Singapore’s Capcon Raises Around $50 Million
February 04 2023 - 10:01PM
Capcon, a Singapore-based advanced packaging solution
provider, has secured around $50 million in series B2 funding.
The fund will mainly be invested in manufacturing, marketing, and
Advanced packaging stands vital in sustaining Moore’s Law. Data
from Yole, a market research institute, shows that the global
market size of advanced packaging reached $33 Billion in 2021,
taking up 45% of the global packaging market, and is projected to
reach $42 Billion by 2025.
Capcon Singapore Pte. Ltd. provides a full range of advanced
packaging processes, offering die bonders for wafer-level
packaging, panel-level packaging, Flip chip, SIP, and Stack Die,
etc. At the beginning of 2022, Capcon reached a 3-year supply
agreement with ASE.
Capcon Singapore Pte. Ltd. has planned 6 series of products to
support advanced processes under various scenarios, namely, A
series (Andromeda), L series (Leo), R series (Reticulum), M series
(Monoceros), V series (Venus) and E series (Eridani).
Capcon is comprehensively engaged in intelligent manufacturing,
semiconductors and pan-semiconductor fields. With the
high-precision pick-and-place technology, the company has launched
mass transfer equipment; With the testing and identifying
capability, the company has expanded to AOI tester and sorter.
At present, Capcon Singapore Pte. Ltd. has served nearly 30
clients, including 7 out of top 10 semiconductor companies
globally, and has received many re-purchases from several leading
equipment companies such as ASE, SPIL, NEPES, and TFME. At the
beginning of 2022, a long-term supply plan for the next three years
has been confirmed with ASE.
Regarding revenue, Capcon expects to maintain a three-fold
growth in 2023. All Capcon’s founding members have about 30 years
of experience in the semiconductor industry. They are also equipped
with profound software & hardware development experience in
packaging equipment such as die bonders, wire bonders, sorters, and
molding machines. At present, the company’s fund in series B3 is in
progress and a wider range of services can be expected.
version on businesswire.com: https://www.businesswire.com/news/home/20230203005149/en/
Bingyi Zhang Email: firstname.lastname@example.org Website:
www.capconsemicon.sg www.capconsemicon.com Telephone:(+65) 6681