ASE to Showcase System-in-Package and MEMS & Sensor Solutions through Smart Living Applications at COMPUTEX 2016
May 30 2016 - 5:30AM
Business Wire
Show suite to demonstrate ASE SiP and
sensors technologies for the IoT
Advanced Semiconductor Engineering, Inc (TAIEX: 2311)(NYSE:
ASX), the world’s largest semiconductor assembly and test service
provider, today announced that it will showcase System-in-Package
(SiP) and MEMS & Sensor technologies through live
demonstrations of Smart Living and Smart Bike applications at
COMPUTEX 2016, scheduled to take place in Taipei, Taiwan, May 31 -
June 3, 2016. These SiP and sensor applications highlight ASE’s
innovative portfolio geared towards the IoT market, as well as the
company’s continued commitment to environmental sustainability.
SiP technology is an ideal solution for a broad spectrum of
consumer technology. With its ability to enable multiple
semiconductor chips and passive components to be integrated within
increasingly more compact modules, without compromising
functionality, SiP is perfectly suited for IoT applications. During
COMPUTEX, ASE will showcase ways in which SiP technology will
enable the evolving Smart Living era. Booth visitors see live
demonstrations featuring mesh lighting that can be controlled
through an iPad, environmental sensors and home security systems.
These demonstrations will feature the potential applications for
these new technologies.
Additionally, visitors will be able to see a live Smart Bike
demo in which ASE will showcase how its SiP platform can enable
smart biking through a city. The demo will feature traffic light
control optical sensing, motion sensing and heart rate and oxygen
saturation detection, among other technologies. COMPUTEX attendees
will find the Smart Living and Smart Bike demonstrations in the ASE
VIP suite, which is located on the second floor of the Taipei
International Convention Center (TICC), number T203A.
ASE’s advancements in SiP technology serve to meet growing
market demand for low-powered controllers and sensors with small
footprints but large memory for continually shrinking devices.
Enabling heterogeneous integration of numerous IC functions — such
as RF, processor, memory, sensors, power, multimedia and more —
within very tight space constraints.
About ASE Group
The ASE Group is the world's largest provider of independent
semiconductor manufacturing services in assembly, test, materials
and design manufacturing. As a global leader geared toward meeting
the industry’s ever-growing needs for faster, smaller and higher
performance chips, the Group develops and offers a wide portfolio
of technology and solutions including IC test program design,
front-end engineering test, wafer probe, wafer bump, substrate
design and supply, wafer level package, flip chip,
system-in-package, final test and electronic manufacturing services
through Universal Scientific Industrial Co., Ltd. and its
subsidiaries, members of the ASE Group. The Group generated sales
revenues of US$8.64 billion in 2015 and employs over 65,000 people
worldwide. For more information about ASE Group, visit
www.aseglobal.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20160530005123/en/
ASE GroupUSA & EuropePatricia MacLeod,
+1-408-636-9500patricia.macleod@aseus.comorAsia PacificJennifer
Yuen, +65-6631-4229jennifer.yuen@aseus.com
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