Exhibit 1.01
CONFLICT MINERALS REPORT OF ANALOG DEVICES, INC. IN ACCORDANCE WITH RULE 13P-1 UNDER THE SECURITIES
EXCHANGE ACT OF 1934 (UNAUDITED)
Section 1: Introduction
This is the Conflict Minerals Report of Analog Devices, Inc. (Analog Devices, ADI, we, our) for calendar year 2023 in accordance with Rule 13p-1 under the Securities Exchange Act of 1934 (Rule 13p-1). Numerous terms in this report are defined in Rule 13p-1 and Form SD and
the reader is referred to those sources for such definitions and explanations thereof.
Products manufactured or contracted to be manufactured by Analog
Devices may contain tantalum, tin, tungsten and/or gold (collectively, conflict minerals) that are necessary to the functionality or production of our products. Based on the reasonable country of origin inquiry (RCOI) described below, Analog Devices
either knows that necessary conflict minerals originated in the Democratic Republic of the Congo or an adjoining country (collectively, Covered Countries) and are not from recycled or scrap sources, or has reason to believe that necessary conflict
minerals may have originated in the Covered Countries and has reason to believe that they may not be from recycled or scrap sources. Accordingly, we undertook due diligence on the source and chain of custody of the necessary conflict minerals in our
products, as described below. Analog Devices is many steps removed from the mining of the conflict minerals; we do not purchase raw ore or unrefined conflict minerals, and we do no purchasing in the Covered Countries. We either purchase conflict
minerals indirectly from a smelter or refiner (SOR) for use in our manufacturing processes or purchase components from suppliers that incorporate conflict minerals. The mine or other point of origin of conflict minerals cannot be determined with any
certainty once the raw ores are smelted, refined, and converted to ingots, bullion, or other conflict mineral-containing derivatives.
Analog Devices is a
global semiconductor leader dedicated to solving our customers most complex engineering challenges. We deliver innovations that connect technology to human breakthroughs and play a critical role at the intersection of the physical and digital
worlds by providing the building blocks to sense, measure, interpret, connect, and power. We design, manufacture, test, and market a broad portfolio of solutions, including integrated circuits (ICs), software and subsystems that leverage
high-performance analog, mixed-signal and digital signal processing technologies. Our comprehensive product portfolio, deep domain expertise and advanced manufacturing capabilities extend across high-performance precision and high-speed
mixed-signal, power management and processing technologies including data converters, amplifiers, power management, radio frequency (RF) ICs, edge processors and other sensors.
Section 2: Product Scope
We design, manufacture,
test, and market a broad portfolio of solutions, including ICs, software and subsystems that leverage high-performance analog, mixed-signal and digital signal processing technologies. Our comprehensive solution portfolio, deep domain expertise and
advanced manufacturing capabilities extend across high-performance precision and high-speed mixed-signal, power management and processing technologies including data converters, amplifiers, power management, RF ICs, edge processors and other
sensors. The scope of this report applies to semiconductor ICs, monolithic and multi-chip ICs, multi-component ICs, system-in-package modules/hybrid ICs, and other
modules and assembled products. Our ICs are designed to address a wide range of real-world signal processing applications. We sell our products to customers worldwide, many of whom use products spanning our core technologies in a wide range of
applications. Our IC product portfolio includes both general-purpose products used by a broad range of customers and applications, as well as application-specific products designed for specific target markets. By using readily available,
high-performance, general-purpose products in their systems, we help our customers to reduce complexity and accelerate their time to market. Given the high cost of developing more customized ICs, our standard products often provide a cost-effective
solution for many low to medium volume applications. More specifically, our analog ICs monitor, condition, amplify or transform continuous analog signals associated with physical forces. By sensing and analyzing signals near their source, we enable
processing, decision making and action at the Intelligent Edge, helping us better translate physical forces like temperature, light, and sound into actionable insights, and enabling the innovations that improve quality of life and solve the
worlds most pressing challenges. Our analog ICs also provide voltage regulation and power control to electronic systems. We collaborate with customers to design application-specific solutions and help them to solve their toughest technology
challenges. We begin with our existing core technologies, which leverage our analog and mixed signal, power management, RF and microwave, edge processors and other sensors, and devise solutions that more closely meet the needs of a specific customer
or group of customers. In certain cases, because we have already developed the core technology platform for our general-purpose products, we can create trusted, application-specific solutions quickly and efficiently.
We produce and market a broad range of ICs and products and operate in one reportable segment based on the aggregation of our operating segments. The ICs
sold by each of our operating segments are manufactured using similar semiconductor processes, package manufacturing processes and raw materials in either our own production facilities or by third-party wafer fabricators and package manufacturers.
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