Intel Unveils New Developer Tools, Future Technologies Spanning Tablets, Analytics, Wearable Devices and PCs at Developer Forum
September 09 2014 - 12:00PM
Business Wire
Announces Availability of Intel® Edison and
2nd Generation LTE Modem Platforms
INTEL DEVELOPER FORUM -– Intel Corporation CEO Brian Krzanich
kicked off Intel's annual technical conference with a broad set of
computing initiatives and projects showing how the company is
moving quickly to enable new market segments where everything is
smart and connected. Krzanich and other executives announced new
hardware and software developer tools, previewed upcoming Intel
technologies and announced new products across several technology
segments.
The Dell Venue 8 7000 Series with Intel
RealSense snapshot, powered by Intel Atom Z3500 processor series,
is the world's thinnest tablet. RealSense snapshot is Intel's
enhanced 3-D photography solution that captures depth information,
without sacrificing image quality, to bring new life to flat,
static photos. (Photo: Business Wire)
“With our diverse product portfolio and developer tools that
span key growth segments, operating systems and form factors, Intel
offers hardware and software developers new ways to grow as well as
design flexibility,” said Brian Krzanich, Intel CEO. “If it’s smart
and connected, it is best with Intel.”
During the keynote, Krzanich was joined on the keynote stage by
several Intel executives, Michael Dell, chairman and CEO of Dell*,
and Greg McKelvey, executive vice president and chief strategy and
marketing officer of the Fossil Group*.
The technical conference’s format and content were revamped this
year to appeal to an expanded range of engineers and programmers,
reflecting Intel’s efforts to extend the reach of Intel technology.
The agenda and technology showcase content expanded beyond PCs,
mobile and the data center to also include the Internet of Things
(IoT) and wearables and other new devices created by so-called
“makers” and inventors. More than 4,500 people are attending the
forum this week from around the world.
Developer Tools News Items
- Intel announced the Intel Reference
Design for Android program to offer tablet users a high-quality,
consistent experience based on the latest Android* operating
system. Intel will help scale the deployment process of Android for
tablet manufacturers by providing the software engineering work,
streamlined access to Google Mobile Services*, as well as support
for updates and upgrades to future Android releases.
- Intel announced the Analytics for
Wearables (A-Wear) developer program that will accelerate
development and deployment of new wearable applications with
data-driven intelligence. The developer program integrates a number
of software components, including tools and algorithms from Intel
and data management capabilities from Cloudera* CDH all deployed on
a cloud infrastructure optimized on Intel® architecture. Developers
of Intel wearables will use the A-Wear developer program free of
charge.
Intel Product Availability News Items
- Intel announced the first commercial
availability of the Intel® XMM™ 7260 modem, now shipping in the
Samsung* Galaxy Alpha smartphone for Europe and other regional
markets. The Intel XMM 7260 and Intel® XMM™ 7262 modems support one
of the industry’s fastest mobile standards, delivering Category 6
data rates up to 300 Mbps. The modems are Intel’s second-generation
LTE platforms and provide device manufacturers a high-performance,
power-efficient solution for the coming wave of LTE-Advanced
networks and devices.
- Intel® Edison, a postage stamp-size
computer with built-in wireless that was announced at CES, is now
shipping and available. The platform is designed to enable rapid
innovation and product development from inventors, entrepreneurs
and consumer product designers by simplifying the design process,
increasing durability and providing additional cost savings.
- AT&T* will be the exclusive carrier
for the “My Intelligent Communication Accessory” (MICA)
bracelet designed by Opening Ceremony, engineered by Intel, that
was introduced last week in New York.
Product and Innovation Preview News Items
- Michael Dell and Krzanich previewed an
upcoming Dell tablet with first-of-its-kind photo capabilities. The
new Dell Venue 8 7000 Series with Intel® RealSense™ snapshot is the
world’s thinnest tablet and will be available in time for the
holiday season. Intel RealSense snapshot is an enhanced photography
solution that creates a high-definition depth map to enable
measurement, refocus and selective filters with a touch of a
finger. It will introduce new capabilities and new ways of using
the tablet, opening up a new creative horizon for developers to
come up with apps that change how consumers engage with their
photos.
- Intel® Wireless Gigabit Docking – a
full wireless experience that includes wireless
docking, wireless display and wireless charging – was
demonstrated via an Intel reference design based on a 14nm
next-generation Intel processor.
- Developers got a preview of the next
generation 14nm Intel® Core™ processor for 2015.
- Renowned physicist Stephen Hawking
joined the conference via video to discuss how technology for the
disabled is often a proving ground for the technology of the
future. In connection with Hawking's video attendance, Intel
revealed for the first time a unique Connected Wheelchair Project,
a proof of concept designed by Intel interns as part of the Intel
Collaborators program. The project demonstrated how to transform
standard “things” into data-driven, connected machines using the
Intel Galileo Development Kit, based on Intel® Quark processors,
and Intel® Gateway Solutions for the IoT, featuring Wind River* and
McAfee* security products.
IDF Preview
- Developers will experience 164
technical sessions with industry and Intel experts.
- Intel’s business units and more than
180 leading companies from around the world will showcase 700
hands-on demonstrations of their newest innovations and future
technologies at the IDF Industry Technology Showcase.
- During the IoT mega session this
morning, Intel Vice President Doug Davis will address
interoperability and security challenges and describe Intel’s
integrated hardware and software building blocks for edge-to-cloud
IoT solutions. He will disclose that Intel is collaborating with
AT&T*, Cisco*, GE* and IBM* to create complete solutions
utilizing their platforms and Intel’s building blocks. The
companies will announce joint products that are available today in
addition to future product plans.
- In the Intel Edison, Wearables and New
Devices mega session this afternoon, Intel Vice President Mike Bell
will preview several Intel Edison-powered prototype devices,
including a 3-D printed interactive garment and a braille printer
and embosser. Meridian Audio*, a top high-performance audio and
video component manufacturer, will also discuss how Intel Edison
contributes to advancing its wireless audio product offerings.
- During the Software Developer mega
session this afternoon, Intel Vice President Doug Fisher will
introduce tools that help developers create software easier, faster
and across ecosystems. He will also talk about the ease with which
OEMs and ODMs will be able to build a Windows-* or Android-based
device using customized tools and reference designs from
Intel.
- In the Mobile Technology mega session
this afternoon, Intel Vice President Hermann Eul will challenge
developers to play a role in solving the world’s most critical
problems and advancing societies across the globe, in particular in
developing countries, through innovations for the most prominent
technology in people’s hands, the mobile device. He will highlight
the hardware, software and communications technologies that will
allow developers to tap into this opportunity and aid in providing
change, progress and innovation.
- During the Data Center mega session
tomorrow morning, Intel Senior Vice President Diane Bryant will
discuss how data centers are being re-architected, driven in large
part by the rise of the digital service economy. This session will
include an update on future Intel silicon photonics products and
details on how Intel is tailoring products for individual data
center customers.
- In the PC Reinvention and Innovation
mega session tomorrow morning, Intel Senior Vice President Kirk
Skaugen will discuss how developers can address the 600 million
unit global opportunity of 4-year-old and older PCs that could be
replaced with exciting new form factors and new experiences across
multiple operating systems. Skaugen will update developers on
ChromeOS* and Intel® Wireless Display momentum, and as well as the
Alliance for Wireless Power wireless charging consortium.
Supporting Resources
- Photos: MICA, “My Intelligent
Communication Accessory”, by Opening Ceremony and Intel
- Photo: Intel® Edison
- Photo: Dell Venue 8 7000 Series* with
Intel RealSense Snapshot
- Fact sheet: Intel’s 2014 LTE-Advanced
Communications Platform Now Shipping
- Blog by Intel Vice President Doug
Fisher: Intel Reference Design for Android
- Blog by Intel Vice President Mike Bell:
Intel, Fossil to Advance Wearable Designs
- IDF14 keynote webcast
- IDF14 virtual media kit
About Intel
Intel (NASDAQ:INTC) is a world leader in computing innovation.
The company designs and builds the essential technologies that
serve as the foundation for the world’s computing devices. As
a leader in corporate responsibility and sustainability, Intel also
manufactures the world’s first commercially available
“conflict-free” microprocessors. Additional information about Intel
is available at newsroom.intel.com and blogs.intel.com, and about
Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, Intel Core, Intel RealSense, XMM, Quark and the Intel
logo are trademarks of Intel Corporation in the United States and
other countries.*Other names and brands may be claimed as the
property of others.
Photos/Multimedia Gallery Available:
http://www.businesswire.com/multimedia/home/20140909006260/en/
IntelLaura Anderson, 480-552-9020Laura.m.anderson@intel.com
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