Section 1 - Conflict Minerals Disclosure
Item 1.01 Conflict Minerals Disclosure
This Conflict
Minerals Disclosure for ASML Holding N.V. (ASML, we, us or our) covers the reporting period from January 1, 2018 to December 31, 2018, and is filed in accordance with Rule 13p-1 of the Securities
Exchange Act of 1934 and Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act (the Dodd-Frank Act). The information contained in this Form SD is publicly available on our website at www.asml.com. The website and
the information accessible through it are not incorporated into this Form SD.
In an effort to curb the violence and exploitation occurring in the
Democratic Republic of the Congo (DRC) and adjoining regions, the Securities and Exchange Commission (SEC) adopted rules pursuant to Section 1502 of the Dodd-Frank Act. Section 1502 of the legislation addresses Conflict
Minerals and requires companies to publicly disclose information related to the use in their products of minerals originating in the DRC and the countries adjoining the DRC (Covered Countries), including the Central African Republic,
South Sudan, Zambia, Angola, Republic of the Congo, Tanzania, Burundi, Rwanda and Uganda. The minerals subject to the SECs disclosure requirements, referred to as Conflict Minerals are columbite-tantalite (coltan), cassiterite,
wolframite, gold and their derivatives, namely tin, tantalum and tungsten (3TG).
Business Overview
ASML designs, develops, integrates, markets and services advanced lithography systems used by its customersthe major global integrated circuit
manufacturersto create chips that power a wide array of electronic, communication and information technology products. Our product development strategy focuses on the development of product families based on a modular, upgradeable design and
encompasses our PAS 5500, TWINSCAN, TWINSCAN NXE lithography systems and the enhancement systems within our Applications business line, including the YieldStar metrology system and E-beam metrology and inspection systems.
Our PAS 5500 lithography systems (which we no longer manufacture but continue to refurbish), comprise advanced wafer steppers and Step-and-Scan systems
equipped with i-line, KrF and ArF light sources for processing wafers up to 200 mm in diameter and are employed in volume manufacturing and in special applications to achieve semiconductor design nodes requiring imaging at a resolution down to 90
nm.
The modular, upgradeable design philosophy of the PAS 5500 product family has been further refined and applied in the design of our TWINSCAN
lithography systems, which are the basis of our current and next-generation Step-and-Scan systems. TWINSCAN systems are equipped with i-line, KrF and ArF light sources for processing wafers up to 300 mm in diameter and are capable of extending
semiconductor shrink technology down to 38 nm and beyond with multiple patterning techniques. The dual-stage advantage of TWINSCAN immersion systems enables our customers to benefit from the process enhancement of immersion while continuing to use
familiar and proven technology. ASMLs TWINSCAN NXE platform is the industrys first production platform for extreme ultraviolet lithography (EUVL), currently offering 13 nm resolution with off-axis illumination and 2.0 nm match machine
overlay performance.
In addition, we continuously develop and sell a range of product options and enhancements within our Applications business line,
including the YieldStar metrology system and E-beam metrology and inspection systems, designed to increase semiconductor manufacturing productivity and improve imaging and overlay to optimize value of ownership over the entire lifecycle of our
systems.
Certain 3TG minerals are necessary to the functionality and production of our products. For example, gold is used in coating critical electronic
connectors to enhance connectivity performance. Each system also contains tin, used for welding electronic components on printed circuit boards and also within a critical component of our systems with the latest technology. Although certain 3TG
minerals are necessary to the functionality and production of our products, we believe that these 3TG minerals are insignificant in terms of volume relative to other parts and components of the systems we produce.
We outsource the production of the majority of components that are needed to produce our systems, and we are only able to determine whether the 3TG minerals
included in our systems are derived from a Covered Country through information provided to us by our suppliers.