating systems, tool support, reference designs and
other services. Cavium's principal office is in San Jose, CA with design team locations in
California, Massachusetts, India and China. For more information, please visit:
http://www.cavium.com.
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SOURCE Cavium, Inc.