VR Victory Resources Corporation

Spectra7 Microsystems Inc. (TSX VENTURE:SEV), a high performance analog
semiconductor company delivering unprecedented speed, resolution and signal
fidelity, today announced that the Company's DisplayDirect(TM) Virtual Reality
VR7100 product has commenced production based on purchase orders to use the
Company's product in leading wearable computing and virtual reality platforms. 


Virtual Reality ("VR") systems based on Spectra7's DisplayDirect(TM) technology
uniquely achieve the most critical consumer VR requirements, including:




--  High Bandwidth for Immersive 3D Resolution: Delivers up to 40Gbps (40
    billion bits per second) - enough equivalent bandwidth to drive 8 large
    format HDTVs using a single thin cable; 
    
--  Low Latency: Operates with less than 35 nanoseconds (i.e. 35 billionths
    of a second) of latency - up to 100,000 times faster than Wi-Fi -
    ensuring the interconnect does not contribute to total system latency
    which could lead to motion "simulation" sickness - an issue that
    impacted acceptance by some consumers of previous VR platforms; 
    
--  Light Weight, Long Reach:  Eliminates up to 80% of the copper used in
    traditional high speed cables, enabling VR interconnects that are up to
    6 times lighter, 10 times thinner, and significantly longer with lengths
    reaching 15 feet; 
    
--  Embedded Power Delivery: Reduces the gauge (thickness) of the signal
    interconnect by leveraging the Company's patented power delivery
    technology to supply power to the headset and associated chips thereby
    eliminating the need for a separate power cable. 



"Virtual reality will require resolutions at or beyond human perception," said
Paul Gray, Director of European Research, DisplaySearch. "Signal feeds to
wearable displays have to be capable of carrying a huge data payload yet also be
light and flexible enough for the wearer to be unhindered and comfortable." 


Spectra7 believes its patented technology is the only solution that achieves all
of these consumer requirements to accelerate mass consumer adoption of VR
platforms by replacing traditional bulky and heavy cabling with a single
super-slim, ultra-light wearable interconnect between the headset, gaming GPU
and power port. 


The Consumer Virtual Reality Market is projected to grow to $5.2 billion by 2018
according to a recent report from KZERO Worldwide. While gamers, innovators and
teens are expected to be first adopters, market analysts believe VR will
transcend beyond gaming into telepresence, healthcare, and engineering
applications for mainstream consumers and business users.


"Our proactive approach to the emerging visual display trends and technology
continues to position us at the forefront of new markets, including the nascent
Virtual Reality world which has recently become mainstream as major players
enter the market," said Tony Stelliga, CEO of Spectra7. "The latest VR headsets
are an ideal platform for Spectra7's signal processing and power delivery
technology as we break the traditional boundaries for weight and industrial
design to deliver the requisite bandwidth, power, resolution and speed for next
generation consumer interconnects." 


Spectra7's technology transforms the industrial design of traditional consumer
electronics and mobile infrastructure by enabling new levels of miniaturization
and portability, previously unavailable to the market. The Company's
next-generation of ultra-small and low profile silicon, including the VR7100,
reduce the metal shielding, wire gauge and electro-mechanical components that
make interconnects, such as those used in virtual reality platforms,
unnecessarily thick, heavy and bulky. 


ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high performance analog semiconductor company
delivering unprecedented speed, resolution and signal fidelity to consumer and
wireless infrastructure products. Spectra7's new system-level components address
throughput bottlenecks and satisfy the exponential demand for more bandwidth and
lower costs in mobile and internet infrastructure equipment, including handsets,
tablets, base stations and microwave backhaul systems. Spectra7 is headquartered
in Markham, Ontario with development centers in Silicon Valley, Irvine,
California and Cork, Ireland. For more information, please visit
www.spectra7.com.


CAUTIONARY NOTES

Certain information in this news release may constitute forward-looking
information. This information is based on current expectations that are subject
to significant risks and uncertainties that are difficult to predict. Actual
results might differ materially from results suggested in any forward-looking
statements. Spectra7 assumes no obligation to update the forward-looking
statements, or to update the reasons why actual results could differ from those
reflected in the forward looking-statements unless and until required by
securities laws applicable to Spectra7. Additional information identifying risks
and uncertainties is contained in Spectra7's filings with the Canadian
securities regulators available at www.sedar.com.


Neither the TSX Venture Exchange nor its Regulation Services Provider (as that
term is defined in the policies of the TSX Venture Exchange) accepts
responsibility for the adequacy or accuracy of this release.


FOR FURTHER INFORMATION PLEASE CONTACT: 
Spectra7 Microsystems Inc.
Melissa Chee
Vice President, Corporate Marketing and Product Management
647-472-2468
pr@spectra7.com
www.spectra7.com

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