DALLAS and SALT LAKE
CITY, Feb. 15, 2023 /PRNewswire/ -- Texas
Instruments Incorporated (TI) (Nasdaq: TXN) today announced plans
to build its next 300-millimeter semiconductor wafer fabrication
plant (or fab) in Lehi, Utah. The
new fab will be located next to the company's existing 300-mm
semiconductor wafer fab in Lehi,
LFAB. Once completed, TI's two Lehi fabs will operate as a single fab.
"This new fab is part of our long-term, 300-mm manufacturing
roadmap to build the capacity our customers will need for decades
to come," said Haviv Ilan, TI
executive vice president and chief operating officer, and incoming
president and chief executive officer. "Our decision to build a
second fab in Lehi underscores our
commitment to Utah and is a
testament to the talented team there who will lay the groundwork
for another important chapter in TI's future. With the anticipated
growth of semiconductors in electronics, particularly in industrial
and automotive, and the passage of the CHIPS and Science Act, there
is no better time to further invest in our internal manufacturing
capacity."
The landmark $11 billion
investment marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800
additional TI jobs as well as thousands of indirect jobs. TI looks
forward to strengthening its partnership with the Alpine School
District and will invest $9 million
to improve student opportunities and outcomes.
"Companies like Texas Instruments continue to invest in
Utah because of our world-class
business climate and exceptional workforce," said Utah Gov. Spencer
Cox. "TI's new semiconductor fab will solidify Utah as a global semiconductor manufacturing
hub for generations to come."
Lehi is an ideal location
because of its access to skilled talent, robust existing
infrastructure and strong network of community partners. The new
fab will manufacture tens of millions of analog and embedded
processing chips daily that will go into electronics
everywhere.
The fab will be designed to meet one of the Leadership in Energy
and Environmental Design (LEED) building rating system's highest
levels of structural efficiency and sustainability: LEED Gold.
Plans include recycling water at nearly double the rate of the
existing Lehi fab. Advanced 300-mm
equipment and processes in Lehi
will further reduce waste, water and energy consumption per
chip.
Construction of the new fab is expected to begin in the second
half of 2023, with production as early as 2026. The cost of the new
fab is comprehended in TI's previously announced capital spending
plan to expand manufacturing capacity and will complement TI's
existing 300-mm fabs, which include DMOS6 (Dallas), RFAB1 and RFAB2 (both in Richardson, Texas), and LFAB (Lehi, Utah). TI is also building four new
300-mm wafer fabs in Sherman,
Texas.
Learn more about TI in Lehi:
For b-roll video, event and site photos, and an infographic,
visit TI.com/Lehi.
To learn more about TI's exciting 300-mm manufacturing roadmap,
visit TI.com/manufacturing.
About Texas Instruments
Texas Instruments
Incorporated (Nasdaq: TXN) is a global semiconductor company
that designs, manufactures, tests and sells analog and embedded
processing chips for markets such as industrial, automotive,
personal electronics, communications equipment and enterprise
systems. Our passion to create a better world by making electronics
more affordable through semiconductors is alive today, as each
generation of innovation builds upon the last to make our
technology smaller, more efficient, more reliable and more
affordable – making it possible for semiconductors to go into
electronics everywhere. We think of this as Engineering Progress.
It's what we do and have been doing for decades. Learn more
at TI.com.
TXN-G
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SOURCE Texas Instruments