ARMONK, N.Y., Aug. 23, 2021 /PRNewswire/ -- At the annual Hot
Chips conference, IBM (NYSE: IBM) today unveiled details of
the upcoming new IBM Telum Processor, designed to bring deep
learning inference to enterprise workloads to help address fraud in
real-time. Telum is IBM's first processor that contains on-chip
acceleration for AI inferencing while a transaction is taking
place. Three years in development, the breakthrough of this new
on-chip hardware acceleration is designed to help customers achieve
business insights at scale across banking, finance, trading,
insurance applications and customer interactions. A Telum-based
system is planned for the first half of 2022.
According to recent Morning Consult research commissioned
by IBM, 90% of respondents said that being able to build and run AI
projects wherever their data resides is important1. IBM
Telum is designed to enable applications to run efficiently where
the data resides, helping to overcome traditional enterprise AI
approaches that tend to require significant memory and data
movement capabilities to handle inferencing. With Telum, the
accelerator in close proximity to mission critical data and
applications means that enterprises can conduct high volume
inferencing for real time sensitive transactions without invoking
off platform AI solutions, which may impact performance. Clients
can also build and train AI models off-platform, deploy and infer
on a Telum-enabled IBM system for analysis.
Innovations across banking, finance, trading,
insurance
Today, businesses typically apply detection techniques to catch
fraud after it occurs, a process that can be time consuming and
compute-intensive due to the limitations of today's technology,
particularly when fraud analysis and detection is conducted far
away from mission critical transactions and data. Due to latency
requirements, complex fraud detection often cannot be completed in
real-time – meaning a bad actor could have already successfully
purchased goods with a stolen credit card before the retailer is
aware fraud has taken place.
According to the Federal Trade Commission's 2020 Consumer
Sentinel Network Databook, consumers reported losing more than
$3.3 billion to fraud in 2020,
up from $1.8 billion in
20192. Telum can help clients to move their thinking
from a fraud detection posture to a fraud prevention
posture, evolving from catching many cases of fraud today, to a
potentially new era of prevention of fraud at scale, without
impacting service level agreements (SLAs), before the transaction
is completed.
The new chip features an innovative centralized design, which
allows clients to leverage the full power of the AI processor for
AI-specific workloads, making it ideal for financial services
workloads like fraud detection, loan processing, clearing and
settlement of trades, anti-money laundering and risk analysis. With
these new innovations, clients will be positioned to enhance
existing rules-based fraud detection or use machine learning,
accelerate credit approval processes, improve customer service and
profitability, identify which trades or transactions may fail, and
propose solutions to create a more efficient settlement
process.
Telum and IBM's Full Stack Approach to Chip Design
Telum follows IBM's long heritage of innovative design and
engineering that includes hardware and software co-creation and
integration that spans silicon, system, firmware, operating systems
and leading software frameworks.
The chip contains 8 processor cores with a deep super-scalar
out-of-order instruction pipeline, running with more than 5GHz
clock frequency, optimized for the demands of heterogenous
enterprise class workloads. The completely redesigned cache and
chip-interconnection infrastructure provides 32MB cache per core,
and can scale to 32 Telum chips. The dual-chip module design
contains 22 billion transistors and 19 miles of wire on 17 metal
layers.
Leadership in semiconductors
Telum is the first IBM chip with technology created by the IBM
Research AI Hardware Center. In addition, Samsung is IBM's
technology development partner for the Telum processor, developed
in 7nm EUV technology node.
Telum is another example of IBM's leadership in hardware
technology. IBM Research, among the world's largest industrial
research organizations, recently announced scaling to the 2 nm
node, the latest benchmark in IBM's legacy of contributions to
silicon and semiconductor innovation. In Albany, NY, home to the IBM AI Hardware Center
and Albany Nanotech Complex, IBM Research has created a leading
collaborative ecosystem with public-private industry players to
fuel advances in semiconductor research, helping to address global
manufacturing demands and accelerate the growth of the chip
industry.
For more information please visit
www.ibm.com/it-infrastructure/z/capabilities/real-time-analytics.
Statements regarding IBM's future direction and intent are
subject to change or withdrawal without notice and represent goals
and objectives only.
About IBM
IBM is a leading global hybrid cloud and AI, and business
services provider, helping clients in more than 175 countries
capitalize on insights from their data, streamline business
processes, reduce costs and gain the competitive edge in their
industries. Nearly 3,000 government and corporate entities in
critical infrastructure areas such as financial services,
telecommunications and healthcare rely on IBM's hybrid cloud
platform and Red Hat OpenShift to affect their digital
transformations quickly, efficiently, and securely. IBM's
breakthrough innovations in AI, quantum computing,
industry-specific cloud solutions and business services deliver
open and flexible options to our clients. All of this is
backed by IBM's legendary commitment to trust, transparency,
responsibility, inclusivity, and service.
For more information, visit www.ibm.com
Media Contact:
Elizabeth
Banta
IBM Systems
Elizabeth.Banta@ibm.com
732-996-4159
1 Morning Consult – Global AI Adoption Index 2021
2 United States Federal Trade Commission,
https://www.ftc.gov/news-events/press-releases/2021/02/new-data-shows-ftc-received-2-2-million-fraud-reports-consumers
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SOURCE IBM