WILSONVILLE, Ore., March 23, 2015 /PRNewswire/ -- Mentor
Graphics Corporation (NASDAQ: MENT) today announced its new
Xpedition® Package Integrator flow, the industry's broadest
solution for integrated circuit (IC), package, and printed circuit
board (PCB) co-design and optimization. The Package Integrator
solution automates planning, assembly and optimization of today's
complex multi-die packages. It incorporates a unique virtual die
model concept for true IC-to-package co-optimization. In support of
early marketing-level studies for a proposed new device, users can
now plan, assemble and optimize complex systems with minimal source
data. The new Package Integrator flow allows design teams to
realize faster and more efficient physical path finding and
seamless tool integration for rapid prototyping, right to the
production flow.
This solution ensures that ICs, packages and PCBs are optimized
with each other to reduce package substrate and PCB costs by
efficient layer reduction, optimized interconnect paths, and
streamlined/automated control of the design process. The Xpedition
Package Integrator product also provides the industry's first
formal flow for ball grid array (BGA) ball-map planning and
optimization based on an "intelligent pin" concept, defined by user
rules. In addition, a groundbreaking multi-mode connectivity
management system (incorporating hardware description language
(HDL), spreadsheet and graphical schematic) provides cross-domain
pin-mapping and system level cross-domain logical verification.
"Companies are recognizing that it will not be possible to
design optimal systems in a timely fashion without the ability to
co-design the IC, package, and board," said E. Jan Vardaman, president and founder,
TechSearch International, Inc. "Incorporating key parameters from
thermal and electromagnetic modeling will be critical in meeting
performance objectives. Automating this process is essential
to meet development and product launch schedules in our fast moving
market segments. Mentor's Xpedition Package Integrator tool is a
breakthrough in the design process."
Additional features include:
- Cross-domain interconnect visualization in a single view
- Powerful, comprehensive and user-friendly multi-mode physical
layout tools with industry leading routing for PCB, MCM, SiP, RF,
Hybrid and BGA designs
- Fully automated library development
The Xpedition Package Integrator flow leverages other Mentor
Graphics tools such as the HyperLynx® signal and power integrity
product, FloTHERM® computational fluid dynamics (CFD) thermal
modeling tools, and the Valor® NPI substrate fabrication checking
tool. To complete the Mentor Graphics co-design solution, Nimbic
was acquired in 2014. The Nimbic technology provides
Maxwell-accurate, 3D full-wave electromagnetic (EM)
high-performance simulation solutions that accurately calculate
complex electromagnetic fields for chip-package-board
simulation.
"The Xpedition Package Integrator design flow, especially the
unique virtual die model, gives package and board design experts
really meaningful guidance and tools for their parts of the system
design efforts," said Herb Reiter,
president of eda2asic and Director of 3D-IC Programs at Si2. "This
flow also allows quick and structured feedback to the IC designers
and enables true die-package-board co-design and optimization
towards best possible performance versus power ratios for your next
system design."
"Mentor Graphics recognizes the increasing complexity in
electrical systems design and manufacturing, particularly for IC,
package and board co-design," stated A.J.
Incorvaia, vice president and general manager of Mentor
Graphics Systems Design Division. "Our new Xpedition Package
Integrator flow will enable systems designers to achieve optimum
productivity by saving time and costs while improving the overall
quality and performance of advanced systems."
Product Availability
The Xpedition Package Integrator
flow is available now. For pricing, consult a Mentor Graphics
sales representative or call 1-800-547-3000. Additional product
information can be found on the website:
www.mentor.com/pcb/package-integrator
About Mentor Graphics
Mentor Graphics Corporation
(NASDAQ: MENT) is a world leader in electronic hardware and
software design solutions, providing products, consulting services
and award-winning support for the world's most successful
electronic, semiconductor and systems companies. Established in
1981, the company reported revenues in excess of $1.24 billion. Corporate headquarters are located
at 8005 S.W. Boeckman Road, Wilsonville,
Oregon 97070-7777. World Wide Web site:
http://www.mentor.com/.
(Mentor Graphics, Xpedition, HyperLynx, FloTHERM and Valor are
registered trademarks of Mentor Graphics Corporation. All other
company or product names are the registered trademarks or
trademarks of their respective owners.)
For more information, please
contact:
Larry
Toda
Mentor Graphics
503.685.1664
larry_toda@mentor.com
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SOURCE Mentor Graphics