MILPITAS, Calif., Feb. 24, 2020 /PRNewswire/ -- Today KLA
Corporation (NASDAQ: KLAC) announced the Archer™ 750
imaging-based overlay metrology system and the SpectraShape™
11k optical critical dimension ("CD")
metrology system for integrated circuit ("IC" or "chip")
manufacturing. As each layer in a chip is constructed, the Archer
750 helps verify that pattern features are correctly aligned to
features on previous layers, while the SpectraShape 11k monitors the shapes of three-dimensional
structures, such as transistors and memory cells, to ensure they
remain in spec. By identifying subtle variations in pattern
alignment or feature shape, these new metrology systems help IC
manufacturers maintain strict control of the complex processes
required to bring high-performance memory and logic chips to
market, for applications such as 5G, AI, data centers, and edge
computing.
"IC manufacturers are facing process tolerances measured on the
atomic scale as they integrate novel structures and new materials
into leading-edge chips," said Jon
Madsen, senior vice president and general manager of the
Metrology division at KLA. "KLA plays a key part in ensuring that
these chips can be manufactured cost-effectively with high quality
standards. Today I'm proud to announce two additions to our
portfolio of metrology solutions, representing the hard work and
creative thinking of a top-notch, multi-disciplinary team of
engineers and scientists. The new SpectraShape 11k and Archer 750 systems bring much-needed
process control capabilities to our fab customers, helping them to
produce the innovative electronics that move our world
forward."
The Archer 750 overlay metrology system generates
accurate and robust measurements of overlay error in the presence
of process variation, while achieving productivity levels
previously seen only with scatterometry-based overlay systems. This
breakthrough system delivers accurate, fast feedback across a range
of layers, helping lithographers identify process excursions inline
and improve overall patterning integrity, for faster yield ramp and
more stable production of advanced logic, DRAM and 3D NAND devices.
The SpectraShape 11k CD and
dimensional shape metrology system provides an unprecedented
combination of sensitivity and productivity, and accommodates
materials, structures and wafer shapes that were previously
inaccessible. With its ability to measure advanced logic, DRAM and
3D NAND device features with high precision and speed, the
SpectraShape 11k enables quick
identification of process issues and rigorous process monitoring
during production.
More information about the new metrology systems and the
technology advances that enable their enhanced performance can be
found on the portfolio information page.
Numerous Archer 750 and SpectraShape 11k systems have been
qualified and are in operation at leading IC manufacturers
worldwide, where they provide critical feedback for many of the
process steps used to produce innovative electronic devices. The
Archer 750 and SpectraShape 11k are
integrated with KLA's 5D Analyzer® advanced data analysis
system, which supports real-time process control, and engineering
monitoring and analysis. To maintain the high performance and
productivity demanded by chip manufacturers, the Archer 750 and
SpectraShape 11k metrology systems
are backed by KLA's global comprehensive service network.
About KLA:
KLA develops industry-leading equipment and
services that enable innovation throughout the electronics
industry. We provide advanced process control and process-enabling
solutions for manufacturing wafers and reticles, integrated
circuits, packaging, printed circuit boards and flat panel
displays. In close collaboration with leading customers across the
globe, our expert teams of physicists, engineers, data scientists
and problem-solvers design solutions that move the world forward.
Additional information may be found at www.kla.com (KLAC-P).
Forward Looking Statements:
Statements in this press
release other than historical facts, such as statements regarding
the expected performance of the Archer 750 and SpectraShape
11k systems and the economic effects
of metrology measurements for wafer, equipment, materials and chip
manufacturing facilities, are forward-looking statements, and are
subject to the Safe Harbor provisions created by the Private
Securities Litigation Reform Act of 1995. These forward-looking
statements are based on current information and expectations and
involve risks and uncertainties. Actual results may differ
materially from those projected in such statements due to various
factors, including delays in the adoption of new technologies
(whether due to cost or performance issues or otherwise), the
introduction of competing products by other companies or
unanticipated technology challenges or limitations that affect the
implementation, performance or use of KLA's products.
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SOURCE KLA Corporation