Nano Dimension and Piezoskin Developed a Customized 3D-Printed MEMS Package with Electric Pads
April 15 2020 - 6:00AM
Nano Dimension Ltd. (Nasdaq, TASE: NNDM),
a leading Printed electronics (PE) / Additively Manufactured
Electronics (AME) provider, announced today that its
technology, DragonFly LDM system and materials were used to develop
a
3D printed sealed packaging with electrical pads
for Micro-Electromechanical Systems (MEMS).
The printed electronics package has the
electrical pads directly printed on the metal layers on which an RF
connector is soldered. The ability to transfer electric pads in a
sealed package is one of the most crucial parts in ohmic-contact
microelectromechanical systems (MEMS) as it determines the device
performance and reliability, particularly for soft and
flexible devices where the electrical connectors are
typically difficult to produce.
“Nano Dimension’s AME technology helped us to
achieve an original product prototype in which wires and connectors
were eliminated such that the package was minimized to obtain an
optimal user experience. It simplifies the manufacturing
process compared to traditional manufacturing methods,”
said Dr. Francesco Guido, CTO of Piezoskin S.R.L.
“With the DragonFly LDM 3D printer, Piezoskin
can design customized printed packages with flexible transducers,
to meet their customers unique needs, drive innovation and get
products to market faster,” said Mr. Yoav Stern, Nano Dimension’s
CEO and President.
About Nano Dimension
Nano Dimension (Nasdaq, TASE: NNDM) is a
provider of intelligent machines for the fabrication of
Additively Manufactured Electronics (AME). High fidelity active
electronic and electromechanical subassemblies are integral
enablers of autonomous intelligent drones, cars,
satellites, smartphones, and in vivo medical devices. They
necessitate iterative development, IP safety, fast time-to-market
and device performance gains, thereby mandating AME for in-house,
rapid prototyping and production. Nano Dimension machines
serve cross-industry needs by depositing proprietary consumable
conductive and dielectric materials simultaneously, while
concurrently integrating in-situ capacitors, antennas, coils,
transformers and electromechanical components, to function at
unprecedented performance. Nano Dimension bridges the gap between
PCB and semiconductor integrated circuits. A revolution at the
click of a button: From CAD to a functional high-performance AME
device in hours, solely at the cost of the consumable
materials. For more information, please
visit www.nano-di.com.
Forward-Looking Statements
This press release contains forward-looking
statements within the meaning of the “safe harbor” provisions of
the Private Securities Litigation Reform Act of 1995 and other
Federal securities laws. Words such as “expects,” “anticipates,”
“intends,” “plans,” “believes,” “seeks,” “estimates” and similar
expressions or variations of such words are intended to identify
forward-looking statements. For example, Nano Dimension is using
forward-looking statements in this press release when it discusses
the potential and use of its products. Because such statements deal
with future events and are based on Nano Dimension's current
expectations, they are subject to various risks and uncertainties.
Actual results, performance or achievements of Nano Dimension could
differ materially from those described in or implied by the
statements in this press release. The forward-looking statements
contained or implied in this press release are subject to other
risks and uncertainties, including those discussed under the
heading “Risk Factors” in Nano Dimension’s annual report on Form
20-F filed with the Securities and Exchange Commission (“SEC”) on
March 10, 2020, and in any subsequent filings with the SEC. Except
as otherwise required by law, Nano Dimension undertakes no
obligation to publicly release any revisions to these
forward-looking statements to reflect events or circumstances after
the date hereof or to reflect the occurrence of unanticipated
events. References and links to websites have been provided as a
convenience, and the information contained on such websites is not
incorporated by reference into this press release. Nano Dimension
is not responsible for the contents of third-party
websites.
NANO DIMENSION INVESTOR RELATIONS CONTACT Yael
Sandler, CFO | ir@nano-di.com
- 3D printed sealed packaging with electrical pads for MEMS
- 3D printed sealed packaging with electrical pads for MEMS
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