SEOUL, South Korea and
SAN JOSE, Calif., May 30,
2019 /PRNewswire/ -- MagnaChip Semiconductor Corporation
("MagnaChip" or the "Company") (NYSE: MX), a designer and
manufacturer of analog and mixed-signal semiconductor products,
announced today the offering of its second generation 0.13
micron eFlash (Embedded Flash) technology with 20V and 30V
high-voltage options. The technology is specifically designed to
address the needs for multi-function hybrid mixed-signal products,
including touch ICs, fingerprint readout ICs and wireless
power charger ICs.
With the growing complexity of analog and mixed-signal
functions, IC designers are facing increasing challenges to
integrate multiple functions in a single product. The wireless
power charger ICs, for instance, include digital logic, analog
blocks, power management functions, embedded microcontrollers, etc.
In order to design and manufacture such multi-functional products,
hybrid processes capable of integrating various devices have become
highly desirable.
To meet these market needs, MagnaChip has developed a unique,
cost-competitive hybrid process through the addition of 20V and 30V
high-voltage options to its second generation 0.13 micron eFlash.
The second generation 0.13 micron eFlash, which has high performing
and highly reliable embedded Flash, is a cost competitive process
as it reduced 7 process steps in comparison to the first generation
0.13 micron eFlash. It also provides various customized IPs up to
64Kbytes. Even with the addition of the high voltage option, the
hybrid process maintains the original eFlash characteristics.
Additional benefit of this process is that customers can now
select either 20V or 30V, whichever fits their products'
characteristics while having the option to choose IPs such as SRAM,
PLL analog IPs, high density standard cell libraries and high
voltage IO libraries to meet their design needs. Furthermore, the
hybrid process provides fully isolated high-voltage capability for
the output driver to handle negative voltage, thereby allowing
higher design flexibility.
MagnaChip's newly developed hybrid process uses the high-voltage
devices of which reliability has already been verified in DDI
(Display Driver IC) technology and can minimize high-voltage area
in chips through more optimized design rules and enhanced current
performance. This high-voltage capability is particularly important
for products needing high-voltage output drivers and those
requiring high SNR (signal to noise ratio). For instance, touch ICs
in tablets and notebooks mainly use 20V and monitors use 30V.
So far, MagnaChip has been developing various hybrid processes
with higher performance at lower costs to meet the growing market
needs for diverse and multi-function foundry products.
Additionally, the next version of the hybrid embedded eFlash
process is already under development to extend the voltage
capability to 40V. Another type of hybrid process, e-Flash with 40V
BCD (Bipolar CMOS DMOS), has been widely accepted in the market.
MagnaChip is also developing e-Flash with 120V BCD process to
continue to pioneer new markets. These technologies have the
potential for broad applications including wireless power chargers,
USB type-C PDs, motor driver ICs and BLU driver ICs.
"The second generation 0.13 micron eFlash with high-voltage
technology is highly desirable for products requiring both memory
and high-voltage, such as wireless power charger ICs, large panel
touch ICs and fingerprint ICs," said YJ Kim, CEO of MagnaChip,
"MagnaChip will continue to develop new hybrid technologies to
enable our customers to design various products and to stay
competitive in the market."
About MagnaChip Semiconductor
MagnaChip is a designer
and manufacturer of analog and mixed-signal semiconductor platform
solutions for communications, IoT, consumer, industrial and
automotive applications. The Company's Standard Products Group and
Foundry Services Group provide a broad range of standard products
and manufacturing services to customers worldwide. MagnaChip, with
about 40 years of operating history, owns a portfolio of
approximately 3,000 registered patents and pending applications,
and has extensive engineering, design and manufacturing process
expertise. For more information, please visit
www.magnachip.com.
CONTACTS:
United States
(Investor Relations):
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USA media /
industry analysts:
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Korea / Asia
media:
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Bruce
Entin
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Mike
Newsom
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Chankeun
Park
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Entin
Consulting
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LouVan
Communications, Inc.
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Director of Public
Relations
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Tel.
+1-408-625-1262
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Tel.
+1-617-803-5385
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Tel.
+82-2-6903-5223
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Investor.relations@magnachip.com
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mike@louvanpr.com
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chankeun.park@magnachip.com
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SOURCE MagnaChip Semiconductor Corporation