STMicroelectronics Unveils Secure
Cellular-Connectivity Offering for Industrial IoT and Automotive
Applications
- ST4SIM offering includes automotive- and industrial-grade
embedded SIM (eSIM) SoCs in addition to standard machine-to-machine
SIM
- Provisioning services by proven trusted partners
- GSMA compliant for interoperability and ease of use
- Manufacturing and personalization at GSMA accredited sites in
Europe and Southeast Asia
Geneva, February 6, 2020 – STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers
across the spectrum of electronics applications, in collaboration
with trusted partners, has created a complete ecosystem for
securely connecting Industrial IoT (IIoT) and automotive systems to
cellular networks.
Offering uncomplicated access to diverse networks and services
worldwide, ST’s solution simplifies connectivity for IIoT use cases
such as remote condition monitoring and predictive maintenance, as
well as connected-driving services such as infotainment, vehicle
diagnostics, and emergency assistance.
ST provides secure hardware and software: a broad set of robust
industrial and automotive-qualified embedded SIMs (eSIMs), ready to
work with industry-standard GSMA or proprietary bootstrap profiles.
Trusted partners Arkessa, Arm and Truphone, with millions of
machine-to-machine (M2M) device deployments and eSIM activations,
provide and operate device-onboarding and service-provisioning
platforms.
The provisioning services enable IoT devices containing the
eSIMs to connect automatically to cellular networks and benefit
from flexible lifetime subscription management. Each of ST’s
appointed partner/operators can access hundreds of cellular
networks of all types including 2G, 3G, 4G, LTE CAT-M (low-power
wide-area connectivity), and NB-IoT (narrowband IoT), in large
numbers of territories worldwide.
“Our M2M connectivity solution comprises high-quality, secure,
and convenient hardware with connectivity and subscription
management provided by accomplished, world-class operators,” said
Laurent Degauque, Marketing Director, Secure Microcontroller
Division, STMicroelectronics. “Its flexibility, global reach, and
proven security at every level from eSIM to service provider let
our customers deploy innovative connected services quickly and
efficiently wherever they are needed.”
ST manufactures and personalizes all eSIMs securely at GSMA
SAS-UP (Security Accreditation Scheme UICC Production) accredited
sites in Europe and Southeast Asia.
Please contact your ST sales office for pricing options and
sample requests.
Further Technical Information:
ST’s ST4SIM family gives customers a comprehensive range of
options for IoT devices, including automotive and industrial-grade
eSIMs in multiple packages.
The ST4SIM-110x and ST4SIM-200x eSIMs are built upon ST’s ST33G
secure microcontroller, which features the tamper-proofed Arm®
SecurCore® SC300™ processor and extra security features including
hardware cryptographic accelerators.
ST4SIM-110M and GSMA-compliant ST4SIM-200M are industrial-grade
eSIMs offered in compact and convenient DFN 6mm x 5mm (MFF2) and
WLCSP form factors.
ST4SIM-110A and GSMA-compliant ST4SIM-200A for automotive use
are AEC-Q100 qualified and available in DFN 6mm x 5mm (MFF2) and
TSSOP-20.
Designed to comply with industrial and automotive reliability
requirements, the MFF2 package has wettable flanks that ensure
board-level solder-joint quality and inspectability.
All devices are designed to comply with Common Criteria CC EAL5+
security assurance, ETSI1 and GSMA 3GPP2 specifications for
connection to 2G, 3G, and LTE cellular networks including NB-IoT.
The eSIMs come with an advanced operating system that meets Java
Card and GlobalPlatform specifications. Java Card applets for
vertical services are also available.
Industrial-grade and automotive-qualified devices are specified
over the temperature range -40°C to 105°C and comply with the ETSI
M2M specification, TS 102 671.
About ArkessaArkessa is a dedicated IoT
cellular connectivity services provider, offering world-wide,
world-class connectivity solutions. A pioneer in IoT connectivity
and a trusted partner in a powerful ecosystem of global technology
leaders, Arkessa enables organisations across all sectors to deploy
their IoT applications easily, efficiently, and at scale.
A market leader in eSIM and eUICC technology, Arkessa provides
secure and resilient managed connectivity services across mobile
networks, providing flexibility for customers and avoiding vendor
lock-in. Arkessa offers access to the very latest in cellular
technologies, including NB-IoT and LTE-M, through a secure global
network and feature-rich management platform.
About Truphone Truphone believes that
connectivity can be easier, smarter and more efficient. Since 2006,
we have built state of the art SIM software, intuitive management
platforms and a powerful global network to make this a reality.
Every day, our technicians engineer better connections between
things, people and business to make the world smarter.
Headquartered in London, we have 15 offices across four continents
and continue to expand globally. To learn more, visit
www.truphone.com.
About STMicroelectronicsST is a global
semiconductor leader delivering intelligent and energy-efficient
products and solutions that power the electronics at the heart of
everyday life. ST’s products are found everywhere today, and
together with our customers, we are enabling smarter driving and
smarter factories, cities and homes, along with the next generation
of mobile and Internet of Things devices.
By getting more from technology to get more from life, ST stands
for life.augmented.
In 2019, the Company’s net revenues were $9.56 billion, serving
more than 100,000 customers worldwide. Further information can be
found at www.st.com.
For Press Information Contact:
Michael Markowitz Director Technical Media Relations
STMicroelectronics Tel: +1 781 591 0354 Email:
michael.markowitz@st.com
1 ETSI: European Telecommunication Standards Institute
2 GSMA 3GPP: GSM Association 3rd Generation Partnership
Project
- P4230S -- Feb 6 2020 -- ST4SIM_FINAL FOR PUBLICATION
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