DNP Develops Lead Frame for Miniaturized, Highly Reliable Semiconductor Package QFN(Quad Flat Non-leaded)
October 27 2021 - 09:00PM
Business Wire
- Verified the highest MSL 1 (≤30°C/85% RH
unlimited) ranking -
Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a
highly reliable manufacturing technology that configures a high
definition silver plated area for lead frames that fix
semiconductor chips and connects them externally. In addition, the
new technology improves adhesiveness with a surface roughening
technology of the highest industry standard that seals the copper
surface to the mold compound.
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Newly developed lead frame (Photo:
Business Wire)
By providing this high definition, highly reliable lead frame we
aim to expand the use of semiconductor Quad Flat Non-leaded package
(QFN) for vehicles.
DNP Developed Lead Frame Features
DNP has taken advantage of our microfabrication technology
developed over many years to successfully achieve the configuration
of lead frame silver plated area of ±25um. It has also been
possible to maintain high level reliability by improving the
adhesion of the mold compound and the lead frame.
The Joint Electron Device Engineering Council (JEDEC) has
established Moisture Sensitivity Levels (MSL) with the objective of
preventing a variety of phenomena from volume expansion due to the
absorption and vaporization of air-borne moisture in the mold
compound. And DNP is pleased to announce that our newly developed
product has been verified the highest MSL 1 ranking.
Going Forward
DNP will propose the newly developed high definition, highly
reliable lead frame to post-processing manufacturers and expand
this business. We will also strengthen our facilities to meet
increasing demand, and plan to double our production capacity by FY
2023 compared to FY 2020.
About DNP
Since 1876, DNP is the worldwide leader in printing solutions
and connects individuals and society, and provides new value. As a
reliable partner DNP capitalizes on core competencies in
microfabrication and precision coating technology to provide
products for the display, electronic device and optical film
markets, holding global top market share in Optical Film for
displays and Photomask for semiconductors. We bring the
next-generation communication solutions such as Vapor Chamber and
Reflect Array to support a comfortable information society.
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version on businesswire.com: https://www.businesswire.com/news/home/20211027005428/en/
Media contact: Yusuke Kitagawa, IR and Public Relations Division
+81-3-6735-0101 kitagawa-y3@mail.dnp.co.jp